EP1061783B2 - Substrat céramique-métal, notamment substrat multiple - Google Patents

Substrat céramique-métal, notamment substrat multiple Download PDF

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Publication number
EP1061783B2
EP1061783B2 EP00112228.2A EP00112228A EP1061783B2 EP 1061783 B2 EP1061783 B2 EP 1061783B2 EP 00112228 A EP00112228 A EP 00112228A EP 1061783 B2 EP1061783 B2 EP 1061783B2
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EP
European Patent Office
Prior art keywords
metal
ceramic
edge
weak spot
break line
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EP00112228.2A
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German (de)
English (en)
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EP1061783A2 (fr
EP1061783A3 (fr
EP1061783B1 (fr
Inventor
Jürgen Schulz-Harder Dr.-Ing.
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Rogers Germany GmbH
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Rogers Germany GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Definitions

  • the invention relates to a ceramic-metal substrate according to the preamble of claim 1.
  • Ceramic-metal substrates and in particular ceramic-copper substrates are known. These substrates are used for the manufacture of electrical circuits, in particular power circuits, and form the “circuit boards” there.
  • such substrates have a ceramic layer, which is provided with a metallization on both surface sides, of which e.g. the metallization on the top of the ceramic layer is structured, for example using an etching technique, in such a way that this metallization then forms the conductor tracks, contact areas, etc. required for the circuit.
  • a multiple substrate is known for efficient production of electrical circuits ( DE-PS 43 19 944 ) is known, in which at least two adjoining and integrally interconnected individual substrates are formed on a large-format ceramic plate or layer, which are each provided on at least one surface side of the ceramic layer with at least one metal surface and each connect via at least one predetermined breaking line provided in the ceramic layer , At these predetermined breaking lines, the multiple substrate is separated into the individual substrates, for example also after the components have been fitted, by breaking.
  • the disadvantage here is that, due to internal stresses in the ceramic-metal substrate, which result from the temperatures during the application of the metallizations and the different coefficients of thermal expansion, uncontrolled breaks can separate or break. Although such uncontrollable breaks occur only in 1 to 5% of the cases, the associated loss of production and damage are not insignificant, especially if the separation into the individual substrates takes place only after they have been assembled.
  • the metallizations are applied in hot processes, ie in processes in which not insignificant temperatures are used.
  • a ceramic for example on an aluminum oxide ceramic
  • DCB process Direct Copper Bond Technology
  • metal or copper foils or metal or copper sheets forming the metallization which have a layer or a coating (melting layer) of a chemical compound of the metal and a reactive gas, preferably oxygen, on their surface sides.
  • a reactive gas preferably oxygen
  • Patent 37 44 120 or in the DE-PS 23 19 854 The described process forms this layer or this coating (melting layer) a eutectic with a melting temperature below the melting temperature of the metal (for example copper), so that it can be connected to one another by placing the film on the ceramic and by heating all layers, by melting of the metal or copper essentially only in the area of the melting layer or oxide layer.
  • this layer or this coating a eutectic with a melting temperature below the melting temperature of the metal (for example copper)
  • Metal-ceramic substrates are also known (EP 0 827 198 A2 ) consisting of a ceramic layer, which is provided on its surface sides with the aid of the DCB method or the active solder method, each with a metal layer, of which the metal layer on one surface side of the ceramic layer has a greater thickness than the metal layer on the other surface side the ceramic layer.
  • a metal plate of greater thickness is provided with a stepped edge region on its circumference.
  • the object of the invention is to show a ceramic-metal substrate designed as a multiple substrate, which can be separated into individual substrates by breaking along the predetermined breaking lines without the risk of uncontrolled breaks.
  • a ceramic-metal substrate is formed according to claim 1.
  • the inventive design surprisingly significantly reduces uncontrolled breaks when cutting the ceramic-metal substrate (proven dimensions up to 75%).
  • multiple substrate also large card
  • multiple substrate consists essentially of a ceramic plate or ceramic layer 2, which is for example an aluminum nitride ceramic or an aluminum oxide ceramic and in the embodiment of the Figures 1-3 is provided on both sides of the surface with a structured metallization, specifically on the upper side with the metallization 3 and on the underside with the metallization 4.
