EP1273682A4 - Forage de trou par laser dans une t le de cuivre - Google Patents

Forage de trou par laser dans une t le de cuivre

Info

Publication number
EP1273682A4
EP1273682A4 EP01917661A EP01917661A EP1273682A4 EP 1273682 A4 EP1273682 A4 EP 1273682A4 EP 01917661 A EP01917661 A EP 01917661A EP 01917661 A EP01917661 A EP 01917661A EP 1273682 A4 EP1273682 A4 EP 1273682A4
Authority
EP
European Patent Office
Prior art keywords
copper foil
laser
hole drilling
laser hole
drilling copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01917661A
Other languages
German (de)
English (en)
Other versions
EP1273682A1 (fr
Inventor
Masaru Sakamoto
Kouji Kitano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000103505A external-priority patent/JP3330925B2/ja
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of EP1273682A1 publication Critical patent/EP1273682A1/fr
Publication of EP1273682A4 publication Critical patent/EP1273682A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Cette invention a trait à une tôle de cuivre dans laquelle a été foré un trou par laser. Dans le cadre de ce procédé, au moins la surface de pénétration du laser dans la tôle de cuivre est recouverte d'au moins un type de métal comprenant du cuivre afin de former sur ladite surface un revêtement dont les particules ont une taille comprise entre 0,01 et 3 νm. Cette tôle de cuivre, facile usiner au laser, se prête bien à la fabrication de trous de connexion intercouche de petit diamètre. Il est possible d'obtenir la tôle de cuivre selon l'invention en apportant des améliorations à la surface d'une tôle de cuivre au moment de la production d'une carte à circuit imprimé.
EP01917661A 2000-04-05 2001-03-30 Forage de trou par laser dans une t le de cuivre Withdrawn EP1273682A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000103505 2000-04-05
JP2000103505A JP3330925B2 (ja) 2000-04-05 2000-04-05 レーザー穴開け用銅箔
PCT/JP2001/002706 WO2001077420A1 (fr) 2000-04-05 2001-03-30 Forage de trou par laser dans une tôle de cuivre

Publications (2)

Publication Number Publication Date
EP1273682A1 EP1273682A1 (fr) 2003-01-08
EP1273682A4 true EP1273682A4 (fr) 2003-04-16

Family

ID=26345056

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01917661A Withdrawn EP1273682A4 (fr) 2000-04-05 2001-03-30 Forage de trou par laser dans une t le de cuivre

Country Status (3)

Country Link
EP (1) EP1273682A4 (fr)
CN (1) CN1388841A (fr)
WO (1) WO2001077420A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7476449B2 (en) * 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP6346556B2 (ja) 2012-03-01 2018-06-20 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板
CN106457205B (zh) 2014-07-22 2020-09-22 旭化成医疗株式会社 去除组蛋白的吸附材料和生物来源液体净化设备
CN111850628A (zh) * 2020-06-12 2020-10-30 九江德福科技股份有限公司 一种屏蔽阴极板的打孔铜箔制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0616489A1 (fr) * 1993-03-19 1994-09-21 Mitsui Mining & Smelting Co., Ltd. Laminé revêtu de cuivre et plaque à circuit imprimé
JPH0987888A (ja) * 1995-09-28 1997-03-31 Nikko Gould Foil Kk 印刷回路用銅箔の処理方法
JPH1018075A (ja) * 1996-06-28 1998-01-20 Nikko Gould Foil Kk 電解銅箔
EP0996318A2 (fr) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Nouvelle feuille composite, procédé de sa production et laminé revêtu de cuivre

