EP0782500A1 - Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiau - Google Patents
Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiauInfo
- Publication number
- EP0782500A1 EP0782500A1 EP95932765A EP95932765A EP0782500A1 EP 0782500 A1 EP0782500 A1 EP 0782500A1 EP 95932765 A EP95932765 A EP 95932765A EP 95932765 A EP95932765 A EP 95932765A EP 0782500 A1 EP0782500 A1 EP 0782500A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- prepreg
- laminate
- layers
- layer
- foiled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 58
- 239000011159 matrix material Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000011888 foil Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 8
- 230000009969 flowable effect Effects 0.000 claims description 6
- 239000002759 woven fabric Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 71
- 239000011521 glass Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 208000004209 confusion Diseases 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 206010013395 disorientation Diseases 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004634 thermosetting polymer Substances 0.000 description 3
- 239000004760 aramid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
- B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
- B29C70/088—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
- B29K2105/108—Oriented arranged in parallel planes and crossing at substantial angles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
- B29K2105/243—Partially cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/253—Preform
- B29K2105/256—Sheets, plates, blanks or films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
- B32B2262/0284—Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
Definitions
- the present invention pertains to a basic material for making a PWB laminate comprising at least one layer of parallel, unidirectionally oriented (UD) reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., a UD prepreg layer.
- the invention also pertains to laminates for use in printed wire boards (PWBs) prepared from such a UD prepreg layer.
- a UD prepreg material for making PWBs is known from US 4,814,945.
- This disclosure relates to a PWB laminate comprising a matrix resin reinforced with parallel aramid fibres.
- the laminate is built up from layers of unidirectional aramid tape stacked one on top of the other in crosswise fashion.
- the aramid tape is formed by arranging a single layer of parallel aramid fibres to form fibre strips, coating the fibre strips with resin, and heating them to a semi-cured or "B"-stage.
- a problem easily incurred when making UD crossply laminates is disorientation of the UD layers. Retaining proper orientation is necessary for obtaining a laminate having sufficient flatness, which is a property of particular importance to a PWB laminate. Particularly if a still flowable matrix resin is used, e.g., B-stage material, there is a substantial risk of disorientation occurring since, on account of the flow which occurs during lamination, the tension, and hence the orientation of the UD layers, cannot be adequately controlled.
- a still flowable matrix resin e.g., B-stage material
- UD-reinforced crossply composite laminates on the basis of prepreg.
- prepreg usually woven glass-fabric prepreg
- resin systems and lamination technology of proven viability in this field.
- the customary prepregs are less prone to disorientation problems.
- UD-crossply laminates are pre-eminently suitable as PWB substrate. Of course, this holds only if these laminates can be manufactured by means of a method that enables retaining proper orientation.
- a problem associated with the orientation of UD fibres is addressed in DE 3542295. It pertains to photographic shutter materials on the basis of a substrate layer of oriented fibres contained in a matrix resin. It is disclosed that by applying a layer of a heat-shrinkable synthetic foil onto the substrate layer, positional deviations of the parallel fibres during shaping under pressure may be suppressed. The use of a heat-shrinkable foil will cause the UD prepreg to slightly bend in the fibre direction. While this may be desirable in the case of a shutter material, in a PWB laminate it should be avoided entirely.
- JP-Hei-4-329,132 teaches a hybrid prepreg article for use therein.
- the hybrid prepreg comprises two different kinds of parallel fibres, essentially thick ones having a diameter of from 30 to 500 ⁇ m and thin ones of 5 to 30 ⁇ m, and a metal layer of 5-100 ⁇ m thickness.
- any reinforcing fibres be filaments having a diameter below 30 ⁇ m, and preferably of from 3 to 15 ⁇ m, since thicker fibres are prohibitive for suitable drilling of holes and for obtaining a desirable surface flatness. It is particularly with thin prepregs, having thin reinforcing fibers, that handling problems occur.
- JP-Hei-6-008,240 teaches structural composites, the outermost layer of which has been covered with a metal or metal-compound film. While the core of the composite can be reinforced with parallel, unidirectional yarns, the outer layers are reinforced with glass cloth.
- the disclosure is directed to shaped, round articles such as golf club shafts or antennas.
- Japanese Patent Application Laid-Open No. 201699/1985 discloses a heat-bondable electric shielding material which comprises a metal foil, a heat-bondable resin layer formed thereon, and a multiplicity of parallel reinforcing wires fixed to the resin layer.
