EP1184403A3 - Résine polyimidesiloxane, procédé de préparation et composition de résine polyimidesiloxane - Google Patents

Résine polyimidesiloxane, procédé de préparation et composition de résine polyimidesiloxane Download PDF

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Publication number
EP1184403A3
EP1184403A3 EP01115363A EP01115363A EP1184403A3 EP 1184403 A3 EP1184403 A3 EP 1184403A3 EP 01115363 A EP01115363 A EP 01115363A EP 01115363 A EP01115363 A EP 01115363A EP 1184403 A3 EP1184403 A3 EP 1184403A3
Authority
EP
European Patent Office
Prior art keywords
silicone resin
polyimide silicone
cyclic siloxane
resin composition
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01115363A
Other languages
German (de)
English (en)
Other versions
EP1184403A2 (fr
EP1184403B1 (fr
Inventor
Michihiro c/o Silicone Denshi Zairyo Sugo
Hideto c/o Silicone Denshi Zairyo Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP1184403A2 publication Critical patent/EP1184403A2/fr
Publication of EP1184403A3 publication Critical patent/EP1184403A3/fr
Application granted granted Critical
Publication of EP1184403B1 publication Critical patent/EP1184403B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
EP01115363A 2000-06-29 2001-06-26 Résine polyimidesiloxane, procédé de préparation et composition de résine polyimidesiloxane Expired - Lifetime EP1184403B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000196842A JP2002012666A (ja) 2000-06-29 2000-06-29 ポリイミドシリコーン樹脂、その製造方法およびその組成物
JP2000196842 2000-06-29

Publications (3)

Publication Number Publication Date
EP1184403A2 EP1184403A2 (fr) 2002-03-06
EP1184403A3 true EP1184403A3 (fr) 2003-03-19
EP1184403B1 EP1184403B1 (fr) 2006-11-15

Family

ID=18695274

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01115363A Expired - Lifetime EP1184403B1 (fr) 2000-06-29 2001-06-26 Résine polyimidesiloxane, procédé de préparation et composition de résine polyimidesiloxane

Country Status (5)

Country Link
US (1) US6538093B2 (fr)
EP (1) EP1184403B1 (fr)
JP (1) JP2002012666A (fr)
KR (1) KR100765710B1 (fr)
DE (1) DE60124469T2 (fr)

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WO2001057112A1 (fr) * 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Resine polyimide adhesive et stratifie adhesif
JP3669429B2 (ja) * 2001-03-27 2005-07-06 信越化学工業株式会社 電極用組成物及び電極材
KR100570128B1 (ko) * 2002-07-03 2006-04-11 경상대학교산학협력단 폴리이미드 실리콘 수지, 그의 용액 조성물 및 그로부터제조된 폴리이미드 실리콘 수지 피막
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
JP2004099638A (ja) 2002-09-04 2004-04-02 Shin Etsu Chem Co Ltd イミドシリコーン樹脂およびその製造方法
JP4204435B2 (ja) * 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
JP2004296932A (ja) * 2003-03-27 2004-10-21 Nippon Chemicon Corp 電解コンデンサ用封口体及びその製造方法
JP2004296931A (ja) * 2003-03-27 2004-10-21 Nippon Chemicon Corp 固体電解コンデンサとその製造方法
JP2004296933A (ja) * 2003-03-27 2004-10-21 Nippon Chemicon Corp 電解コンデンサ
JP3952194B2 (ja) * 2003-06-02 2007-08-01 信越化学工業株式会社 シロキサン共重合体及びその製造方法並びにそれを用いた熱硬化性樹脂組成物
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US7220490B2 (en) * 2003-12-30 2007-05-22 E. I. Du Pont De Nemours And Company Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
JP4280177B2 (ja) 2004-02-25 2009-06-17 日東電工株式会社 基板処理装置の除塵部材
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
JP4490866B2 (ja) * 2005-05-09 2010-06-30 信越化学工業株式会社 電気化学キャパシタ用電極、それに用いる組成物及び前記電極の製造方法、並びに該電極を用いた電気化学キャパシタ
JP4737447B2 (ja) * 2007-06-01 2011-08-03 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂及びポリイミド樹脂組成物
WO2009025283A1 (fr) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation Nouvelle résine de polyimide et composition de résine de polyimide photosensible
WO2009025319A1 (fr) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible
JP5045924B2 (ja) * 2007-11-19 2012-10-10 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
KR100969487B1 (ko) * 2010-02-05 2010-07-14 한밭대학교 산학협력단 이어폰 내장형 휴대폰
JP5385247B2 (ja) * 2010-12-03 2014-01-08 信越化学工業株式会社 ウエハモールド材及び半導体装置の製造方法
US11497681B2 (en) 2012-02-28 2022-11-15 Corning Incorporated Glass articles with low-friction coatings
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CN107540242B (zh) 2012-02-28 2020-11-20 康宁股份有限公司 具有低摩擦涂层的玻璃制品
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EP0349010A1 (fr) * 1988-06-30 1990-01-03 Nippon Steel Chemical Co., Ltd. Copolymères de polyimide
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US4497922A (en) * 1982-06-11 1985-02-05 Hitachi Chemical Company, Ltd. Compositions of materials for forming protective film in semiconductor device
EP0349010A1 (fr) * 1988-06-30 1990-01-03 Nippon Steel Chemical Co., Ltd. Copolymères de polyimide
US5041513A (en) * 1989-05-31 1991-08-20 Shin-Etsu Chemical Co., Ltd. Polyimide resin compositions

Also Published As

Publication number Publication date
EP1184403A2 (fr) 2002-03-06
US6538093B2 (en) 2003-03-25
EP1184403B1 (fr) 2006-11-15
DE60124469T2 (de) 2007-09-20
DE60124469D1 (de) 2006-12-28
KR20020002269A (ko) 2002-01-09
JP2002012666A (ja) 2002-01-15
KR100765710B1 (ko) 2007-10-11
US20020016438A1 (en) 2002-02-07

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