EP0923751A1 - Module d'emission et/ou de reception optoelectronique, et son procede de production - Google Patents

Module d'emission et/ou de reception optoelectronique, et son procede de production

Info

Publication number
EP0923751A1
EP0923751A1 EP97941805A EP97941805A EP0923751A1 EP 0923751 A1 EP0923751 A1 EP 0923751A1 EP 97941805 A EP97941805 A EP 97941805A EP 97941805 A EP97941805 A EP 97941805A EP 0923751 A1 EP0923751 A1 EP 0923751A1
Authority
EP
European Patent Office
Prior art keywords
optoelectronic
carrier plate
cap
cover cap
transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97941805A
Other languages
German (de)
English (en)
Inventor
Hans-Ludwig Althaus
Werner Späth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0923751A1 publication Critical patent/EP0923751A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering

Definitions

  • the invention relates to an optoelectronic transmitting and / or receiving module for signal transmission by means of an optical waveguide, in which an optoelectronic transmitting and / or receiving unit which is assigned to the carrier plate and is arranged in a housing essentially formed by a carrier plate and a cover cap has an optoelectronic transmitter element and / or an optoelectronic receiver element and an optical radiation focusing device which is adjusted in particular for maximum radiation coupling into or out of the optoelectronic transmitter and / or receiver unit, in the case of which for at least one electrical connection the optoelectronic transmitter and / or receiver unit is provided with an electrically conductive feedthrough through the housing and in which the cover cap has an optical waveguide connection device. Furthermore, the invention relates to a method for producing an optoelectronic transmitter and / or receiver module.
  • Such a module is known for example from the European patent application EP 664 585.
  • a transmission and reception module for bidirectional optical message and signal transmission is described therein.
  • a hybrid laser module chip and a PIN diode chip are located on a base plate with a plurality of electrical housing bushings arranged.
  • a cover cap is attached to the base plate, which has a window and which, together with the base plate, the housing se of the transmitter and receiver module.
  • the window serves to couple or couple radiation emitted or received by the transmitting and receiving module out of or into the interior of the housing.
  • the housing is hermetically sealed and provided with a vacuum or filled with gas.
  • a device for transmitting light between an optoelectronic component and an optical waveguide with a spherical lens for bundling the light radiation in which the optoelectronic component is attached to a base plate of a gas-tight housing.
  • a sleeve with a radiation passage opening in which the spherical lens is fitted is placed on the base plate.
  • the optical waveguide is pushed into the sleeve on the side of the sleeve facing away from the base plate.
  • the sleeve is moved relative to the base plate until the light intensity coupled over between the component and the optical waveguide becomes maximum and the sleeve is subsequently attached to the base plate.
  • a separate adjustment of the optical waveguide with respect to the ball lens and the component is not possible with this device.
  • the sleeve and the ball lens must therefore be designed as high-precision parts.
  • US Pat. No. 4,650,285 describes an optoelectronic structural unit in which an optoelectronic transmission element is arranged on a carrier plate and a spherical lens is located above it.
  • a cover cap with a radiation passage window is attached to the support plate in such a way that the support plate together with the cover cap completely encloses the optoelectronic transmission element.
  • the cover cap is held over the carrier plate by means of a chuck, which is attached in the middle above the radiation passage window. has arranged optical fiber for communicating with the electrically activated optoelectronic transmission element.
  • cover cap is then moved relative to the carrier plate until a maximum output power of the electrically activated optoelectronic transmission element is detected in the optical fiber. In this position, the cover cap is attached to the carrier plate.
  • a fitting part is placed on the cover cap, into which the end of the optical waveguide is inserted.
  • both the cover cap and the fitting part must be designed as a high-precision part. Large tolerances in the manufacture of these parts would lead to a low yield in the manufacture of the optoelectronic components. In this optoelectronic assembly, only an inaccuracy in the positioning of the optoelectronic transmission element can be compensated for by subsequent adjustment of the cover cap. A separate adjustment of the fitting part and thus the optical fiber is not possible here.
  • the invention has for its object to develop an optoelectronic transmitter and / or receiver module of the type mentioned in such a way that a simple and improved adjustment of an optical fiber compared to the optoelectronic transmitter and / or receiver unit is ensured. Another goal is to reduce the assembly effort for the optical waveguide and to create a module with minimal dimensions.
  • the carrier plate or the cover cap has a mounting surface on which the cover cap or the optical waveguide connection device can be displaced with respect to the optoelectronic transmitter and / or receiver unit before being finally fixed, so that essentially immediately before the final fixed connection the cover cap or the optical fiber connection device with the carrier plate, the optical fiber connection device can be adjusted with respect to the optoelectronic transmitter and / or receiver unit.
  • the carrier plate has an inner region and a cover cap assembly region which surrounds this inner region.
  • the optoelectronic transmitting and / or receiving unit is arranged on the inner region, preferably in such a way that the direction of radiation and / or receiving direction of the optoelectronic transmitting and / or receiving unit runs essentially perpendicular to the carrier plate (3) and away from it.
