EP0656128A1 - Procede de production d'un materiau sur lequel une image est produite par rayonnement electromagnetique - Google Patents

Procede de production d'un materiau sur lequel une image est produite par rayonnement electromagnetique

Info

Publication number
EP0656128A1
EP0656128A1 EP92911985A EP92911985A EP0656128A1 EP 0656128 A1 EP0656128 A1 EP 0656128A1 EP 92911985 A EP92911985 A EP 92911985A EP 92911985 A EP92911985 A EP 92911985A EP 0656128 A1 EP0656128 A1 EP 0656128A1
Authority
EP
European Patent Office
Prior art keywords
radiation
image
imaged
process according
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92911985A
Other languages
German (de)
English (en)
Other versions
EP0656128A4 (fr
Inventor
James G. Birkholm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB9108466A external-priority patent/GB2248506B/en
Application filed by Individual filed Critical Individual
Publication of EP0656128A4 publication Critical patent/EP0656128A4/fr
Publication of EP0656128A1 publication Critical patent/EP0656128A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

Definitions

  • This invention relates to a process for preparing electromagnetic radiation imaged material and to an article of manufacture comprising an adherent sheet-like photoresist laminate which can be transferred to a surface to introduce a pattern into the surface using a particulate etchant such as a sandblast.
  • the invention relates to a photoresist laminate which can be adherently applied to the surface of an object or material, for the purpose of revealing or exposing in the surface of the object or material, a pattern.
  • the resist laminate contains a layer of photoresist composition which when exposed to light a specific desired pattern can be developed when the resist is applied to the surface of the object or material, the pattern can be selectively revealed by the action of an etchant.
  • Such patterns can be decorative, informative, can be for the purpose of providing nonskid surface properties, can be useful in forming copper printed wiring board pat ⁇ terns, and can be useful in many other application where a specific pattern is desired.
  • Grit blasting has been effected in the past by employing a pattern mask prepared manually from rubber, paper, or various plastics and attaching the pattern mask to the article to be etched employing an adhesive. This method is time consuming and cannot be used to etch fine image details on a repetitive basis.
  • the surface of the article can also be etched by silk screen printing an image in relief onto a very fine sticky backing paper.
  • This method requires a very strong ink image.
  • the sticky backing paper is dampened and adhered to the surface.
  • the ink image is then grit blasted.
  • the grit material must, however, penetrate through the paper and its adhesive before affecting the surface. During this time, the ink image must withstand the grit blasting.
  • the resultant image is more of a frost than an etch, and is best suited for producing large numbers of etched items since the method is too costly for etching small numbers of items.
  • Die cut vinyl stencils are also produced as an etchant mask, and the time, effort and cost factors make the use of such stencils undesirable.
  • Liquid photoresists are also commercially available which are painted or sprayed onto the surface of the object to be etched, and then exposed when dry to achieve a desired image. While the process does work, there are serious problems when working with any but a planer surface, and presents problems on water sensitive surfaces. The process is time consuming, expensive, and must be cleaned using special expensive removers.
  • a photoresist which can be produced quickly and inexpen ⁇ sively while providing extremely fine detail which transfers intact and adheres so fine detail is not blown off during the blasting is in demand.
  • Fig. 1 is a view of a generally rectangle portion diagram of a preferred resist laminate which is made of a substrate which has been coated with a photosensitive resist.
  • Fig. 2 is an enlarged side view diagram of a method of forming an unrevealed pattern in the surface of the photosensitive resist by exposure to a film image and a electromagnetic radiation source.
  • Fig. 3 is an enlarged side view diagram of a method of forming an integral membrane in the previously imaged photo resist sheet, Fig. 2.
  • Fig. 4 is an enlarged side view diagram of the wash out device, and water or chemical solvent spray, reveal ⁇ ing the imaged pattern, leaving the integral membrane intact on the substrate.
  • Fig. 5 is an enlarged side view diagram of the imaged photoresist, applied to the object to be etched, by means of an adhesive coating. The integral membrane holds all pattern pieces in place while the substrate is stripped away.
  • Fig. 6 is an enlarged side view diagram of the applied photoresist, on the object to be etched, being blasted with abrasive, propelled from an abrasion etching device, producing an etched pattern in the object.
  • Fig. 7 is an enlarged side diagram of a method of forming an integral membrane in photosensitive laminates for later use.
  • photo sensitive resist 33 revealed image 22 substrate 34 adhesive layer 24 electromagnetic source 36 surface to be etched
  • the resist laminate of the invention generally is made of a resist layer, a substrate layer, and an adhesive layer.
  • the resist layer of the laminate generally comprises compositions that are photosensitive.
  • the photosensitive compositions typically interact with light to transform the composition from a soluble state into an insoluble film.
  • resist compositions typically contain reactive mono/or polymeric substances along with photo activated initiators. Such polymer suspensions are well known in the art and are available from a number of suppliers.
  • One of the preferred resists is sold by The Chromaline Corporation under the name SBX.
  • the support layer of this invention commonly comprises a web, film, or other such substrate which can be coated with the resist composition of the invention.
  • the substrate may be mechanically strong to permit rapid manufacture of the resist laminate and may be flexible to allow for the easy removal after transfer of the resist mask to the object to be etched.
  • Such substrate materials are readily available from a number of suppliers.
  • the preferred substrate of this invention is a transpar ⁇ ent or translucent sheet-like material which is less than 4 mil mylar polyester, produced by DuPont.
  • the photoresist laminate of the invention comprises an adhesive layer that is used to adherently apply the laminate to the object for etching.
