EP1067589A3 - Vorrichtung und Verfahren zur Ausrichtung von einem Halbleitersubstrat - Google Patents

Vorrichtung und Verfahren zur Ausrichtung von einem Halbleitersubstrat Download PDF

Info

Publication number: EP1067589A3
Authority: EP; European Patent Office
Prior art keywords: semiconductor substrate; units; aligner apparatus; holding; spindle units
Prior art date: 1999-07-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

EP00202403A

Other languages

English (en)

French (fr)

Other versions

EP1067589A2 (de

Inventor

Takayuki Yamagishi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ASM Japan KK

Original Assignee

ASM Japan KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-07-08

Filing date

2000-07-06

Publication date

2006-07-12

2000-07-06 Application filed by ASM Japan KK filed Critical ASM Japan KK

2001-01-10 Publication of EP1067589A2 publication Critical patent/EP1067589A2/de

2006-07-12 Publication of EP1067589A3 publication Critical patent/EP1067589A3/de

Status Ceased legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
- H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Registering Or Overturning Sheets (AREA)

EP00202403A 1999-07-08 2000-07-06 Vorrichtung und Verfahren zur Ausrichtung von einem Halbleitersubstrat Ceased EP1067589A3 (de)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP19508799		1999-07-08
JP19508799		1999-07-08
JP21734899		1999-07-30
JP21734899A JP3245833B2 (ja)	1999-07-08	1999-07-30	半導体基板アライナー装置および方法

Publications (2)

Publication Number	Publication Date
EP1067589A2 EP1067589A2 (de)	2001-01-10
EP1067589A3 true EP1067589A3 (de)	2006-07-12

Family

ID=26508916

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP00202403A Ceased EP1067589A3 (de)	1999-07-08	2000-07-06	Vorrichtung und Verfahren zur Ausrichtung von einem Halbleitersubstrat

Country Status (5)

Country	Link
US (1)	US6454516B1 (de)
EP (1)	EP1067589A3 (de)
JP (1)	JP3245833B2 (de)
KR (1)	KR20010039706A (de)
TW (1)	TW478088B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10121010B4 (de) *	2001-04-28	2007-06-28	Infineon Technologies Ag	Halter für Halbleiterwafer in einer Bürstenreinigungsanlage
KR20030021653A (ko) *	2001-09-07	2003-03-15	삼성전자주식회사	웨이퍼 스테이지 및 이를 이용한 베이크 장치
US7256132B2 (en) *	2002-07-31	2007-08-14	Applied Materials, Inc.	Substrate centering apparatus and method
US7372250B2 (en)	2003-02-20	2008-05-13	Applied Materials, Inc.	Methods and apparatus for determining a position of a substrate relative to a support stage
JP4620365B2 (ja) *	2003-02-20	2011-01-26	アプライドマテリアルズインコーポレイテッド	支持ステージに対して基板を位置決めするアライメント装置および基板較正システム
US7104535B2 (en)	2003-02-20	2006-09-12	Applied Materials, Inc.	Methods and apparatus for positioning a substrate relative to a support stage
US7151981B2 (en)	2003-02-20	2006-12-19	Applied Materials, Inc.	Methods and apparatus for positioning a substrate relative to a support stage
US7499767B2 (en)	2003-02-20	2009-03-03	Applied Materials, Inc.	Methods and apparatus for positioning a substrate relative to a support stage
KR100814448B1 (ko) *	2003-12-12	2008-03-17	한미반도체 주식회사	반도체 패키지 건조시스템
JP4467367B2 (ja) *	2004-06-22	2010-05-26	大日本スクリーン製造株式会社	基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
JP4410063B2 (ja) *	2004-09-06	2010-02-03	東京エレクトロン株式会社	基板処理装置
US7556334B2 (en)	2004-11-04	2009-07-07	Applied Materials, Inc.	Methods and apparatus for aligning print heads
US9202725B2 (en) *	2006-07-24	2015-12-01	Planar Semiconductor, Inc.	Holding and rotary driving mechanism for flat objects
KR100872267B1 (ko) *	2007-07-23	2008-12-05	주식회사 윌비에스엔티	웨이퍼 토글 롤러 결합구조
JP5723612B2 (ja) *	2011-01-28	2015-05-27	リンテック株式会社	板状部材の支持装置
CN103192463A (zh) *	2012-01-05	2013-07-10	沈阳新松机器人自动化股份有限公司	透光夹持式预对准机
CN103206591B (zh) *	2012-01-11	2016-10-05	昆山允升吉光电科技有限公司	电动载物台定位方法
CN103985662B (zh) *	2014-04-24	2017-07-04	京东方科技集团股份有限公司	一种对位装置及对位平台
TWM549447U (zh) *	2016-11-23	2017-09-21	辛耘企業股份有限公司	基板對準及檢測裝置與基板處理機台
CN110729216A (zh) *	2019-10-21	2020-01-24	华虹半导体(无锡)有限公司	晶圆位置检测装置、晶圆位置检测方法
KR102308346B1 (ko) *	2021-01-12	2021-10-01	(주)볼타오토메이션	웨이퍼의 센터링 장치
CN112967995B (zh) *	2021-02-01	2022-12-30	泉芯集成电路制造(济南)有限公司	一种芯片夹具、芯片清洗装置及芯片刻蚀装置
WO2024233209A1 (en) *	2023-05-10	2024-11-14	Jabil Inc.	Apparatus, system and method for aligning flat panels and film frames
TWD233403S (zh) *	2023-07-13	2024-09-01	韓商維比Ｓ＆Ｔ股份有限公司 (南韓)	晶圓撥動滾輪
TWD231773S (zh) *	2023-07-13	2024-06-11	韓商維比Ｓ＆Ｔ股份有限公司 (南韓)	晶圓撥動滾輪