- the conductive wires which have a diameter of from 0.03 to 0.5 mm, are spaced apart 10 to 15 cm. It is disclosed that if the metal foil is to be prevented from wrinkling, the shielding material should be wound up together with a cushioning material, e.g. a polyurethane foam sheet.
- EP 0372 505 It essentially discloses a fibre-reinforced thermoplastic laminate.
- the fibre reinforcement can be in any form.
- the thermoplastic laminate is provided with a metal foil when in the molten state. It generally is a high temperature thermoplastic, which is solid at room temperature.
- the disclosed laminate is not the type of basic material for making PWBs that the invention is aiming at, as it serves as a PWB laminate itself.
- the laminate manufactured according to EP 372 505 is a laminate having the final properties of a PWB substrate.
- the invention essentially aims at UD prepregs which can be used to make PWBs, but are not suitable as PWB laminates in themselves.
- the invention now seeks to provide a UD prepreg layer that allows further handling and processing without incurring problems such as indicated above, and is of a type essentially suitable for making a PWB laminate. Furthermore, the invention seeks to provide a UD prepreg layer in which it is possible to employ a thermally curable resin as the not yet fully consolidated resin without suffering from the additional problems associated therewith. To this end the invention provides a basic material for making a PWB laminate comprising a UD prepreg layer of the type indicated above, wherein the reinforcing fibres have a diameter of below 30 ⁇ m, and a layer of a conductive metal foil, such as copper foil, the layer of conductive metal foil being bonded to the UD prepreg layer.
- the layer of conductive metal foil makes for a UD prepreg material having sufficient strength perpendicular to the fibres direction to prevent tearing during handling. If the foil is laminated onto the UD prepreg prior to its being cut to size, the problem of handling a thin copper foil is solved too.
- the invention pertains to a basic material for making a PWB laminate.
- This basic material comprises a layered structure, the two consecutive layers bonded to each other being a layer of a metal foil, such as copper foil, and a layer of parallel, unidirectionally oriented fibres impregnated with not yet fully consolidated matrix resin.
- prepreg is well-known in the art and generally indicates a reinforcing material impregnated with resin and (semi)cured. It usually is still in a tacky stage.
- not yet fully consolidated matrix material indicates that the resin can be further cured still. In the case of a thermoset resin, it generally refers to the matrix resin being in the B stage.
- the several matrix material (matrix resin) stages are customarily identified in the art as the “A”, "B”, and “C” stages, the A stage indicating unsolidified resin (i.e., in the case of a thermoset resin: the uncured stage), the B stage generally indicating partial solidification (in the case of a thermoset resin: the reaction has proceeded through the formation of longer chains, but not to full network formation), and the C stage indicating a solidified (cured) stage.
- the terms A stage, B stage and C stage are known to the person of ordinary skill in the art and require no further elucidation here.
- the foiled prepreg of the invention can be laminated with other prepreg layers or with layers of a consolidated material.
- other layers comprise a woven fabric reinforcement, but if the advantages of UD reinforcement are to be enjoyed in full, the other layers should have UD parallel fibres as well, i.e., should be UD prepreg layers or consolidated (non-flowing) UD composite layers such as disclosed in WO 92/22191.
- Woven glass fibres are impregnated with a solution of epoxy resin in MEK.
- the resulting prepreg is cut to length and stacked between two copper foils.
- This package is cured under pressure at elevated temperature in a multidaylight press.
- the laminate coated with copper on both sides manufactured in this manner is then formed into a printed wire board by etching.
- PWB laminates on the basis of the UD prepreg according to the invention can be manufactured in essentially analogous manner.
- the preparation of the UD prepreg basic material deviates from the process of impregnating and curing a woven fabric.
- the UD prepreg can be conveniently prepared by coating a copper foil with matrix resin to form a foiled resin layer, heating the foiled resin layer so as to ensure that the resin is sufficiently flowable for impregnation of filaments to occur, and applying parallel filaments onto the resin to form a foiled UD-reinforced resin layer.
- the impregnation can also be carried through inversely, viz.
- the foiled UD-reinforced resin layer is either further heated or subjected to actinic radiation to effect partial curing of the resin (e.g., to the B-stage) or cooled down in order for the resin to solidify (e.g., with a thermoplastic resin that is solid at room temperature).
- the resulting foiled UD prepreg is easier to handle than both the bare copper foil and the corresponding non-foiled UD prepreg.
- the foiled prepreg is cut to length and ready to be stacked and laminated with other, non- foiled, UD layers.