  • the adhesive layer can be water activated, pressure sensitive, heat ac ⁇ tivated, or other adhesive form.
  • the adhesive layer is preferably a pressure sensitive adhesive which is typically an adhesive composition having a high degree of tack and cohesive strength. Such adhesives may be applied by a large variety of means; spray, brush, roll coating, or in the photoresist polymer suspension.
  • Pressure sensitive adhesives tend to bond almost instan ⁇ taneously to a surface with slight contact pressure at the interface between the adhesive and the contacted surface.
  • pressure sensitive adhesives commonly are used in conjunction with a pressure sen- sitive release liner comprising a backing material such as paper, textile, plastic film, or metal foil which has a generally silicone release coating to ensure that a release liner can be removed from the pressure sensitive adhesive without reducing the adhesive properties of the adhesive mass and without any removal of the pressure sensitive adhesive.
  • the removable release liner makes it practical to store imaged sheets with the adhesive applied for later use, or for shipment.
  • the preferred pressure sensitive adhesives are well known to the art, and are commonly available through a variety of sources including 3-M.
  • the photoresist laminate articles of manufacture of the invention are typically used by adhering the exposed, re- exposed, washed out laminate to the object to be etched.
  • the substrate is stripped off and the resist is exposed to the action of a particulate etchant.
  • Fig. 1 is a diagram of a generally rectangle portion of a preferred resist laminate which is made of a substrate 22 which has been coated with a photosensitive resist 20.
  • the coating may be produced by various well known coating methods, and can be applied in a variety of thicknesses directly related to the intended use of the resist.
  • the preferred thickness of the photosensitive resist 20 is between 3 mil and 5 mil.
  • Fig. 2 is an enlarged side view diagram of a method of forming an unrevealed image 26 in the surface of the photosensitive resist 20, by exposure to a image transfer means 27 and a electromagnetic radiation source 24.
  • This known art generally requires sufficient electromagnetic radiation 24 to be applied to photosensitive resist 20 to cause the crosslinking or polymerization of the resist into an insoluble state.
  • the image transfer means 27 repels the electromagnetic radiation 24 and the un- revealed image 26 remains soluble.
  • Fig. 3 is an enlarged side view diagram of a method of forming an integral membrane 28 in the previously imaged photosensitive resist sheet Fig. 2.
  • the previously imaged photosensitive resist sheet is re-introduced, or exposed a second time to the electromagnetic radiation 24.
  • the image transfer means 27 is not present.
  • the preferred method exposes the laminate with the photosen ⁇ sitive resist 20 in the reverse of Fig. 2, with the substrate 22 in the direct path of the electromagnetic radiation 24.
  • the areas of unrevealed image 26 are now briefly exposed for a specific time period, using a timing device 25, through the substrate 22, forming a integral membrane 28.
  • the specific time to produce the membrane varies in direct relation to the time of electromagnetic radiation from a specific source, a.s is well known.
  • Fig. 4 is an enlarged side view diagram of the wash out device 30, and water or chemical solvent spray 32, revealing the revealed image 33 and the integral membrane 28 left intact on the substrate 22.
  • the integral membrane 28 spans all the revealed image areas 33 and has held them in place during the wash out process.
  • the stabilizing effect of the integral membrane greatly improves the resolution capability of the photosensitive resist since all fine detail is held in place, and is not eroded at the roots.
  • Fig. 5 is an enlarged side view diagram of the imaged photoresist 20, applied to the object to be etched 36, by the means of an adhesive coating 34.
  • the integral membrane 28 now holds all pattern pieces in place without loss or distortion while substrate 22 is stripped away manually.
  • the transfer method allows previously dif ⁇ ficult surfaces including compound and inward curves to be successfully masked, as well as application to other surfaces which are sensitive to the presence of water.
  • Fig. 6 is an enlarged side view diagram of the applied photoresist 20, applied to the object to be etched 36, by means of an adhesive coating 34.
  • the integral membrane 28 holds the various small parts in place while exposed to the abrasive 42.
  • the membrane rapidly erodes when exposed to the action of the abrasive, and after suf ⁇ ficient exposure to the etchant, the etched image 46 is developed in the object surface.
  • the holding in place of the small pieces by the membrane allows deeper etching of the image since the small pieces do not blow off.
  • Fig. 7 is an enlarged side view diagram of the photores ⁇ ist 20 on substrate 22 exposed to electromagnetic radiation 24.
  • SUBSTITUTESHEET a later time is to expose the laminate briefly for a specific time to produce a membrane 28' by means of a timing device 25 and deposit the exposed laminate in exposure proof means for later re-exposure, Fig. 2, washout Fig. 4, application with adhesive coating Fig. 5, stripping of substrate Fig. 5, and etching Fig. 6.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Procédé de fabrication permettant d'obtenir une membrane (28) modulable à l'intérieur d'une couche d'un matériau photosensible (20) stratifié sur un support (22), le procédé consistant à: exposer la couche de matériau photosensible (20) à un rayonnement de lumière en présence d'un élément de transfert d'image afin d'y produire une image (26) non révélée, et à exposer à nouveau l'image non révélée (26) à un rayonnement de lumière (24) du côté opposé à la couche de matériau photosensible par rapport au support (22), en l'absence d'un élément de transfert d'image et pour un laps de temps suffisant pour former la membrane solidaire (28) dans l'image non révélée (26).
EP92911985A 1991-04-19 1992-04-07 Procede de production d'un materiau sur lequel une image est produite par rayonnement electromagnetique Withdrawn EP0656128A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9108466A GB2248506B (en) 1990-04-19 1991-04-19 Process for preparing electromagnetic radiation imaged material
GB9108466 1991-04-19
PCT/US1992/002939 WO1992021065A1 (fr) 1991-04-19 1992-04-07 Procede de production d'un materiau sur lequel une image est produite par rayonnement electromagnetique