  • the metallizations are realized in that in each case one metal foil, for example, a copper foil is connected flat to the ceramic layer 2.
  • the structuring of the metallizations 3 and 4 is carried out using the customary means known to those skilled in the art, for example using masking and etching techniques.
  • the metallization 3 is structured on the upper side in such a way that it forms a plurality of metal surfaces 3 ′ which are provided in a plurality of rows which each extend in the direction of the X axis and adjoin one another in the direction of the Y axis.
  • the multiple substrate 1 is formed with a rectangular circumferential line, specifically in such a way that the shorter circumferential sides extend in the direction of the X axis and the longer circumferential axes in the direction of the Y axis.
  • the metallization 3 is further structured such that it forms a rectangular or strip-shaped metal surface 3 "(along the edges 5) and 3" '(along the edges 6) along the edges 5 and 6, the two metal surfaces 3 " each extend essentially over the entire width (distance between the two edges 6) of the multiple substrate 1 and the two metal surfaces 3 ′′ end at both ends near a metal surface (3 ′′).
  • edges of the metal surface 3 lie parallel to the edges 5 and 6 and thus also in the X-axis or Y-axis.
  • the strip-shaped or elongated rectangular metal surfaces 3 "and 3" ' lie with their edges parallel to the edges 5 and 6 and thus in the direction of the X-axis or Y-axis.
  • All metal surfaces 3 ', 3 ", 3"' are each spaced from an adjacent metal surface, as will be discussed in more detail below.
  • scratches are formed in these predetermined breaking lines 7 and 8, in such a way that these predetermined breaking lines are not only between the individual metal surfaces 3 forming the individual substrates ', but also between the metal surfaces 3 "and adjacent metal surfaces 3' and 3" 'and between the metal surfaces 3 "' and adjacent metal surfaces 3 '.
  • the predetermined breaking line 7 extends in the direction of the X axis and the predetermined breaking lines 8 in Direction of the Y-axis, wherein in each case an external predetermined breaking line 7, which is adjacent to the metal surface 3 ", extends over the entire width of the multiple substrate 1 in the embodiment shown, ie also in the exposed areas of the top of the ceramic layer 2 between the metallizations 3 "and 3" '.
  • the two outer predetermined breaking lines 8 each extend between the respective metal surface 3 ′′ and the adjacent metal surfaces 3 ′ and, in the embodiment shown, each end at the metal surfaces 3 ′′ or at the outer predetermined breaking lines 7 running parallel to these metal surfaces.
  • the metallization 4 on the underside of the multiple substrate 1 is structured in such a way that this metallization forms a multiplicity of metal surfaces 4 ′ which correspond to the metal surfaces 3 ′ and each of which has a metal surface 4 ′ directly opposite a metal surface 3 ′.
  • the metal surfaces 4 ' are also provided in several rows in the same way as the metal surfaces 3' and their edges are parallel to the edges 5 and 6.
  • the metallization 4 forms metal surfaces 4 "and 4"'which correspond to the metal surfaces 3 "and 3 "'and of which each metal surface 4" is opposite a metal surface 3 "and each metal surface 4"' is opposite a metal surface 3 "'.
  • the metal surfaces 4 ', 4 "and 4"' are spaced apart from one another at the predetermined breaking lines 7 and 8, so that the underside of the ceramic layer 2 is exposed there.
  • the multiple substrate can be separated by breaking along the predetermined breaking lines 7 and 8, in particular after the structuring of the metal surfaces 3 'and after the assembly into individual substrates or into electrical components formed by these individual substrates, with first opening the multiple substrate for this purpose 1 is necessary in that the edges provided with the metal surfaces 3 "and 3" 'and 4 "and 4"' are broken off, specifically along the outer predetermined breaking lines 7 and 8.
  • This opening is only possible in a certain order, namely by first breaking off the outer edges having the metal surfaces 3 "and 4" and then the outer edges having the metal surfaces 3 "'and 4"'. Unintentional breaking of the multiple substrate 1 is effectively prevented by the metal surfaces 3 ", 4" and 3 "', 4"', which in particular also bridge the predetermined breaking line 7 and 8 running between the metal surfaces 3 '.
  • the Figure 3 shows a partial section through the multiple substrate of the Figure 1 , SE in this figure denotes the planes perpendicular to the XY plane, which include the predetermined breaking lines 7 and 8, respectively.