- the non-foiled UD layers will form the inner laminae and be sandwiched between two foiled UD prepregs (with the Cu-foil layers on the outer surfaces).
- the invention also pertains to a method of making a PWB laminate wherein several layers comprising parallel, unidirectionally oriented reinforcing fibres contained in a resin matrix are stacked and pressed.
- the layers forming the outer surfaces of the laminate are formed of a foiled UD-prepreg comprising a layer of a conductive metal foil bonded to a UD-prepreg layer, the conductive metal foil being on the outside of the laminate.
- the layers forming the inner laminae of the PWB laminate are prepreg layers comprising parallel, unidirectionally oriented reinforcing fibres impregnated with not yet fully consolidated matrix resin, i.e., non-foiled UD prepreg.
- the layers forming the inner laminae of the laminate are formed of non-flowing UD-composite layers or non-flowing UD crossply laminates.
- non-flowing UD composite is used to indicate a composite material comprising unidirectionally oriented reinforcing fibres enclosed in a matrix material which has been solidified (consolidated) to the extent that it is not brought to flow again during the 96/09158 PCI7EP95/03652
- the non-flowing UD composite is under such conditions of pressure and temperature as to be in a state below its softening point (i.e., below Tg or apparent Tg), or solidified to a stage in which flow no longer can occur.
- Tg softening point
- solidification of the non- flowing UD composite it is preferred for the solidification of the non- flowing UD composite to have reached the C stage, or for such resins to be used as those comprising rigid molecular chains in which, under regular storage and processing conditions, a non-flowing state may already be attained at a stage still called the B stage.
- a stage material can be employed.
- these laminae can be prepared in accordance with WO 92/22191. It is also possible to stack and laminate foiled UD prepreg in accordance with the invention using intermediate substrates such as disclosed in WO 92/22192, which may be coated with adhesive or not.
- UD crossply laminates preferably are balanced and symmetric.
- the term "balanced” indicates equal properties in perpendicular directions (e.g., an equal number of filaments in the x and y directions)
- the term "symmetric” indicates mirror image symmetry over the thickness of the laminate, i.e., the laminate is mid-plane symmetric.
- the plane of symmetry which runs through the centre of the laminate and is parallel to the laminate's outer surfaces, is either the boundary between two UD layers or an imaginary plane running through one UD layer, depending on the number and order of UD layers over the thickness of the laminate.
- a major advantage of such a balanced and mid-plane symmetric laminate provided with crosswise applied UD-reinforced layers consists in the isomorphism of its properties in the x and y directions (i.e., the two fibre directions perpendicular to each other). More particular preference is given to the laminate being so composed that the UD-reinforced layers are oriented as specified in one of the following models, with 0° and 90° standing for orthogonal orientational directions and the relative thickness of the layers being indicated by repeating the given orientation where necessary: 0°/90°90°/0°
- the UD-reinforced layers in the laminate according to the invention will each have a thickness in the range of 6 to 800 ⁇ m, preferably of about 12.5 to 400 ⁇ m.
- the outer layers of the crossply laminate will be formed by a foiled UD prepreg in accordance with the present invention, i.e., a layered structure having a layer of metal foil (say; Cu) and a UD layer (say; 0°) .
- the inner UD layers have a double thickness as compared with the outer UD layers
- the inner layers can be built up of a UD prepreg.
- the UD layers of double thickness do not display the same handling problems as a UD layer of single thickness (which problem is solved in accordance with the invention by applying metal foil).
- the inner layers are the above-identified non-flowing UD composite layers in accordance with WO 92/22191.
- the stack of non- foiled UD layers sandwiched between two foiled UD prepregs is such that the UD-reinforced layers are oriented as specified in one of the above models, i.e., Cu0°/90 o 90 o /0°Cu, or Cu0°/90 o 90 o /0 o 0 o /90°90 o /0°Cu.
- the lamination may be conducted in a multidaylight press, an autoclave, a vacuum press, a double belt press, or in any other suitable apparatus.
- the PWB laminates made on the basis of the foiled UD-prepreg in acccordance with the present invention are suitable to be used in multilayer PWBs (MLBs), e.g., as disclosed in WO 92/22192.
- MLBs multilayer PWBs
- the materials employed in carrying through the present invention are not especially critical. Preferably, use is made of the materials discussed hereinafter.