Publications (2)

Publication Number Publication Date
EP0656128A4 EP0656128A4 (fr) 1994-08-05
EP0656128A1 true EP0656128A1 (fr) 1995-06-07

Family

ID=10693625

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92911985A Withdrawn EP0656128A1 (fr) 1991-04-19 1992-04-07 Procede de production d'un materiau sur lequel une image est produite par rayonnement electromagnetique

Country Status (4)

Country Link
EP (1) EP0656128A1 (fr)
AU (1) AU2014592A (fr)
CA (1) CA2108674A1 (fr)
WO (1) WO1992021065A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013119600A1 (fr) * 2012-02-08 2013-08-15 Rayzist Photomask, Inc. Planche à roulettes à surface antidérapante gravée

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1772662B1 (de) * 1968-06-15 1971-10-14 Asahi Chemical Ind Verfahren zur photographischen Herstellung einer Reliefplatte,die ein photopolymerisates raeumliches Bild traegt
US4360267A (en) * 1980-03-24 1982-11-23 Schwaab, Inc. Method and apparatus for producing printing patterns
US4587186A (en) * 1982-05-13 1986-05-06 Asahi Kasei Kogyo Kabushiki Kaisha Mask element for selective sandblasting and a method
JPS58196971A (ja) * 1982-05-13 1983-11-16 Asahi Chem Ind Co Ltd サンドブラスト用マスクの製造方法
US4716096A (en) * 1983-01-18 1987-12-29 Container Graphics Corporation Method and apparatus for producing characters on a grit-erodible body
US4764449A (en) * 1985-11-01 1988-08-16 The Chromaline Corporation Adherent sandblast photoresist laminate
US4801490A (en) * 1986-05-07 1989-01-31 Schuette James R Method and apparatus for sand blasting a design on glass
US4858394A (en) * 1987-03-18 1989-08-22 Dynamat, Inc. Free standing photoresist mask and the method of using the same for abrasive engraving
US4834833A (en) * 1987-12-02 1989-05-30 Palmer Alan K Mask for etching, and method of making mask and using same

Also Published As

Publication number Publication date
AU2014592A (en) 1992-12-30
WO1992021065A1 (fr) 1992-11-26
CA2108674A1 (fr) 1992-10-20
EP0656128A4 (fr) 1994-08-05

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