EP0803336A2 - Drahtsäge und Abschneideverfahren - Google Patents

Drahtsäge und Abschneideverfahren Download PDF

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Publication number
EP0803336A2
EP0803336A2 EP97106922A EP97106922A EP0803336A2 EP 0803336 A2 EP0803336 A2 EP 0803336A2 EP 97106922 A EP97106922 A EP 97106922A EP 97106922 A EP97106922 A EP 97106922A EP 0803336 A2 EP0803336 A2 EP 0803336A2
Authority
EP
European Patent Office
Prior art keywords
wires
work
rollers
machining
machining rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97106922A
Other languages
English (en)
French (fr)
Other versions
EP0803336B1 (de
EP0803336A3 (de
Inventor
Takashi Kambe
Yukihiro Kanemichi
Yasuhiro Itou
Akio Kawakita
Shigeo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippei Toyama Corp
Original Assignee
Nippei Toyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13139596A external-priority patent/JPH09290417A/ja
Priority claimed from JP31510296A external-priority patent/JP3256155B2/ja
Application filed by Nippei Toyama Corp filed Critical Nippei Toyama Corp
Publication of EP0803336A2 publication Critical patent/EP0803336A2/de
Publication of EP0803336A3 publication Critical patent/EP0803336A3/de
Application granted granted Critical
Publication of EP0803336B1 publication Critical patent/EP0803336B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • B28D1/086Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws consisting of strap saws
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D55/00Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
    • B23D55/08Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of devices for guiding or feeding strap saw blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Definitions

  • the present invention relates to a wire saw used to cut a ingot-shape work of brittle material such as semiconductor material, magnetic material, ceramic, etc. simultaneously into a plural of sheets each having a prescribed thickness, and a work slicing method using it.
  • the machining roller has a tendency of becoming long in the axial direction.
  • the machining roller becomes too long, when the work is cut/sliced, it becomes hot due to friction between the machining roller and wire. This may provide great thermal distortion in the roller, and a large fluctuation in the pitch of the circular grooves.
  • the work cannot be cut into wafers each having a prescribed thickness with a high precision.
  • the cutting thickness of the work is not varied greatly.
  • a tension imparting mechanism 133 and a guide mechanism 134 are arranged between the reel mechanism 127 and the roller groups 113, 114 and 115 of the cutting mechanism 111. Both ends of the wire 118 wound between the machining rollers 116 and 117 in each of the roller groups 113, 114 and 115 is hung on the tension imparting mechanism 133 through each guide roller 135 of the guide mechanism 134. In this state, by the tension imparting mechanism 133, prescribed tension is applied to the wire 118 between the machining rollers 116 and 117 in each of the roller groups 113, 114 and 115.
  • a tension reducing mechanism 136 is arranged between the reel mechanism 127 and tension imparting mechanism 133 and provided with a pair of rotary rollers 137.
  • the wire 118 is hung on the rollers 137. When three rollers 137 are rotated, the tension of the wire 118 spreading from the tension imparting mechanism 133 to the reels of the reel mechanism 127 is attenuated.
  • the first and second aspect of the present invention which is configured as described above, a single work can be cut/sliced by prescribed amounts in a sharing manner by plural flows of wires travelling between the machiningrollers.
  • the cutting thickness of the work can be suppressed from varying.
  • the work which is lengthy can be cut into a large number of wafers simultaneously with a high precision.
  • the reel mechanism for supply and take-up of the wire may not be required individually for each of the roller groups, so that the structure of the wire saw can be simplified and miniaturized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP97106922A 1996-04-27 1997-04-25 Drahtsäge und Abschneideverfahren Expired - Lifetime EP0803336B1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP13139596 1996-04-27
JP131395/96 1996-04-27
JP13139596A JPH09290417A (ja) 1996-04-27 1996-04-27 ワイヤソー及びワーク加工方法
JP315102/96 1996-11-26
JP31510296A JP3256155B2 (ja) 1996-11-26 1996-11-26 ワイヤソー
JP31510296 1996-11-26

Publications (3)

Publication Number Publication Date
EP0803336A2 true EP0803336A2 (de) 1997-10-29
EP0803336A3 EP0803336A3 (de) 1998-04-08
EP0803336B1 EP0803336B1 (de) 2003-07-02

