EP0701281A3 - Substrat mit bondfähiger Beschichtung - Google Patents

Substrat mit bondfähiger Beschichtung Download PDF

Info

Publication number
EP0701281A3
EP0701281A3 EP19950107941 EP95107941A EP0701281A3 EP 0701281 A3 EP0701281 A3 EP 0701281A3 EP 19950107941 EP19950107941 EP 19950107941 EP 95107941 A EP95107941 A EP 95107941A EP 0701281 A3 EP0701281 A3 EP 0701281A3
Authority
EP
European Patent Office
Prior art keywords
weldable
substrate
weldable substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19950107941
Other languages
English (en)
French (fr)
Other versions
EP0701281A2 (de
Inventor
Guenter Dr Herklotz
Thomas Frey
Otto Camus
Karl-Heinz Dr Ullrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of EP0701281A2 publication Critical patent/EP0701281A2/de
Publication of EP0701281A3 publication Critical patent/EP0701281A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
EP19950107941 1994-09-07 1995-05-24 Substrat mit bondfähiger Beschichtung Withdrawn EP0701281A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4431847A DE4431847C5 (de) 1994-09-07 1994-09-07 Substrat mit bondfähiger Beschichtung
DE4431847 1994-09-07

Publications (2)

Publication Number Publication Date
EP0701281A2 EP0701281A2 (de) 1996-03-13
EP0701281A3 true EP0701281A3 (de) 1996-09-11

Family

ID=6527625

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19950107941 Withdrawn EP0701281A3 (de) 1994-09-07 1995-05-24 Substrat mit bondfähiger Beschichtung

Country Status (2)

Country Link
EP (1) EP0701281A3 (de)
DE (1) DE4431847C5 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19827521C1 (de) * 1998-06-22 1999-07-29 Heraeus Gmbh W C Verfahren zur Herstellung einer gebondeten, aluminiumhaltiges Material enthaltenden Vorrichtung
TW457674B (en) * 1999-03-15 2001-10-01 Texas Instruments Inc Aluminum leadframes for semiconductor devices and method of fabrication
US6747343B2 (en) 2000-03-08 2004-06-08 Texas Instruments Incorporated Aluminum leadframes with two nickel layers
US6534192B1 (en) * 1999-09-24 2003-03-18 Lucent Technologies Inc. Multi-purpose finish for printed wiring boards and method of manufacture of such boards
DE10103294C1 (de) * 2001-01-25 2002-10-31 Siemens Ag Träger mit einer Metallfläche und mindestens ein darauf angeordneter Chip, insbesondere Leistungshalbleiter
US6911230B2 (en) * 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
SG117440A1 (en) * 2002-11-23 2005-12-29 Shipley Co Llc Plating method
DE102004030800B4 (de) 2004-06-25 2017-05-18 Epcos Ag Verfahren zur Herstellung einer keramischen Leiterplatte
ATE503037T1 (de) * 2008-10-17 2011-04-15 Atotech Deutschland Gmbh Spannungsreduzierte ni-p/pd-stapel für waferoberfläche
DE102017202425A1 (de) * 2017-02-15 2018-08-16 Robert Bosch Gmbh Membrantropf für einen Ultraschallwandler, Verfahren zum Herstellen eines Membrantopfs und Ultraschallwandler
ES2882690T3 (es) 2018-11-06 2021-12-02 Atotech Deutschland Gmbh Disolución de chapado con níquel no electrolítico
CN115298023B (zh) 2020-03-18 2025-05-27 思力柯集团 纳米结构的基于钯的合金和相关方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038823A (ja) * 1983-08-11 1985-02-28 Nec Corp 半導体装置
WO1987005057A1 (en) * 1986-02-17 1987-08-27 Plessey Overseas Limited Electrical contact surface coating
EP0410472A2 (de) * 1989-07-27 1991-01-30 Yazaki Corporation Elektrischer Kontakt
EP0468787A2 (de) * 1990-07-27 1992-01-29 Shinko Electric Industries Co. Ltd. Automatische Bandmontage in der Halbleitertechnik
DE4243570C1 (de) * 1992-12-22 1994-01-27 Heraeus Gmbh W C Elektrischer Kontaktkörper
EP0637082A1 (de) * 1993-07-29 1995-02-01 AT&T Corp. Integrierte Schaltungsanordnungen mit lötbarem Leiterrahmen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156556A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Electrode structure
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
JPS5553814A (en) * 1978-10-16 1980-04-19 Hitachi Ltd Method of forming gold electrode
JPS6034257B2 (ja) * 1980-05-26 1985-08-07 京セラ株式会社 金の導電層を有する電子部品
WO1982002908A1 (en) * 1981-02-27 1982-09-02 Western Electric Co Palladium and palladium alloys electroplating procedure
JPS59168659A (ja) * 1983-03-15 1984-09-22 Furukawa Electric Co Ltd:The 集積回路用リ−ドフレ−ム
JPS607161A (ja) * 1984-03-12 1985-01-14 Masami Kobayashi ニツケル・鉄合金のｉｃ用リ−ドフレ−ムに半田性およびボンデイング性を付与する方法
DE68923024T2 (de) * 1988-03-28 1995-11-02 Texas Instruments Inc Leiterrahmen mit verminderter Korrosion.
JPH03191086A (ja) * 1989-12-19 1991-08-21 Nippon Mining Co Ltd 耐摩耗性に優れた金めっき材
DD299382A7 (de) * 1990-06-28 1992-04-16 Ingenieur- Und Consulting Leipzig Gmbh,De Chemisch-reduktive gold-elektrolyt-kombination und verfahren zur goldabscheidung unter verwendung dieser kombination
DE4123911C1 (de) * 1991-07-18 1993-01-14 Doduco Gmbh + Co Dr. Eugen Duerrwaechter, 7530 Pforzheim, De
US5206055A (en) * 1991-09-03 1993-04-27 General Electric Company Method for enhancing the uniform electroless deposition of gold onto a palladium substrate
JP3191170B2 (ja) * 1992-03-04 2001-07-23 生化学工業株式会社 新規エンドグリコセラミダーゼ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038823A (ja) * 1983-08-11 1985-02-28 Nec Corp 半導体装置
WO1987005057A1 (en) * 1986-02-17 1987-08-27 Plessey Overseas Limited Electrical contact surface coating
EP0410472A2 (de) * 1989-07-27 1991-01-30 Yazaki Corporation Elektrischer Kontakt
EP0468787A2 (de) * 1990-07-27 1992-01-29 Shinko Electric Industries Co. Ltd. Automatische Bandmontage in der Halbleitertechnik
DE4243570C1 (de) * 1992-12-22 1994-01-27 Heraeus Gmbh W C Elektrischer Kontaktkörper
EP0637082A1 (de) * 1993-07-29 1995-02-01 AT&T Corp. Integrierte Schaltungsanordnungen mit lötbarem Leiterrahmen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 159 (E - 326) 4 July 1985 (1985-07-04) *

Also Published As

Publication number Publication date
EP0701281A2 (de) 1996-03-13
DE4431847C2 (de) 2002-08-08
DE4431847A1 (de) 1996-03-14
DE4431847C5 (de) 2011-01-27

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Owner name: W.C. HERAEUS GMBH & CO. KG

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Withdrawal date: 20010517