  • all metal surfaces 4 ' have a distance d1 from these center planes SE.
  • the edges of all metal surfaces 3 ', 3 "and 3"' have a distance of d2 from the adjacent plane SE running parallel to the respective edge. This applies both to the planes SE arranged parallel to the XZ plane and to the planes SE arranged parallel to the YZ plane.
  • the thickness of the metallization 3 and 4 is, for example, 0.15-1.0 mm.
  • the respective distance d2 is greater than or equal to d1, e.g. d1 is on the order of 1.0 to 0.05 mm. In the case of the multiple substrate 1, the distances d2 are greater than 1 mm.
  • the predetermined breaking lines 7 and 8 are generated, for example, by laser treatment, for example by laser scribing.
  • the predetermined breaking lines 7 and 8 can also be generated in other ways, for example by mechanical processing.
  • Uncontrolled fractures 9 of this type cause considerable damage, in particular if the multiple substrate is only separated after it has been fitted with components, since the corresponding individual substrates are then no longer usable.
  • the damage is determined not only by the cost of the individual substrate, but in particular also by the labor and machine costs for the assembly and the costs of the components with which such a defective individual substrate is equipped.
  • the value of an assembled single substrate is approximately 10 times that of an unpopulated single substrate.
  • the metal surface 4 ′ provided on the underside of the respective individual substrate extends as close as possible to the edge of this individual substrate, as is generally required for various reasons, are the metal surfaces 4 'on the underside along their edges with a weakening (edge or edge weakening) provided in the Figure 3 is generally designated 10.
  • This edge weakening 10 can, as will be explained in more detail below, be implemented in different ways, but is in any case designed in such a way that the metal volume or the amount of metal per unit volume is reduced in the area of this edge weakening 10.
  • the width of the edge weakening is in the Figure 4 denoted by a and is in the order of magnitude between 0.2 and 6 mm.
  • the reduction in the amount of metal or the metal volume is such that the amount of metal at the edge weakening 10 is only 10 to 80% of the amount of metal in a metal surface 4 'without edge weakening, in each case based on a specific volume unit.
  • the edge weakening 10 is also provided on the metal surfaces 4 "and 4"', namely along the edges adjacent to the predetermined breaking lines 7 and 8, ie along the planes SE.
  • this edge weakening 10 makes it possible to provide the metal surfaces 4 'with only a small distance d1 from the planes SE and yet to greatly reduce uncontrolled breaks 9, so that overall there is a reduction in rejects compared to conventional multiple substrates is detectable by 75%. Edge weakenings on the metal surfaces 3 ', 3 "and 3"' corresponding to the edge weakenings 10 are then necessary or at least useful if the distances d2 are less than 1 mm.
  • FIGS. 6 - 15 show as examples different possibilities for the formation of the edge weakening 10.
  • An example of an edge weakening 10a is shown, which is formed by the fact that the edges of the metal surfaces 4 ', 4 ", 4'" adjacent to the planes SE are beveled, the oblique edge surface 11 formed here being at an angle ⁇ , for example is less than 45 °.
  • the Figures 6 and 7 show an edge weakening 10b, which is formed in that rows of hole-like depressions 12 are formed along the edges of the metal surfaces 4 ', 4 ", 4"' adjacent to the planes SE, these depressions 12 reaching to the underside of the ceramic layer 2 and for example, have a diameter of about 0.4 to 0.5 mm.
  • the depressions 12 form a simple row of holes.
  • the depressions 12 have a diameter of approximately 0.5 mm.
  • the width a of the edge weakening 10b, within which the (width) also contains the depressions 12, is, for example, 0.8 mm, specifically at a distance d1 of approximately 0.5 mm.
  • the width a is defined here such that a is the maximum distance that the edges of the depressions 12 have from the adjacent edge of the metallization.
  • the Figure 8 shows a possible embodiment in which the edge weakening 10c is formed by the outer, ie the edges of the respective metallization 4 ', 4 ", 4'" immediately adjacent recesses 12 and further inner recesses 13.
  • the latter are each offset from the recesses 12 and, in addition to the outer row of holes (recesses 12), form an inner row of holes (recesses 13), both the recesses 12 and the recesses 13 reaching to the underside of the ceramic layer 2.