Family

ID=26466243

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97106922A Expired - Lifetime EP0803336B1 (de) 1996-04-27 1997-04-25 Drahtsäge und Abschneideverfahren

Country Status (5)

Country Link
US (1) US5865162A (de)
EP (1) EP0803336B1 (de)
KR (1) KR970069280A (de)
DE (1) DE69723151T2 (de)
MY (1) MY113652A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010000449A1 (de) * 2008-06-30 2010-01-07 Wacker Schott Solar Gmbh Drahtsägevorrichtung
EP2347845A1 (de) * 2010-01-26 2011-07-27 Schott Solar AG Drahtführungsrolle zur Verwendung in Drahtsägen
CN104972567A (zh) * 2014-04-11 2015-10-14 上海启发电子科技有限公司 一种多线切割机导轮
CN110834385A (zh) * 2018-08-15 2020-02-25 株式会社迪思科 切削装置
EP3943265A1 (de) * 2020-07-21 2022-01-26 Siltronic AG Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
JP3256503B2 (ja) * 1998-11-05 2002-02-12 日本碍子株式会社 セラミック生素地製品の切断装置
JP4411062B2 (ja) * 2003-12-25 2010-02-10 株式会社アライドマテリアル 超砥粒ワイヤソー巻き付け構造、超砥粒ワイヤソー切断装置および超砥粒ワイヤソーの巻き付け方法
GB2414204B (en) * 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
US20090122637A1 (en) * 2007-11-14 2009-05-14 Jan Kruyer Sinusoidal mixing and shearing apparatus and associated methods
US20090139905A1 (en) * 2007-11-30 2009-06-04 Jan Kruyer Endless cable system and associated methods
US20090139906A1 (en) * 2007-11-30 2009-06-04 Jan Kruyer Isoelectric separation of oil sands
SG183130A1 (en) * 2010-02-08 2012-09-27 Toyo Advanced Tech Co Method of cutting workpiece with wire saw, and wire saw
US8881716B2 (en) * 2010-02-08 2014-11-11 Toyo Advanced Technologies Co., Ltd. Wire saw with tension detecting means and guide roller speed control
KR101897082B1 (ko) * 2011-12-26 2018-09-11 엘지이노텍 주식회사 잉곳 절단 장치 및 잉곳 절단 방법
US9312066B2 (en) * 2012-01-09 2016-04-12 Apple Inc. Magnetic shape optimization
CN104708719B (zh) * 2013-12-13 2016-11-02 无锡斯达新能源科技股份有限公司 一种双头摇摆式蓝宝石晶圆开方机

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1662488A (en) * 1923-05-26 1928-03-13 Burkhardt Otto Stone saw
US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire
US4191159A (en) * 1978-10-16 1980-03-04 Nasa System for slicing silicon wafers
US4494523A (en) * 1983-08-05 1985-01-22 Motorola, Inc. Wire saw
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
JPH04294973A (ja) * 1991-03-20 1992-10-19 Nippon Steel Corp ワイヤーソー
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010000449A1 (de) * 2008-06-30 2010-01-07 Wacker Schott Solar Gmbh Drahtsägevorrichtung
EP2347845A1 (de) * 2010-01-26 2011-07-27 Schott Solar AG Drahtführungsrolle zur Verwendung in Drahtsägen
CN104972567A (zh) * 2014-04-11 2015-10-14 上海启发电子科技有限公司 一种多线切割机导轮
CN110834385A (zh) * 2018-08-15 2020-02-25 株式会社迪思科 切削装置
CN110834385B (zh) * 2018-08-15 2023-08-18 株式会社迪思科 切削装置
EP3943265A1 (de) * 2020-07-21 2022-01-26 Siltronic AG Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück
WO2022017803A1 (de) * 2020-07-21 2022-01-27 Siltronic Ag Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück
US12311577B2 (en) 2020-07-21 2025-05-27 Siltronic Ag Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece

Also Published As

Publication number Publication date
EP0803336B1 (de) 2003-07-02
KR970069280A (ko) 1997-11-07
DE69723151T2 (de) 2004-03-11
EP0803336A3 (de) 1998-04-08
DE69723151D1 (de) 2003-08-07
MY113652A (en) 2002-04-30
US5865162A (en) 1999-02-02

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