EP0952545A4 - Carte a circuit integre - Google Patents

Carte a circuit integre

Info

Publication number
EP0952545A4
EP0952545A4 EP98947891A EP98947891A EP0952545A4 EP 0952545 A4 EP0952545 A4 EP 0952545A4 EP 98947891 A EP98947891 A EP 98947891A EP 98947891 A EP98947891 A EP 98947891A EP 0952545 A4 EP0952545 A4 EP 0952545A4
Authority
EP
European Patent Office
Prior art keywords
card
encapsulating
board
insulating
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98947891A
Other languages
German (de)
English (en)
Other versions
EP0952545B1 (fr
EP0952545A1 (fr
Inventor
Satoru Sugiyama
Toyoji Kanazawa
Tetsuo Satoh
Mikio Yamaguchi
Masahi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of EP0952545A1 publication Critical patent/EP0952545A1/fr
Publication of EP0952545A4 publication Critical patent/EP0952545A4/fr
Application granted granted Critical
Publication of EP0952545B1 publication Critical patent/EP0952545B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention porte sur une carte à circuit intégré ayant un substrat de carte et un module à circuit intégré monté sur ledit substrat. Le module à circuit intégré comprend une plaque à bornes (1) incluant un tableau isolant (2) sur lequel est formée une configuration de borne de jonction (3) pour l'alimentation électrique, le raccordement des signaux et la mise à la terre. Le module comprend également une puce à circuit intégré (4) montée sur le revers de la plaque à bornes (1) et raccordée électriquement à la configuration de borne (3), un élément d'encapsulation (5) pour encapsuler la puce (4) et un élément de renforcement (6) pour renforcer l'élément d'encapsulation (5). Cet élément de renforcement (6) est constitué d'un matériau conducteur et comprend une section annulaire (7) recouvrant la périphérie de l'élément d'encapsulation (5) et une section de bride (8) présentant quasiment la même forme que la périphérie de la plaque à bornes (1) qui recouvre le revers du tableau isolant (2), ces deux sections formant un corps solidaire. Dans une telle carte à circuit intégré, la rupture par disjonction des fils de masse résultant de la séparation du substrat isolant (2) et de l'élément d'encapsulation (5) due à une force extérieure est réalisée à faible coût.
EP98947891A 1997-10-16 1998-10-15 Carte a circuit integre Expired - Lifetime EP0952545B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28408797A JP3914620B2 (ja) 1997-10-16 1997-10-16 Ｉｃカード
JP28408797 1997-10-16
PCT/JP1998/004668 WO1999021132A1 (fr) 1997-10-16 1998-10-15 Carte a circuit integre

Publications (3)

Publication Number Publication Date
EP0952545A1 EP0952545A1 (fr) 1999-10-27
EP0952545A4 true EP0952545A4 (fr) 2001-04-18
EP0952545B1 EP0952545B1 (fr) 2005-08-31

Family

ID=17674081

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98947891A Expired - Lifetime EP0952545B1 (fr) 1997-10-16 1998-10-15 Carte a circuit integre

Country Status (5)