  • the cover cap has a side wall enclosing the inner region, the end face of which faces the carrier plate lies in the cover cap assembly area on the carrier plate and is firmly connected to the latter.
  • the area of the inner area is smaller in all dimensions than the area on the carrier plate which is enclosed by the side wall, so that essentially immediately before the cover cap is finally firmly connected to the carrier plate for adjusting the optical fiber connection device with respect to the optoelectronic Unit, in particular for maximum radiation emitting and / or coupling out or out of the optical waveguide, the cover cap can preferably be displaced in all directions with respect to the optoelectronic transmitting and / or receiving unit
  • This optoelectronic transmitter and / or receiver module according to the invention can advantageously be realized with a minimal need for individual parts and with extremely small dimensions, since no separate adjustment devices for the optical waveguide or for the optoelectronic transmitter and / or receiver module are necessary
  • the cover cap is formed in one piece with the optical waveguide connection device. This has the particular advantage that this component of the housing can be easily manufactured in large quantities, for example in stock.
  • the cover cap with the fiber optic connection is composed of a first and a second part, the first part having a housing cap with a mounting surface on which a second part is fastened, which has the fiber optic connection device.
  • This embodiment has the particular advantage that the first part can be fastened to the carrier plate with the housing cap and then the second part can be adjusted and fixed with the optical waveguide connection device with respect to the optoelectronic transmission and / or reception.
  • the cover cap with the optical waveguide connection device is telbar on the carrier plate or the first part directly on the carrier plate and the second part on the first part by means of gluing, soldering or welding not releasably attached.
  • the thickness of the cover cap mounting area is less than the thickness of the inner area and the end face of the side wall facing the carrier plate in the cover cap mounting area is connected to the carrier plate.
  • the smaller thickness of the cover cap mounting area compared to the inner area has the particular advantage that the cover cap mounting area of the carrier plate can be heated very quickly and precisely locally, for example by means of a laser, without simultaneously the inner area in which the optoelectronic transmission and / or Receiver unit is arranged, is heated too much.
  • the optoelectronic transmitter and / or receiver unit can thereby advantageously be protected against excessive heat loads.
  • the cover cap has a hermetically sealed window cap with the window arranged on the carrier plate and a wall sleeve surrounding the window cap.
  • the inner cross-section of the wall sleeve is larger than the outer cross-section of the window cap, so that the wall sleeve can be displaced with respect to the carrier plate or on the window cap before it is fastened.
  • the optical waveguide connection device is fastened on an end face of the wall sleeve facing away from the carrier plate or is formed in one piece with the window cap and arranged above the window cap. This preferred embodiment advantageously also requires only very little assembly effort and has a very small size.
  • a further advantageous development of the optoelectronic transmission and / or reception modules according to the invention consists in the fact that the optical waveguide connection device has a plug-socket for attaching an optical waveguide provided with a plug.
  • This has the particular advantage, for example, that a defective optoelectronic transmitter and / or receiver module can be replaced in a simple manner.
  • the optical waveguide connection device is attached to the optoelectronic transmitter and / or receiver unit by moving the cover cap relative to the carrier before the cover cap is attached to the support plate - plate z. B. adjusted for maximum radiation coupling into the light waveguide or into the receiving element. The cover cap is then firmly connected to the carrier plate.
  • the housing cap is first attached to the carrier plate and then the connecting part is attached the optical waveguide connection device by moving the connecting part relative to the carrier plate z. B. adjusted for maximum radiation coupling into the light waveguide or into the receiving element and fastened on the housing cap.
  • the window cap is first attached to the carrier plate, such that the carrier plate together with the window cap z.
  • B. forms a hermetically sealed housing. Then the wall sleeve is placed on the window cap or the support plate and fastened before the connection part with the optical waveguide connection device by displacing the connection part relative to the support plate z.
  • the wall sleeve is adjusted for maximum radiation coupling into the light waveguide or into the receiving element and fastened on the wall sleeve. If the wall sleeve is formed in one piece with the connecting part, the wall sleeve is adjusted by moving the wall sleeve relative to the window cap. The wall sleeve must then be designed in a manner analogous to the embodiment with a one-piece cover cap with an optical waveguide connection device in such a way that it can be displaced relative to the carrier plate before being fixed on it.
  • FIG. 1 shows a schematic sectional illustration of a first exemplary embodiment of the optoelectronic transmitter and / or receiver module according to the invention
  • FIG. 2 shows a schematic sectional illustration of a second exemplary embodiment of the optoelectronic transmitter and / or receiver module according to the invention
