EP1054467A1 - Coupleur directionnel à ligne microruban et méthode pour ajuster son facteur de couplage - Google Patents

Coupleur directionnel à ligne microruban et méthode pour ajuster son facteur de couplage Download PDF

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Publication number
EP1054467A1
EP1054467A1 EP00106481A EP00106481A EP1054467A1 EP 1054467 A1 EP1054467 A1 EP 1054467A1 EP 00106481 A EP00106481 A EP 00106481A EP 00106481 A EP00106481 A EP 00106481A EP 1054467 A1 EP1054467 A1 EP 1054467A1
Authority
EP
European Patent Office
Prior art keywords
coupling factor
stripline
potting
potting compound
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00106481A
Other languages
German (de)
English (en)
Other versions
EP1054467B1 (fr
Inventor
Roland Baur
Markus Laudin
Christian Vollmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMS Connector Systems GmbH
Original Assignee
IMS Connector Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IMS Connector Systems GmbH filed Critical IMS Connector Systems GmbH
Publication of EP1054467A1 publication Critical patent/EP1054467A1/fr
Application granted granted Critical
Publication of EP1054467B1 publication Critical patent/EP1054467B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips

Definitions

  • the invention relates to a method for setting the coupling factor a stripline coupler with at least two strip conductors arranged on a printed circuit board, one Device for carrying out the method and a stripline coupler with at least two on a circuit board arranged striplines.
  • Stripline couplers are made up of several striplines, the z. B. opposite each other on a circuit board are arranged.
  • the stripline can, for. B. attached in printed circuit technology on the circuit board Be conductor tracks.
  • Stripline couplers are used to transmit RF signals from one Strips to transfer to the other by coupling and are therefore used in multiple taps for RF signals, for example in community antenna systems, used to control those of a common antenna received signals on several Distribute to consumers.
  • For a perfect signal line and ensuring coupling is a precisely defined coupling factor within specified tolerances, the is difficult to achieve, however, because the PCB thickness, the thickness, the width and the spacing of the copper conductor tracks fluctuate greatly. The coupling factors therefore vary widely, so that a relatively large number of stripline couplers as a committee must be removed from production.
  • the procedure for setting the coupling factor solves this Task in that the stripline of the stripline coupler be potted with a potting compound.
  • a given coupling factor is used for a stripline coupler achieved by the stripline for Cast the coupling factor with a potting compound are.
  • the invention is based on the knowledge that through the Potting the stripline with a potting compound the electrical Properties of the stripline coupler changed and uses this to improve the electrical properties of the stripline coupler.
  • a stripline coupler to be potted with a potting compound VM K lead measuring lines ML to a network analyzer A, which is connected to a Control unit S is connected.
  • the control unit S controls A device V for potting via a control line SL of the stripline coupler K.
  • the network analyzer A sends test signals via the measuring lines ML to the stripline coupler to be potted with the potting compound VM K, which sits in a housing G, around which Measure coupling factor.
  • the control unit S controls the Potting device V, for example a potting machine, so that so much potting compound VM in the housing G, where the stripline coupler K is seated until the Network analyzer A measures the specified coupling factor.
  • the stripline coupler K is, so to speak, above the height H of the potting matched.
  • the process can preferably be used in the production of Insert stripline couplers.
  • the with the potting compound VM stripline couplers K to be cast become automatic connected to the network analyzer A via the measuring lines ML; controlled by the control unit S, the casting machine pours V so much potting compound VM in the housing G that the required Coupling factor is achieved.
  • the encapsulated stripline coupler is now separated from the measuring line ML, so that the next one can be connected.
  • control unit S By programming the control unit S to different Coupling factors can be used automatically for every stripline coupler be adjusted to another coupling factor.
  • the production is very quickly switchable to other coupling factors and adaptable at any time to the specific requirements of the customers.
  • a first advantage of the method according to the invention lies in that the stripline coupler on the assembly line with the Potting compound to be shed, and that the coupling factor by means of of the network analyzer is checked.
  • a second advantage can be seen in the fact that a preliminary test of the circuit boards with the strip lines arranged on it are omitted because the Stripline couplers can be adjusted automatically.
  • a third advantage is that the required Coupling factor is observed very precisely. The committee on unusable stripline couplers is therefore on reduced to a minimum.
  • Figure 1 is a strip line coupler K without potting compound shown.
  • the circuit board P on which the stripline is arranged are, sits in a housing G, which is for potting with the Potting compound is open at the top.
  • FIG. 2 shows a potted with the potting compound VM Stripline coupler K shown.
  • the housing G is with the potting compound VM up to a potting height H filled.
  • the potting compound VM can only above the circuit board P or provided below the circuit board P. his. After potting with the potting compound VM, the housing G completely closed.
  • the stripline coupler according to the invention has a number advantages.
  • stripline couplers are without additional during transport Measures are sufficient before shocks protected. They can therefore also be used in vehicles where they are subjected to strong mechanical stresses caused by vibrations or are exposed to vibrations, for example in one Helicopter.
  • the potting compound advantageously causes the Heat generated in the components on the circuit board better is dissipated. There are therefore much smaller components use, which leads to a reduction in costs and HF technology is also cheaper.
  • the potting compound can be made of transparent or opaque Material.
  • Damaged components can be found with a transparent potting compound well recognizable on the circuit board.
  • one opaque potting compound a certain copy protection because the structure of the circuit board is not visible.
  • Copy protection because the circuit arrangement only in connection works optimally with the sealing compound. Will the circuit arrangement reproduced without the sealing compound, this is how it works not because of the coupling factor because of the missing Potting compound is not adjusted to the specified value.
  • Casting resin is particularly suitable as a potting compound Heat conduction z.