Country Link
US (1) US6166914A (fr)
EP (1) EP0952545B1 (fr)
JP (1) JP3914620B2 (fr)
DE (1) DE69831394T2 (fr)
WO (1) WO1999021132A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101636750A (zh) * 2007-03-23 2010-01-27 富士通株式会社 电子装置、安装有电子装置的电子设备、安装有电子装置的物品、电子装置的制造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG80077A1 (en) * 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres
US20050145609A1 (en) * 2001-02-26 2005-07-07 John Gregory Method of forming an opening or cavity in a substrate for receiving an electronic component
JP4802398B2 (ja) * 2001-06-08 2011-10-26 凸版印刷株式会社 非接触ｉｃカード
JP2003058853A (ja) * 2001-08-17 2003-02-28 Toppan Forms Co Ltd 非接触型ｉｃカード及びその製造方法
DE10200382B4 (de) * 2002-01-08 2006-05-04 Infineon Technologies Ag Chipmodul für Chipkarten
FR2838850B1 (fr) * 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
TWI299559B (en) * 2002-06-19 2008-08-01 Inpaq Technology Co Ltd Ic substrate with over voltage protection function and method for manufacturing the same
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP2005122678A (ja) * 2003-09-26 2005-05-12 Toshiba Corp 携帯可能電子装置
TWI249232B (en) * 2004-10-20 2006-02-11 Siliconware Precision Industries Co Ltd Heat dissipating package structure and method for fabricating the same
WO2007056503A2 (fr) * 2005-11-08 2007-05-18 Macsema, Inc. Dispositifs d'informations
US7680625B2 (en) * 2005-11-14 2010-03-16 Macsema, Inc. Systems and methods for monitoring system performance
US7908118B2 (en) * 2005-11-14 2011-03-15 Macsema, Inc. System and methods for testing, monitoring, and replacing equipment
US20080106415A1 (en) * 2006-11-08 2008-05-08 Macsema, Inc. Information tag
EP2420960A1 (fr) * 2010-08-17 2012-02-22 Gemalto SA Procédé de fabrication d'un dispositif électronique comportant un module indémontable et dispositif obtenu
JP2013206122A (ja) * 2012-03-28 2013-10-07 Toppan Printing Co Ltd Ｉｃモジュールとこれを搭載したｉｃカード
EP2731058A1 (fr) * 2012-11-13 2014-05-14 Gemalto SA Procédé de fabrication d'un module à puce électronique anti-charge électrostatique
EP3836010B1 (fr) 2019-12-12 2024-07-24 Fingerprint Cards Anacatum IP AB Module de capteur biométrique pour l'intégration dans une carte

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
EP0766197A1 (fr) * 1995-04-13 1997-04-02 Dai Nippon Printing Co., Ltd. Carte et module de circuit integre

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201295A (ja) * 1986-02-28 1987-09-04 松下電器産業株式会社 Ｉｃカ−ドおよびその製造方法
US4803546A (en) * 1986-09-17 1989-02-07 Fujitsu Limited Heatsink package for flip-chip IC
JPS6440397A (en) * 1987-08-07 1989-02-10 Dainippon Printing Co Ltd Portable electronic device
JPH01184193A (ja) * 1988-01-19 1989-07-21 Mitsubishi Electric Corp 薄型半導体カード
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
JP2772739B2 (ja) * 1991-06-20 1998-07-09 いわき電子株式会社 リードレスパッケージの外部電極構造及びその製造方法
JPH08267973A (ja) * 1995-03-30 1996-10-15 Toppan Printing Co Ltd Ｉｃカード
DE19640466B4 (de) * 1996-09-30 2006-06-14 Robert Bosch Gmbh Metallisches Trägerteil für elektronische Bauelemente oder Schaltungsträger und Verfahren zur Herstellung desselben

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
EP0766197A1 (fr) * 1995-04-13 1997-04-02 Dai Nippon Printing Co., Ltd. Carte et module de circuit integre

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9921132A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101636750A (zh) * 2007-03-23 2010-01-27 富士通株式会社 电子装置、安装有电子装置的电子设备、安装有电子装置的物品、电子装置的制造方法
CN101636750B (zh) * 2007-03-23 2012-08-08 富士通株式会社 电子装置、安装有电子装置的电子设备、安装有电子装置的物品、电子装置的制造方法

Also Published As

Publication number Publication date
EP0952545B1 (fr) 2005-08-31
US6166914A (en) 2000-12-26
EP0952545A1 (fr) 1999-10-27
JP3914620B2 (ja) 2007-05-16
JPH11115356A (ja) 1999-04-27
DE69831394T2 (de) 2006-06-01
WO1999021132A1 (fr) 1999-04-29
DE69831394D1 (de) 2005-10-06

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