  • the diameter of the depressions 13 is smaller than the diameter of the depressions 12.
  • the width a of the edge weakening 10c, within which (width a) all the depressions 12 and 13 are located, is approximately 1.4 mm, the diameter of the outer recesses is about 0.6 mm and the inner recesses is about 0.4 mm.
  • the width a is defined here such that a is the maximum distance that the edges of the depressions 13 have from the adjacent edge of the metallization.
  • the Figure 9 shows as a further possibility an edge weakening 10d, which is formed in that the edges or edges of the metal surfaces 4 ', 4 "and 4"' adjacent to the planes SE are provided with depressions 14 which open towards these edges, so that edges running in a meandering manner result.
  • the depressions 14 in turn extend to the underside of the ceramic layer 2.
  • edge weakenings 10b - 10d there is also the possibility of designing all or only some of the depressions 12, 13 or 14 in such a way that they do not reach the underside of the ceramic layer 2, but rather a remainder forming the bottom of the respective depression the metallization 4 remains.
  • the Figures 10 and 11 show, as a non-inventive example, an edge weakening 10e which is formed by a gradation 15 of the edges of the metal surfaces 4 ', 4 ", 4"' adjacent to the planes SE, ie the thickness of the material of the respective metal surface increases within the width a of the edge weakening 10e stepwise, namely when the Figures 9 and 10 in one stage. In principle, several stages 15 can also be provided.
  • FIGS 12 and 13 show as a further possible embodiment an edge weakening 10f, which is formed in that the metal surfaces 4 ', 4 "and 4"' are each provided with a groove-like recess 16, which runs along the edges of the planes SE and adjacent in these planes Metal surfaces extends, wherein the recess 16 on the metal surfaces 4 'is designed as a self-contained groove.
  • edge weakenings 10a-10f can also be combined, specifically on one side of the multiple substrate 1 or on several sides. Furthermore, it goes without saying that edge weakenings 10 are of course only provided where corresponding metal surfaces 3 ', 3 ", 3"' or 4 ', 4 ", 4"' are also provided.
  • FIGS 14 and 15 show in representations similar to Figures 1 and 3 as a further possible embodiment, a multiple substrate 1a, which differs from the multiple substrate 1 essentially only in that the metal surfaces 4 "and 4"'provided on the edges 5 and 6 are not present, but only the metal surfaces 3 "and 3"' at the top of the multiple substrate.
  • the Figure 16 shows a multiple substrate 1b, which corresponds, for example, to multiple substrate 1 or 1a, but in which, however, the metal surfaces 3 'provided on the upper side are structured to form conductor tracks, contact areas, etc. for the individual substrates, as is shown in this figure with the numbers 17, 18 and 19 is indicated schematically.
  • Components in the form of semiconductor chips 20 are applied to the structured surface areas 18 and are electrically connected to the associated structured areas 17 and 18 forming electrical contact surfaces or connections by means of wire bonds.
  • all metal surfaces 3' are structured in this way and equipped with components, so that a large card or a multiple-conductor plate or a populated multiple substrate is obtained, which is only after the assembly into the individual substrates or into the individual assemblies or circuits formed by them is separated.
  • edge weakening 10 on the metal surfaces 4 ', 4 "or 4"' (of course only to the extent that these metal surfaces are present) and, if appropriate, also on the metal surfaces 3 ', 3 "and 3"' along all of them a plane SE of adjacent edges or edges.
  • the Figure 17 shows in a representation similar to that Figure 2 as a further possibility a multiple substrate 1c, at the edge or edge weakenings 10 are provided only along part of the edges of the metal surfaces 4 ', 4 "or 4"' and possibly also only on part of the edges of the metal surfaces 3 ', 3 "and 3"', specifically again, of course, only if the metal surface in question is actually present.
  • the Indian Figure 17 The embodiment shown is based on the knowledge that wild breaks 9 preferably occur if, when the multiple substrate is separated or broken into individual substrates, the respective breaking process breaks along a predetermined breaking line 7 or 8, which extends over a plurality of individual substrates. If, for example, the multiple substrate 1c is separated according to the rule or breaking sequence specified below, then at those edges of the metal surfaces 3 'which are adjacent to the predetermined breaking lines 8 running between these metal surfaces 3' or the planes SE, which are those between the metal surfaces 4 ' include the predetermined breaking line 8, an edge weakening 10 are dispensed with. The same applies analogously to the metal surfaces 3 ', provided that an edge weakening is necessary or sensible there.