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP2717910B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US5482784A (en) * 1993-12-24 1996-01-09 Mitsui Mining And Smelting Co., Ltd. Printed circuit inner-layer copper foil and process for producing the same
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0616489A1 (fr) * 1993-03-19 1994-09-21 Mitsui Mining & Smelting Co., Ltd. Laminé revêtu de cuivre et plaque à circuit imprimé
JPH0987888A (ja) * 1995-09-28 1997-03-31 Nikko Gould Foil Kk 印刷回路用銅箔の処理方法
JPH1018075A (ja) * 1996-06-28 1998-01-20 Nikko Gould Foil Kk 電解銅箔
EP0996318A2 (fr) * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Nouvelle feuille composite, procédé de sa production et laminé revêtu de cuivre

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *
See also references of WO0177420A1 *

Also Published As

Publication number Publication date
WO2001077420A1 (fr) 2001-10-18
EP1273682A1 (fr) 2003-01-08
CN1388841A (zh) 2003-01-01

Similar Documents

Publication Publication Date Title
MY126831A (en) Copper clad laminate
EP1157821A4 (fr) Plaquette laminee cuivree et plaquette de circuit imprime et son procede de fabrication
EP1194021A3 (fr) Procédé de fabrication d'un panneau à circuit imprimé multicouche et panneau à circuit imprimé multicouche
EP1667510A4 (fr) Procede de fabrication d'une plaque de verre imprimee des deux cotes
WO2003015483A1 (fr) Feuille de cuivre a utiliser comme tableau de connexions imprime, et feuille stratifiee recouverte de cuivre faisant appel a ladite feuille de cuivre a utiliser comme tableau de connexions imprime
CA2364918A1 (fr) Procede de fabrication d'une carte de circuit imprime multicouches et feuille composite utilisee dans ce dernier
EP1923489A3 (fr) Carte de circuit imprimé multicouche et son procédé de fabrication
MY122378A (en) Method for producing vias in the manufacture of printed circuit boards
EP2111087A3 (fr) Solution d'électrodéposition, procédé de fabrication de carte de circuit imprimé multicouche utilisant la solution, et carte de circuit imprimé multicouche
EP1505859A3 (fr) Carte multicouche à circuits imprimés avec trous d'interconnexion remplis
EP1843649A3 (fr) Panneau à circuit imprimé multicouche et son procédé de fabrication
EP1194022A4 (fr) Carte a circuit imprime multicouche et procede de fabrication d'une telle carte
MXPA06000842A (es) Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.
EP1097806A3 (fr) Plaque revêtue de cuivre, méthode pour la fabrication d'alésages dans cette plaque et panneau de circuit imprimé comprenant la dite plaque
EP1061785A3 (fr) Panneau circuit imprimé multicouche à haute densité ayant des trous traversants à haute fiabilité et procédé de fabrication de ce panneau à circuit imprimé
EP2124513A3 (fr) Feuille lubrifiante pour la fabrication de trous et procédé de fabrication de trous par perçage
EP1653789A4 (fr) Carte imprimee et procede de production associe
MY108905A (en) Copper-clad laminate and printed wiring board
TW200520662A (en) Multi-layer printed circuit board and fabricating method thereof
EP1357775A4 (fr) Carte de circuit imprime et procede de fabrication
MY122999A (en) Copper foil for use in laser beam drilling
MY124084A (en) A clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof
AU2001282235A1 (en) Method for making a circuitry comprising conductive tracks, chips and micro-viasand use of same for producing printed circuits and multilayer modules with high density of integration
EP1599079A4 (fr) Procede de production d'une carte de formation de circuit et materiau de production d'une carte de formation de circuit
EP2398304A3 (fr) Stratifié de revêtement de cuivre doté d'une couche de circuit plaquée au cuivre et procédé de fabrication d'une carte de circuit imprimé utilisant le stratifié de revêtement de cuivre doté d'une couche de circuit plaquée au cuivre

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20020123

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

A4 Supplementary search report drawn up and despatched

Effective date: 20030228

RIC1 Information provided on ipc code assigned before grant

Ipc: 7H 05K 3/00 B

Ipc: 7C 25D 7/06 A

17Q First examination report despatched

Effective date: 20030730

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB LU

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20040716