- the matrix material is a thermoplastic or a ther osetting polymer, preference being given to thermosetting resins. More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI), polyi ide (PI), phenol resins, triazines, polyurethanes, silicone resin, biscitraconic resin (BCI). Alternatively, combinations of said resins may be employed, and it is also possible to mix the aforementioned resins with certain appropriate thermoplasts, such as PPO, PES, PSU, and PEI among others.
- thermosetting resins More preferred is the use of an epoxy resin based matrix material, but other resins are also useful in principle. Examples include cyanate esters, unsaturated polyester (UP) resins, vinyl ester resins, acrylate resins, BT epoxy resin, bismaleimide resin (BMI
- interpenetrating polymer networks may be suitable. It is of advantage to incorporate compounds into the matrix material to render it flame resistant, such as phosphorus or halogen-(particularly bromine-) containing compounds.
- a particular matrix material which is preferred for its favourable flow and curing properties comprises about 100 parts by weight of Epikote ® 828 EL, about 73 parts by weight of Epikote ® 5050, and about 4 parts by weight of a complex of boron trifluoride and onoethyl amine.
- the preferred reinforcing material consists of filament yarns
- non-continuous fibres may also be employed.
- the reinforcing yarns are preferably selected from the following group of materials: glass, e.g., E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, Sl-glass, and S2-glass, and various ceramic materials, such as alumina and silicon carbide.
- polymer based fibres more particularly so-called liquid- crystalline polymers, such as paraphenylene terephthalamide (PPDT), polybenzobisoxazole (PBO), polybenzobisthiazole (PBT), and polybenzoimidazole (PBI), as are fibres based on polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyphenylene sulphide (PPS).
- the fibres (filaments) should have a diameter of below 30 ⁇ m, e.g. 20 ⁇ m. Typical diameters more particularly range from 3 to 15 ⁇ m, and preferably are of from 5 to 13 ⁇ m.
- the fibre content in the matrix is about 10-90 vol .%, preferably in the range of about 40 to about 70 vol.%.
- a fibre volume fraction of about 50 vol .% is highly satisfactory.
- the composite laminates manufactured using the process according to the invention are also suited to be used in a flexible panel or laminate and in rigid-flex laminates.
- woven fabrics undergo cracking at the junctions of warp and weft fibres, due to the fact that fibres oriented in the bending direction are interwoven with fibres perpendicular to the bending direction, this adverse effect being enhanced by the high fibre concentration at these junctions, which leads to cracking at a relatively low degree of bending.
- Such cracks cause a high concentration of stress in the conductive traces present on the flexible laminate, and consequently a high risk of cracking, which leads to circuit breakage.
- the orientation of the outer UD layers preferably parallels the desired bending direction.
- the present UD crossply laminates are pre-eminently suited to be used as supporting material in devices with various integrated circuits provided thereon (multichip modules). This is notably due to the favourable TCEs, which mostly are the result of the high fibre volume fraction that can be obtained when crossply laminates are used and may be close to the TCEs of electronic components (chips) used in conjunction with PWBs, more particularly MLBs. Such components may be provided on top of an MLB (chip-on-board) or else be embedded in a substrate such as an intermediate substrate according to WO 92/22192 (chip-in-board) .
- Fig. 1 shows a foiled UD prepreg (1) in accordance with the invention.
- a foiled UD prepreg (1) in accordance with the invention.
- copper foil (2) which is applied onto a UD prepreg layer (3) made up of parallel, unidirectionally oriented reinforcing fibres (4) impregnated with not yet fully consolidated matrix resin (5).
- Fig. 2 shows a non-flowing UD composite (6) in accordance with WO 92/22191.
- x and y cross-sections are two layers made up of UD fibres (7) impregnated with non-flowing matrix resin (8).
- Fig. 3 shows a CuO°/90°90°/0°Cu PWB laminate made by stacking and laminating the non-flowing UD composite (6), with two foiled UD prepregs (1).