  • edges of the metal surfaces 4 ', 4 ", 4"' which (edges) are each provided with an edge weakening 10, are additionally hatched.
  • the edges, which do not have an edge weakening 10, are shown as a straight line.
  • the metal surfaces 4 ' are not provided with the edge weakening 10 at one edge, which are adjacent to a group of predetermined breaking lines running between these metal surfaces, namely the predetermined breaking lines 8 extending in the Y-axis, but at all others edge areas.
  • edge weakenings 10 are then definitely required along the predetermined breaking lines 8 running between the individual substrates, while there is no need for edge weakening along the predetermined breaking lines 7 running between the individual substrates.
  • breaking should take place at the shortest possible breaking lines, i.e. in the case of a rectangular design of the multiple substrate with the greater length in the direction of the Y-axis and the shorter width in the X-axis, the strips are expediently broken along the shorter predetermined breaking lines 8.

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Claims (11)

  1. Substrat en céramique-métal à titre de substrat mixte comprenant une plaque ou une couche de céramique (2) qui forme au moins deux zones de substrat se raccordant l'une à l'autre et reliées l'une à l'autre en une seule pièce, qui sont munies respectivement sur au moins un côté superficiel de la couche de céramique (2) d'au moins une surface métallique (3', 3", 3"'; 4', 4", 4"') obtenue par application d'une couche métallique ou d'une feuille mince métallique au moyen du procédé DCB ou à brasage actif, et qui se raccordent l'une à l'autre respectivement via au moins une ligne de rupture (7, 8) prévue dons la couche de céramique, une individualisation de zones de substrat en substrats individuels étant prévue par rupture le long de la ligne de rupture (7, 8),caractérisé en ce que
    ladite au moins une surface métallique (3', 3", 3"'; 4', 4", 4"') des zones de substrat présente, à un bord voisin d'une ligne de rupture (7,8) et s'étendant le long de cette ligne de rupture (7,8), au moins un affaiblissement marginal (10) sous une forme telle que la quantité du métal formant ladite au moins une surface métallique (3', 3", 3"'; 4', 4", 4"') soit réduite de 10 à 80 % par unité de volume, et de ce fait par rapport à la quantité spécifique de métal que présente la surface métallique en dehors de l'affaiblissement marginal (10), la largeur (a) de l'affaiblissement marginal étant comprise entre 0,2 et 6 mm et l'affaiblissement marginal étant formé par des renfoncements ou des évidements (12, 13, 14, 16) dans la matière de la surface métallique.
  2. Substrat en céramique-métal selon la revendication 1 caractérisé en ce que, au moins sur un côté superficiel du substrat en céramique-métal, les bords des surfaces métalliques (3', 3", 3"' 4', 4", 4"') respectivement voisins d'une ligne de rupture (7, 8) sont munis d'un affaiblissement marginal (10).
  3. Substrat en céramique-métal selon la revendication 1 ou 2, caractérisé en ce que les surfaces métalliques des zones de substrat sont formées par au moins une métallisation structurée (3, 4) sur au moins un côté superficiel de la couche de céramique (2).
  4. Substrat en céramique-métal selon l'une des revendications 1 à 3, caractérisé par au moins une surface métallique (3", 3"' ; 4", 4"') de forme rectangulaire ou en forme de bande qui s'étend, sur au moins un côté superficiel de la couche de céramique (2), au moins le long d'un bord (5, 6) du substrat en céramique-métal, ainsi que par au moins une ligne de rupture (7,8) entre cette surface métallique externe et des zones de substrat voisines, ladite au moins une surface métallique externe (3", 3"' ; 4", 4"') le long de la ligne de rupture (7, 8) présentant également un affaiblissement marginal (10).
  5. Substrat en céramique-métal selon l'une des revendications 1 à 4, caractérisé en ce que le bord présentant l'affaiblissement marginal présente un écart marginal (d1, d2), par rapport à la ligne de rupture voisine (7, 8) ou par rapport au plan (SE) de cette ligne de rupture, qui est inférieur à 1 mm.