  • FIG. 3 shows a schematic sectional illustration of a third exemplary embodiment of the optoelectronic transmitter and / or receiver module according to the invention
  • Figure 4 is a schematic sectional view of a fourth embodiment of the optoelectronic transmitter and / or receiver module according to the invention.
  • an optoelectronic transmitter and / or receiver unit 5 is arranged on a carrier plate 2, for example a conventional standard 8pin-T039 base plate.
  • This contains a U-shaped heat sink 16, which is made, for example, of copper, ceramic or silicon, an insulator carrier element 17 on which a PIN diode chip 18 or another photodiode is attached, and a hybrid laser module chip 30 with a laser diode 39 arranged on a sub ount, two deflection prisms, a monitor diode 41 and a collecting optics 40.
  • a more detailed description of the hybrid laser module chip 30 is, for example, in European
  • Patent application EP 664 585 included and is therefore no longer described here.
  • the hybrid laser module chip 30 is arranged on the U-shaped heat sink 16 in such a way that it comes to lie on the PIN diode chip 18 positioned within the U-shaped heat sink 16.
  • the positioning of hybrid laser module chip 30 and PIN diode chip 18 in relation to one another is also described in European patent application EP 664 585 and is therefore not explained in more detail here.
  • Electrical housing bushings 6 are arranged in the carrier plate 2, which lead through the carrier plate 2 and with which the electrical connections of the optoelectronic transmitter and / or receiver unit 5 are made, for example, by means of
  • Bond wires 19 are connected and led out of the interior of the housing formed by the cover cap 3 and the base plate 2.
  • the housing feedthroughs 6 are fastened in the carrier plate 2 by means of an electrically insulating connecting means 33, for example an adhesive or a glass solder, or are hermetically sealed in as standard.
  • the carrier plate 2 has an inner region 11 which at least partially has a greater thickness D ⁇ than a cover cap mounting region 12 which surrounds the inner region 11 and has a thickness D A and a mounting surface 42.
  • the cover cap 3 is designed such that the end face 13 of the side wall 10 is seated on the cover cap mounting area 12 of the carrier plate 2.
  • a mechanically strong and hermetically sealed connection 28 between the carrier plate 2 and the cover cap 3 is realized, for example, by means of resistance welding, laser welding or a conventional weld seam, but could also be soldered or glued.
  • a transparent pane 31 is arranged in the optical window 4 of the covering cap 3, which is connected to the covering cap 3 via a connecting means 32 and, if necessary, hermetically seals it.
  • An adhesive or a glass solder can be used as the connecting means 32, for example.
  • the cap 3 On the opposite side of the support plate 2 of the window 4, the cap 3 has an optical fiber connector 7 in which an optical fiber 1 is attached and attached to the z.
  • an optical fiber cable 37 (see FIG. 2) is coupled.
  • the optical waveguide connection device 7 can, for example, se have a connecting fiber guide, which is designed as a pigtail.
  • the cover cap 3 is positioned and fixed on the carrier plate 2 in such a way that radiation emitted or received by the optoelectronic transmitter and / or receiver unit 5 is optimally coupled into the optical waveguide 1 or into the optoelectronic transmitter and / or receiver unit 5.
  • the area enclosed by the side wall 10 of the cover cap 3 is larger in all dimensions than the area of the inner region 11, in such a way that a cover cap 3 placed on the cover cap mounting area 12 of the carrier plate 2 can be displaced in all directions parallel to the upper side 20 of the carrier plate 2.
  • the optical waveguide 1 can thus be brought into the desired position simply by moving the cover cap 3 before it is finally fixed on the carrier plate 2.
  • the distance between the optical waveguide 1 and the optoelectronic transmitter and / or receiver unit 5 can be set in a simple manner. Only then is the connection 28 made, for example, by means of laser welding.
  • the hybrid laser module chip 30 is first produced with a collecting optic 40 that is adjusted with respect to the laser diode chip 39. Subsequently, the hybrid laser module chip 30 is attached to the heat sink 16, which, like that, is already on the carrier plate 2 or is subsequently applied thereon. Then the cover cap 3 placed on the carrier plate 2, adjusted and connected to it, for. B. welded.
  • the cover cap 3 is composed of a first part 8 and a second part 9, the first part 8 as a housing cap (cover cap) with a radiation passage - Step opening 4, a transparent disc 31 arranged in this and a side wall 10 is formed, which together with the carrier plate 2 encloses the optoelectronic transmitting and / or receiving unit 5.
  • the second part 9 has an optical waveguide connection device 7 and is fastened to a mounting surface 42 of the first part 8 such that an optical waveguide 1 arranged in the optical waveguide connection device 7 is arranged above the radiation passage opening 4 as seen from the carrier plate 2.
  • the second part 9 is fastened to the first part 8, for example by means of resistance welding, laser welding, soldering or gluing.
  • the disc 31 may be omitted.
  • the first part 8 (housing cap) is first attached to the carrier plate 2 and subsequently the second part 9 (connecting part) with the optical waveguide connecting device 7 by displacing the second part 9 relative to the carrier plate 2 z. B. adjusted for maximum radiation coupling into the optical waveguide 1 or in the receiving element 18 and attached to the housing cap 8.
  • the cover cap 3 is composed of three parts, namely a window cap 14, a wall sleeve 15 surrounding this window cap 14 and one fastened on the wall sleeve 15 Connection part 9 with an optical waveguide connection device 7.
  • the window cap 14 is provided with a window 4 which is hermetically sealed by means of a transparent pane 31 in connection with a connecting means 32.
