JP2000501856A - 光電式送光および／または受光モジュールおよびその製造方法 - Google Patents
光電式送光および／または受光モジュールおよびその製造方法Info
- Publication number
- JP2000501856A JP2000501856A JP10512107A JP51210798A JP2000501856A JP 2000501856 A JP2000501856 A JP 2000501856A JP 10512107 A JP10512107 A JP 10512107A JP 51210798 A JP51210798 A JP 51210798A JP 2000501856 A JP2000501856 A JP 2000501856A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric
- support plate
- optical waveguide
- cap
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 230000003287 optical effect Effects 0.000 claims abstract description 247
- 230000005540 biological transmission Effects 0.000 claims abstract description 120
- 230000008054 signal transmission Effects 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 30
- 230000008878 coupling Effects 0.000 claims description 25
- 238000010168 coupling process Methods 0.000 claims description 25
- 238000005859 coupling reaction Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 16
- 230000005693 optoelectronics Effects 0.000 claims description 9
- 230000003213 activating effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 20
- 230000008901 benefit Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000004026 adhesive bonding Methods 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004334 sorbic acid Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19635583.4 | 1996-09-02 | ||
| DE1996135583 DE19635583A1 (de) | 1996-09-02 | 1996-09-02 | Optoelektronisches Sende- und/oder Empfangsmodul |
| PCT/DE1997/001811 WO1998010319A1 (fr) | 1996-09-02 | 1997-08-22 | Module d'emission et/ou de reception optoelectronique, et son procede de production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000501856A true JP2000501856A (ja) | 2000-02-15 |
Family
ID=7804403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10512107A Pending JP2000501856A (ja) | 1996-09-02 | 1997-08-22 | 光電式送光および／または受光モジュールおよびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0923751A1 (fr) |
| JP (1) | JP2000501856A (fr) |
| CN (1) | CN1235679A (fr) |
| DE (1) | DE19635583A1 (fr) |
| WO (1) | WO1998010319A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101171205B1 (ko) | 2011-12-21 | 2012-08-06 | 진재현 | 양방향 광 송수신기 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10032796A1 (de) * | 2000-06-28 | 2002-01-17 | Infineon Technologies Ag | Optomodul |
| JP4750983B2 (ja) * | 2001-09-21 | 2011-08-17 | シチズン電子株式会社 | 双方向光伝送デバイス |
| US20050030628A1 (en) * | 2003-06-20 | 2005-02-10 | Aegis Semiconductor | Very low cost narrow band infrared sensor |
| US7221827B2 (en) | 2003-09-08 | 2007-05-22 | Aegis Semiconductor, Inc. | Tunable dispersion compensator |
| DE10348675B3 (de) | 2003-10-15 | 2005-06-09 | Infineon Technologies Ag | Modul für eine bidirektionale optische Signalübertragung |
| DE102005063280A1 (de) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Hermetisch dichtes Elektronik-Gehäuse sowie Trägerplatte |
| CN106908916A (zh) * | 2017-04-17 | 2017-06-30 | 武汉盛为芯科技股份有限公司 | 一种基于柔性电路板的垂直腔面发射光器件 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57118212A (en) * | 1981-01-14 | 1982-07-23 | Nec Corp | Optical semiconductor receptacle |
| JPS5910289A (ja) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | 半導体装置 |
| JPS59166907A (ja) * | 1983-03-14 | 1984-09-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レ−ザ結合装置 |
| JPS59166906A (ja) * | 1983-03-14 | 1984-09-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レ−ザ結合装置 |
| US4650285A (en) * | 1984-04-20 | 1987-03-17 | Motorola, Inc. | Hot alignment assembly method for optoelectronic packages |
| DE4022076A1 (de) * | 1990-07-10 | 1992-01-16 | Siemens Ag | Vorrichtung zur uebertragung von licht |
| JPH05343709A (ja) * | 1992-06-08 | 1993-12-24 | Sumitomo Electric Ind Ltd | ピッグテール型光モジュールの製造方法 |
| US5537503A (en) * | 1993-10-25 | 1996-07-16 | Matsushita Electric Industrial Co., Ltd. | Optical semiconductor module and method of fabricating the same |
| DE59308228D1 (de) * | 1993-12-22 | 1998-04-09 | Siemens Ag | Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung |
-
1996
- 1996-09-02 DE DE1996135583 patent/DE19635583A1/de not_active Withdrawn
-
1997
- 1997-08-22 CN CN 97199393 patent/CN1235679A/zh active Pending
- 1997-08-22 JP JP10512107A patent/JP2000501856A/ja active Pending
- 1997-08-22 WO PCT/DE1997/001811 patent/WO1998010319A1/fr not_active Ceased
- 1997-08-22 EP EP97941805A patent/EP0923751A1/fr not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101171205B1 (ko) | 2011-12-21 | 2012-08-06 | 진재현 | 양방향 광 송수신기 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998010319A1 (fr) | 1998-03-12 |
| EP0923751A1 (fr) | 1999-06-23 |
| DE19635583A1 (de) | 1998-03-05 |
| CN1235679A (zh) | 1999-11-17 |
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