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5052886A (en) *	1988-12-20	1991-10-01	Texas Instruments Incorporated	Semiconductor wafer orientation device
JPH04212436A (ja) *	1990-04-06	1992-08-04	Nikon Corp	円形基板の位置決め装置および方法
JPH09246357A (ja) *	1996-03-04	1997-09-19	Zetetsuku Kk	半導体ウエハの一斉方向合わせ方法及びその装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2957252A (en) *	1959-12-11	1960-10-25	William A Pain	Globe support and orienting means
US3389778A (en) *	1967-04-20	1968-06-25	Heisler Company	Apparatus for orienting eared containers
US3972424A (en) *	1973-03-12	1976-08-03	The Computervision Corporation	Automatic wafer loading and pre-alignment system
JPS50122879A (de) *	1974-03-13	1975-09-26
US4242038A (en) *	1979-06-29	1980-12-30	International Business Machines Corporation	Wafer orienting apparatus
JPS5666036A (en) *	1979-11-05	1981-06-04	Canon Inc	Wafer positioner
US4377038A (en) *	1981-02-19	1983-03-22	Fmc Corporation	Truck wheel clamp with floating spindle plate
JPH0610775B2 (ja) *	1984-12-05	1994-02-09	株式会社ニコン	円形基板の位置決め装置
US4887904A (en) *	1985-08-23	1989-12-19	Canon Kabushiki Kaisha	Device for positioning a semi-conductor wafer
JPS6386447A (ja) *	1986-09-30	1988-04-16	Nippon Seiko Kk	露光装置用被露光部材位置決め装置
US5085558A (en) *	1987-02-09	1992-02-04	Svg Lithography Systems, Inc.	Wafer handling system
EP0350752B1 (de) *	1988-07-15	1993-10-13	Balzers Aktiengesellschaft	Haltevorrichtung für eine Scheibe sowie Anwendung derselben
ZA905487B (en)	1989-07-18	1991-06-26	Petrus Joubert Van Der Walt	Provision of stereoscopic images
US5385186A (en) *	1993-11-12	1995-01-31	Forest Products Machinery, Inc.	Sharp chain charger
US5566466A (en) *	1994-07-01	1996-10-22	Ontrak Systems, Inc.	Spindle assembly with improved wafer holder
US6003185A (en) *	1994-07-15	1999-12-21	Ontrak Systems, Inc.	Hesitation free roller
US5551829A (en) *	1995-10-11	1996-09-03	H-Square Corporation	Notch finder having a flexible alignment rod
US5851041A (en) *	1996-06-26	1998-12-22	Ontrak Systems, Inc.	Wafer holder with spindle assembly and wafer holder actuator
US5662452A (en) *	1996-08-26	1997-09-02	H-Square Corporation	Apparatus and method of aligning notches using a free-floating rod
US5853284A (en) *	1996-09-24	1998-12-29	Kaijo Corporation	Notched wafer aligning apparatus
US5880479A (en) *	1996-10-25	1999-03-09	Vanguard International Semiconductor Corporation	Wafer aligner apparatus using different diameter rollers
ATE242064T1 (de) *	1998-02-14	2003-06-15	Lam Res Corp	Vorrichtung zum laden von halbleiterscheiben
KR100343153B1 (ko)	1998-03-30	2002-09-18	삼성전자 주식회사	광기록재생장치
TW412817B (en) *	1998-06-19	2000-11-21	Matsushita Electric Industrial Co Ltd	A bump bonding apparatus and method
FR2780961B1 (fr) *	1998-07-10	2000-10-13	Dubuit Mach	Dispositifs de chargement et dechargement pour machine d'impression
US6270307B1 (en) *	1999-01-25	2001-08-07	Chartered Semiconductor Manufacturing Company	Method for aligning wafers in a cassette
US6357996B2 (en) *	1999-05-14	2002-03-19	Newport Corporation	Edge gripping specimen prealigner
JP3116039U (ja)	2005-08-23	2005-11-24	岡本株式会社	靴下