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- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
On décrit un matériau de base destiné à la préparation d'un stratifié pour plaquette à circuit imprimé et qui est un matériau préimprégné à fibres unidirectionnelles, recouvert d'une feuille métallique, comprenant une couche d'une feuille de métal conducteur liée à une couche faite de fibres de renforcement parallèles, à orientation unidirectionnelle, possédant un diamètre inférieur à 30 νm et imprégnées d'une résine matricielle pas complètement durcie. On peut utiliser ce matériau préimprégné pour fabriquer des stratifiés de plaquettes à circuit imprimé dont les couches de fibres unidirectionnelles sont croisées, en empilant et en pressant ces couches, en intercalant toutefois entre celles-ci d'autres couches de fibres à orientation unidirectionnelle qui peuvent être soit des couches préimprégnées de fibres à orientation unidirectionnelle dépourvues de couche métallique, soit des couches composites non fluides de fibres à orientation unidirectionnelle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP95932765A EP0782500A1 (fr) | 1994-09-19 | 1995-09-18 | Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiau |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP94202688 | 1994-09-19 | ||
| EP94202688 | 1994-09-19 | ||
| PCT/EP1995/003652 WO1996009158A1 (fr) | 1994-09-19 | 1995-09-18 | Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiau |
| EP95932765A EP0782500A1 (fr) | 1994-09-19 | 1995-09-18 | Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiau |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0782500A1 true EP0782500A1 (fr) | 1997-07-09 |
Family
ID=8217206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP95932765A Ceased EP0782500A1 (fr) | 1994-09-19 | 1995-09-18 | Materiau preimpregne a fibres unidirectionnelles, recouvert d'une feuille metallique, et stratifie de plaquette a circuit imprime prepare a partir de ce materiau |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0782500A1 (fr) |
| JP (1) | JPH10508720A (fr) |
| KR (1) | KR970705465A (fr) |
| CN (1) | CN1158101A (fr) |
| AU (1) | AU694564B2 (fr) |
| CA (1) | CA2200314A1 (fr) |
| MX (1) | MX9702059A (fr) |
| TW (1) | TW371285B (fr) |
| WO (1) | WO1996009158A1 (fr) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0838977A1 (fr) * | 1996-10-25 | 1998-04-29 | Gividi Italia S.P.A. | Laminés pour circuits imprimés en utilisant un tissu de verre unidirectionnel |
| WO2000072643A1 (fr) * | 1999-05-26 | 2000-11-30 | Ppg Industries Ohio, Inc. | Fabrication de preimpregnes lamines unidirectionnellement par procedes de coulage en bande et leurs equipements |
| CN1229002C (zh) | 2001-07-18 | 2005-11-23 | 松下电器产业株式会社 | 电路形成基板及电路形成基板的制造方法 |
| ITRM20040571A1 (it) * | 2004-11-22 | 2005-02-22 | Gen Services Srl | Rotore, relativo procedimento di fabbricazione, e macchina ad induzione impiegante il rotore. |
| JP4903723B2 (ja) | 2006-01-30 | 2012-03-28 | 京セラ株式会社 | 配線基板、および電子装置 |
| JPWO2008093757A1 (ja) | 2007-01-31 | 2010-05-20 | 京セラ株式会社 | プリプレグシートの製造方法および製造装置ならびにプリプレグシート |
| EP1970951A3 (fr) | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif de semi-conducteurs et son procédé de fabrication |
| EP2372756A1 (fr) | 2007-03-13 | 2011-10-05 | Semiconductor Energy Laboratory Co, Ltd. | Dispositif de semi-conducteurs et son procédé de fabrication |
| WO2008117911A1 (fr) | 2007-03-26 | 2008-10-02 | Lg Electronics Inc. | Composant de renforcement pour un réfrigérateur |
| JP5268395B2 (ja) | 2007-03-26 | 2013-08-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1976000A3 (fr) | 2007-03-26 | 2009-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Procédé de fabrication d'un dispositif semi-conducteur |
| JPWO2008120619A1 (ja) | 2007-03-30 | 2010-07-15 | 京セラ株式会社 | 繊維強化樹脂およびその製造方法 |
| EP2001047A1 (fr) | 2007-06-07 | 2008-12-10 | Semiconductor Energy Laboratory Co, Ltd. | Dispositif semi-conducteur |
| JP2009045915A (ja) * | 2007-07-26 | 2009-03-05 | Kyocera Corp | 複合基板、配線基板および実装構造体、並びに複合基板の製造方法 |
| US8284557B2 (en) | 2007-10-18 | 2012-10-09 | Kyocera Corporation | Circuit board, mounting structure, and method for manufacturing circuit board |