  • the window cap 14 forms, together with the carrier plate 2, a hermetically sealed housing for the optoelectronic transmitting and / or receiving unit 5.
  • the window cap 14 is fastened to the carrier plate 2 by means of welding, gluing or soldering.
  • the wall sleeve 15 whose end face 13 facing the carrier plate 2 is connected to the window cap 14 by means of welding, gluing or soldering, serves as a supporting device for the connecting part 9 with the optical waveguide connection device 7. This is on the end face 21 facing away from the carrier plate 2. which here represents the mounting surface 42, the wall sleeve 15 also attached by welding, soldering or gluing.
  • connection part 9 with the optical waveguide connection device 7 and the wall sleeve 15 of the embodiment of FIG. 3 are integrally formed.
  • the area enclosed by the wall sleeve 15 must be larger than the outer diameter of the window cap 14, such that the wall sleeve 15 is parallel to the top side 20 of the window cap 14 Carrier plate 2 is displaceable in all directions. Then the wall sleeve 15 with the optical waveguide connection device 7 can be precisely adjusted before being finally attached to the window cap 14 or on the carrier plate 2 for the optoelectronic transmitting and / or receiving unit 5.
  • window cap 14 is omitted in the exemplary embodiment in FIG. 3, that the wall sleeve 15 is placed on the carrier plate 2, on which the connecting part 9 is fastened with the optical waveguide connecting device 7.
  • the window cap 14 is first fastened to the carrier plate 2, such that the carrier plate 2 together with the window cap 14 z. B. forms a hermetically sealed housing. Then the wall sleeve 15 is placed on the window cap 14 or the carrier plate 2 and fastened before the connecting part 9 with the optical waveguide connecting device 7 by moving the connecting part 9 relative to the carrier plate 2 z. B. adjusted for maximum radiation coupling into the optical waveguide 1 or in the receiving element 18 and fastened on the wall sleeve 15.
  • the wall sleeve 15 is formed in one piece with the connecting part 9, its adjustment takes place by displacing the wall sleeve 15 relative to the window cap 14.
  • the wall sleeve 15 must then be designed in a manner analogous to the embodiment with a one-piece cover cap with an optical waveguide connection device so that it is in front the fixation on the carrier plate 2 is displaceable relative to the latter.
  • the embodiment shown in FIG. 4 of the optoelectronic transmitter and / or receiver module according to the invention differs from the embodiment examples described above in particular in that the cover cap 3 has a guide sleeve 22 (a so-called receptacle
  • Coupling sleeve for a ferrule of an optical waveguide and a plug socket 23 (a so-called receptacle body).
  • the guide sleeve 22 is fastened, for example, to a housing part 24 corresponding to the first part 8 of the embodiment of FIG. 2, so that a guide sleeve window 25 formed in the guide sleeve 22 is arranged above a window 4 of the housing part 24.
  • the inside of the guide sleeve 22 is provided with a ceramic sleeve 26, for example, for precise guidance of an insertable optical waveguide.
  • the socket 23 has a socket base plate 27 fastened to the housing part 24 with a hole into which the housing part 24 is inserted.
  • a connection 29 between the socket base plate 27 and the housing part 24 is made, for example, by gluing, soldering or welding.
  • a socket sleeve 34 for example made of plastic or metal, is fastened, which is designed such that the guide sleeve 22 comes to lie completely in a socket interior 35 defined by the combination of socket bottom plate 27, socket socket 34 and housing part 24 .
  • a holding clamp 36 is fastened in the socket interior 35 and serves to fix a correspondingly designed optical waveguide plug in the socket 23.
  • the plug socket sleeve 34 including the holding clip 36 can optionally be designed in accordance with the standardized plug housing types (STC, SC, FC, DIN, E2000 etc.).
  • the housing type shown by way of example in FIG. 4 is a so-called SC receiver.
  • the cap 3 is not limited to the embodiment shown there.
  • the housing part 24 including the guide sleeve 22 can, for example, be formed in one piece. Compare the embodiment of FIG. 1, in which the cover cap 3 is formed in one piece with the light waveguide connection device 7.
  • the cover cap 3 can have a window cap 14 enclosed by a wall 15, over which the guide sleeve 22 is fastened.
  • the carrier plate 2 and the cover cap 3 in the exemplary embodiments of FIGS. 1 to 3 can be produced entirely from a metallic material or from another material known to the person skilled in the art to be suitable.
  • the base plate 2, the housing part 24 including the guide sleeve 22 and the plug socket base plate 27 can also be made of a metallic material, for example; the socket sleeve 34 and the retaining clip 36 are made of plastic, for example.
  • the disk 31 can be designed for special applications as an optical filter for certain wavelengths or for certain intensities.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module d'émission et/ou de réception optoélectronique destiné à la transmission de signaux au moyen d'un guide d'ondes optique (1), constitué d'un boîtier présentant une plaque support (2), une coiffe de couverture (3) et une fenêtre (4), dans lequel est disposée une unité d'émission et/ou de réception (5). Selon l'invention, la coiffe de couverture (3) présente un dispositif de connexion de guide d'ondes (7) qui est conçu de telle façon qu'il peut être réglé, par rapport à l'unité optoélectronique (5), avant d'être fixé définitivement.
EP97941805A 1996-09-02 1997-08-22 Module d'emission et/ou de reception optoelectronique, et son procede de production Withdrawn EP0923751A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1996135583 DE19635583A1 (de) 1996-09-02 1996-09-02 Optoelektronisches Sende- und/oder Empfangsmodul
DE19635583 1996-09-02
PCT/DE1997/001811 WO1998010319A1 (fr) 1996-09-02 1997-08-22 Module d'emission et/ou de reception optoelectronique, et son procede de production