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
EP00106481A 1999-05-19 2000-03-25 Coupleur directionnel à ligne microruban et méthode pour ajuster son facteur de couplage Expired - Lifetime EP1054467B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19922831A DE19922831C2 (de) 1999-05-19 1999-05-19 Verfahren zur Einstellung des Koppelfaktors eines Streifenleitungsrichtkopplers und Streifenleitungsrichtkoppler
DE19922831 1999-05-19

Publications (2)

Publication Number Publication Date
EP1054467A1 true EP1054467A1 (fr) 2000-11-22
EP1054467B1 EP1054467B1 (fr) 2006-11-22

Family

ID=7908431

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00106481A Expired - Lifetime EP1054467B1 (fr) 1999-05-19 2000-03-25 Coupleur directionnel à ligne microruban et méthode pour ajuster son facteur de couplage

Country Status (3)

Country Link
US (1) US6573806B1 (fr)
EP (1) EP1054467B1 (fr)
DE (2) DE19922831C2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7193323B2 (en) * 2003-11-18 2007-03-20 International Business Machines Corporation Electroplated CoWP composite structures as copper barrier layers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121925A (ja) * 1991-10-25 1993-05-18 Toko Inc マイクロストリツプアンテナの共振周波数調整方法
GB2284095A (en) * 1990-04-05 1995-05-24 Gen Electric Microwave component having tailored operating characteristics and method of tailoring
JPH08154009A (ja) * 1994-11-29 1996-06-11 Murata Mfg Co Ltd 方向性結合器及びその製造方法
JPH10190321A (ja) * 1996-12-20 1998-07-21 Nec Corp 誘電体絶縁膜を備えた結合素子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2934719A (en) * 1955-11-14 1960-04-26 Gen Electric High frequency couplers
US3478281A (en) * 1968-07-25 1969-11-11 Hewlett Packard Co Tem mode directional coupler having dielectric compensating means
US3742392A (en) * 1971-12-13 1973-06-26 Rca Corp Self loaded uneven power divider
US3768042A (en) * 1972-06-07 1973-10-23 Motorola Inc Dielectric cavity stripline coupler
US3886498A (en) * 1974-07-22 1975-05-27 Us Navy Wideband, matched three port power divider
JPH0769376B2 (ja) 1989-08-30 1995-07-31 マツダ株式会社 車両用多重伝送装置
US5012209A (en) * 1990-01-12 1991-04-30 Raytheon Company Broadband stripline coupler
US5410179A (en) * 1990-04-05 1995-04-25 Martin Marietta Corporation Microwave component having tailored operating characteristics and method of tailoring
US5227730A (en) * 1992-09-14 1993-07-13 Kdc Technology Corp. Microwave needle dielectric sensors
DE19503213C2 (de) 1995-02-02 1996-10-17 Becker Gmbh Verfahren zur gemeinsamen Übertragung von digitalen Quell- und Steuerdaten zwischen über Datenleitungen verbundenen Datenquellen und -senken
US6097271A (en) * 1997-04-02 2000-08-01 Nextronix Corporation Low insertion phase variation dielectric material
DE19723274C2 (de) 1997-06-04 2000-05-25 Harting Kgaa Datenübertragungssystem

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284095A (en) * 1990-04-05 1995-05-24 Gen Electric Microwave component having tailored operating characteristics and method of tailoring
JPH05121925A (ja) * 1991-10-25 1993-05-18 Toko Inc マイクロストリツプアンテナの共振周波数調整方法
JPH08154009A (ja) * 1994-11-29 1996-06-11 Murata Mfg Co Ltd 方向性結合器及びその製造方法
JPH10190321A (ja) * 1996-12-20 1998-07-21 Nec Corp 誘電体絶縁膜を備えた結合素子

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 17, no. 487 (E - 1427) 3 September 1993 (1993-09-03) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 10 31 October 1996 (1996-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 12 31 October 1998 (1998-10-31) *

Also Published As

Publication number Publication date
EP1054467B1 (fr) 2006-11-22
DE19922831C2 (de) 2002-01-24
US6573806B1 (en) 2003-06-03
DE50013762D1 (de) 2007-01-04
DE19922831A1 (de) 2001-06-28

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