  6. Substrat en céramique-métal selon l'une des revendications 1 à 5, caractérisé en ce que les renfoncements ou les évidements sont réalisés chaque fois en continu, c'est-à-dire jusqu'à atteindre le côté superficiel de la couche de céramique (2) voisin de la surface métallique, ou bien sont réalisés de telle sorte que du métal de la surface métallique subsiste entre les côtés superficiels de la couche de céramique (2) voisins de la surface métallique respective.
  7. Substrat en céramique-métal selon l'une des revendication 1 à 6, caractérisé en ce que l'affaiblissement marginal est formé par une multitude de renfoncements (12,13) en forme de trous qui présentent un diamètre d'environ 0,5 à 0,6 mm.
  8. Substrat en céramique-métal selon l'une des revendications 1 à 7, caractérisé en ce que l'affaiblissement marginal est formé par une multitude de renfoncements (12, 13) en forme de trous qui sont disposés de façon à obtenir une série de trous, et en ce que les renfoncements (12) formant une simple série de trous présentent un diamètre de 0,5 mm, et de ce fait avec une largeur de l'affaiblissement marginal d'environ 0,8 mm et avec une distance du bord par rapport à la ligne de rupture d'environ 0,5 mm.
  9. Substrat en céramique-métal selon l'une des revendications 1 à 7, caractérisé en ce que l'affaiblissement marginal est formé por une multitude de renfoncements (12, 13) en forme de trous, qui sont disposés de façon à obtenir plusieurs séries de trous (12, 13), et en ce que les renfoncements (12, 13) respectifs de la série de trous située à l'extérieur présentent un diamètre qui est supérieur au diamètre des renfoncements de la série de trous située à l'intérieur.
  10. Substrat en céramique-métal selon l'une des revendication 1 à 6, caractérisé en ce que l'affaiblissement marginal est formé par un renfoncement (16) en forme de rainure ou, au moins dans une zone partielle, par un gradin (15) ou par un chanfrein (11l) du bord correspondant, par exemple par un chanfrein qui forme avec le plan de la couche de céramique (2) un angle qui est inférieur à 45°.
  11. Substrat en céramique-métal selon l'une des revendications 1 à 10, caractérisé en ce qu'il est prévu au moins une surface métallique (3', 4') dans les zones de substrat sur les deux côtés superficiels respectifs de la couche de céramique (2), et en ce que les surfaces métalliques (4') présentent sur un premier des deux côtés superficiels un écart marginal (d1), par rapport à la ligne de rupture voisine (7, 8) ou par rapport au plan (SE) de cette dernière, qui est inférieur a l'écart marginal (d2) des surfaces métalliques (3') sur le deuxième côté des deux côtés superficiels du substrat en céramique-métal.
EP00112228.2A 1999-06-14 2000-06-07 Substrat céramique-métal, notamment substrat multiple Expired - Lifetime EP1061783B2 (fr)

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DE19927046A DE19927046B4 (de) 1999-06-14 1999-06-14 Keramik-Metall-Substrat als Mehrfachsubstrat
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KR102844112B1 (ko) * 2022-08-10 2025-08-07 앱솔릭스 인코포레이티드 코어기판, 기판 및 반도체 패키징 기판의 용도
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DE102022134661A1 (de) 2022-12-23 2024-07-04 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats, Keramikelement sowie Metallschicht für ein solches Verfahren und Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren
DE102023103508A1 (de) 2023-02-14 2024-08-14 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren
DE102023103509A1 (de) 2023-02-14 2024-08-14 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren
DE102023103850A1 (de) 2023-02-16 2024-08-22 Rogers Germany Gmbh Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats
DE102023113513A1 (de) 2023-05-24 2024-11-28 Rogers Germany Gmbh Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats
DE102023113512A1 (de) 2023-05-24 2024-11-28 Rogers Germany Gmbh Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats
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Also Published As

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EP1061783A2 (fr) 2000-12-20
EP1061783A3 (fr) 2005-11-30
DE19927046B4 (de) 2007-01-25
US6638592B1 (en) 2003-10-28
EP1061783B1 (fr) 2013-11-20
DE19927046A1 (de) 2000-12-28

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