1999
- 1999-07-30 JP JP21734899A patent/JP3245833B2/ja not_active Expired - Fee Related
2000
- 2000-06-23 TW TW089112463A patent/TW478088B/zh not_active IP Right Cessation
- 2000-07-06 EP EP00202403A patent/EP1067589A3/de not_active Ceased
- 2000-07-07 KR KR1020000038769A patent/KR20010039706A/ko not_active Ceased
- 2000-07-10 US US09/612,739 patent/US6454516B1/en not_active Expired - Fee Related

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5052886A (en) *	1988-12-20	1991-10-01	Texas Instruments Incorporated	Semiconductor wafer orientation device
JPH04212436A (ja) *	1990-04-06	1992-08-04	Nikon Corp	円形基板の位置決め装置および方法
JPH09246357A (ja) *	1996-03-04	1997-09-19	Zetetsuku Kk	半導体ウエハの一斉方向合わせ方法及びその装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 554 (E - 1293) 25 November 1992 (1992-11-25) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 01 30 January 1998 (1998-01-30) *

Also Published As

Publication number	Publication date
TW478088B (en)	2002-03-01
US6454516B1 (en)	2002-09-24
JP3245833B2 (ja)	2002-01-15
EP1067589A2 (de)	2001-01-10
KR20010039706A (ko)	2001-05-15
JP2001077179A (ja)	2001-03-23

Legal Events

Date	Code	Title	Description
2000-11-24	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2001-01-10	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
2001-01-10	AX	Request for extension of the european patent	Free format text: AL;LT;LV;MK;RO;SI
2006-06-09	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
2006-07-12	AK	Designated contracting states	Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
2006-07-12	AX	Request for extension of the european patent	Extension state: AL LT LV MK RO SI
2007-02-28	17P	Request for examination filed	Effective date: 20070111
2007-03-21	AKX	Designation fees paid	Designated state(s): DE
2007-04-18	17Q	First examination report despatched	Effective date: 20070319
2008-03-14	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED
2008-04-16	18R	Application refused	Effective date: 20071207

Publication	Publication Date	Title
EP1067589A3 (de)	2006-07-12	Vorrichtung und Verfahren zur Ausrichtung von einem Halbleitersubstrat
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