| JP5293075B2 (ja) * | 2007-10-24 | 2013-09-18 | 日立化成株式会社 | 金属箔張り積層板及びプリント配線板 |
| JP2009205669A (ja) | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| KR101596698B1 (ko) | 2008-04-25 | 2016-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치 제조 방법 |
| WO2009139282A1 (fr) | 2008-05-12 | 2009-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteur et procédé de fabrication de dispositif à semi-conducteur |
| WO2009142310A1 (fr) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif semiconducteur et procede de fabrication associe |
| WO2009142309A1 (fr) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif semiconducteur |
| JP5248412B2 (ja) | 2008-06-06 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8053253B2 (en) | 2008-06-06 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5473413B2 (ja) | 2008-06-20 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法 |
| JP2010041045A (ja) | 2008-07-09 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| KR102026604B1 (ko) | 2008-07-10 | 2019-10-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
| TWI475282B (zh) | 2008-07-10 | 2015-03-01 | Semiconductor Energy Lab | 液晶顯示裝置和其製造方法 |
| JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| WO2010032611A1 (fr) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteurs et son procédé de fabrication |
| JP5583951B2 (ja) | 2008-11-11 | 2014-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102460722B (zh) | 2009-06-05 | 2015-04-01 | 株式会社半导体能源研究所 | 光电转换装置及其制造方法 |
| TWI517268B (zh) | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
| JP5719560B2 (ja) | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
| KR20110114325A (ko) | 2010-04-13 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 표시 장치 |
| JP5594872B2 (ja) * | 2010-05-06 | 2014-09-24 | 日精株式会社 | 着色繊維強化複合材 |
| JP5851875B2 (ja) * | 2012-02-14 | 2016-02-03 | 信越化学工業株式会社 | 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法 |
| NL2016357B1 (en) * | 2016-03-03 | 2017-09-20 | Allotropica Tech Inc | Pre-preg and composite products |
| JPWO2019111416A1 (ja) * | 2017-12-08 | 2020-12-10 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
| CN109049891B (zh) * | 2018-06-13 | 2020-09-29 | 咸阳天华电子科技有限公司 | 一种高弹性覆铜单向纤维片的制备方法 |
| CN109496076B (zh) * | 2018-12-19 | 2020-12-15 | 咸阳天华电子科技有限公司 | 一种单向纤维电路板的制造工艺 |
| CN111688287B (zh) * | 2020-06-14 | 2022-06-10 | 湖南亿润新材料科技有限公司 | 一种环氧树脂半固化片及其生产工艺 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51111879A (en) * | 1975-03-27 | 1976-10-02 | Mitsubishi Gas Chemical Co | Manufacture of metal foillclad preepreg |
| FR2516441A1 (fr) * | 1981-11-18 | 1983-05-20 | Spie Batignolles | Procede de fabrication de profiles en resine thermoplastique chargee de fibres, installation pour la mise en oeuvre, profiles obtenus et leur utilisation |
| KR900009265A (ko) * | 1988-12-07 | 1990-07-04 | 원본미기재 | 강화 열 가소성 복합체-금속박 적층품의 제조방법 |
| JPH04329132A (ja) * | 1991-04-30 | 1992-11-17 | Tonen Corp | ハイブリッドプリプレグ |
| TW244340B (fr) * | 1992-07-21 | 1995-04-01 | Akzo Nv |
-
1994
- 1994-11-02 TW TW083110086A patent/TW371285B/zh active
-
1995
- 1995-09-18 CA CA002200314A patent/CA2200314A1/fr not_active Abandoned
- 1995-09-18 AU AU35684/95A patent/AU694564B2/en not_active Ceased
- 1995-09-18 MX MX9702059A patent/MX9702059A/es unknown
- 1995-09-18 WO PCT/EP1995/003652 patent/WO1996009158A1/fr not_active Ceased
- 1995-09-18 JP JP8510579A patent/JPH10508720A/ja active Pending
- 1995-09-18 EP EP95932765A patent/EP0782500A1/fr not_active Ceased
- 1995-09-18 KR KR1019970701433A patent/KR970705465A/ko not_active Withdrawn
- 1995-09-18 CN CN95195145A patent/CN1158101A/zh active Pending
Non-Patent Citations (1)
| Title |
|---|
| See references of WO9609158A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10508720A (ja) | 1998-08-25 |
| MX9702059A (es) | 1997-06-28 |
| CA2200314A1 (fr) | 1996-03-28 |
| AU694564B2 (en) | 1998-07-23 |
| KR970705465A (ko) | 1997-10-09 |
| AU3568495A (en) | 1996-04-09 |
| WO1996009158A1 (fr) | 1996-03-28 |
| TW371285B (en) | 1999-10-01 |
| CN1158101A (zh) | 1997-08-27 |
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