Publications (1)

Publication Number Publication Date
EP0923751A1 true EP0923751A1 (fr) 1999-06-23

Family

ID=7804403

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97941805A Withdrawn EP0923751A1 (fr) 1996-09-02 1997-08-22 Module d'emission et/ou de reception optoelectronique, et son procede de production

Country Status (5)

Country Link
EP (1) EP0923751A1 (fr)
JP (1) JP2000501856A (fr)
CN (1) CN1235679A (fr)
DE (1) DE19635583A1 (fr)
WO (1) WO1998010319A1 (fr)

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DE10032796A1 (de) * 2000-06-28 2002-01-17 Infineon Technologies Ag Optomodul
JP4750983B2 (ja) * 2001-09-21 2011-08-17 シチズン電子株式会社 双方向光伝送デバイス
US20050030628A1 (en) * 2003-06-20 2005-02-10 Aegis Semiconductor Very low cost narrow band infrared sensor
US7221827B2 (en) 2003-09-08 2007-05-22 Aegis Semiconductor, Inc. Tunable dispersion compensator
DE10348675B3 (de) 2003-10-15 2005-06-09 Infineon Technologies Ag Modul für eine bidirektionale optische Signalübertragung
DE102005063280A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Hermetisch dichtes Elektronik-Gehäuse sowie Trägerplatte
KR101171205B1 (ko) 2011-12-21 2012-08-06 진재현 양방향 광 송수신기
CN106908916A (zh) * 2017-04-17 2017-06-30 武汉盛为芯科技股份有限公司 一种基于柔性电路板的垂直腔面发射光器件

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Also Published As

Publication number Publication date
WO1998010319A1 (fr) 1998-03-12
DE19635583A1 (de) 1998-03-05
JP2000501856A (ja) 2000-02-15
CN1235679A (zh) 1999-11-17

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