EP1276587A1 - Dispositif pour usiner des substrats et procede mis en oeuvre a l'aide dudit dispositif - Google Patents

Dispositif pour usiner des substrats et procede mis en oeuvre a l'aide dudit dispositif

Info

Publication number
EP1276587A1
EP1276587A1 EP00988633A EP00988633A EP1276587A1 EP 1276587 A1 EP1276587 A1 EP 1276587A1 EP 00988633 A EP00988633 A EP 00988633A EP 00988633 A EP00988633 A EP 00988633A EP 1276587 A1 EP1276587 A1 EP 1276587A1
Authority
EP
European Patent Office
Prior art keywords
laser
laser beam
processing substrates
substrate
minimum spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00988633A
Other languages
German (de)
English (en)
Inventor
Leo Higgins
Hans Jürgen MAYER
Eddy Roelants
Alex Schreiner
Udo Wiggermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1276587A1 publication Critical patent/EP1276587A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Definitions

  • the object is achieved according to the invention by a device of the type mentioned at the outset with the characterizing features of claim 1 and by a method of the beginning mentioned type with the characterizing features of claim 7.
  • multilayer substrates with wavelengths adapted to the respective layers can be processed. Additional flexibility of the method according to ⁇ demanding through the use of pulsed laser beams, it aims ⁇ 9, wherein the pulse repetition rate or the pulse energies for the two laser is set differently.
  • Figure 4a shows a beam path for the first laser beam
  • Figure 4b shows a beam path for the second laser beam with the second beam misaligned
  • FIG. 4c shows a beam path for the second laser beam with a second beam expander with a different magnification factor.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

Lors de la focalisation d'un faisceau laser (2) sur un substrat (7), pour usiner ledit substrat, la plage de profondeurs de champ dans laquelle il est possible de travailler avec une portée minimale de spot, est prédéterminée par les appareils optiques tels que les expanseurs de faisceau (3), l'unité de déflexion (5) et le dispositif de reproduction optique (6). Dans le cas de substrats épais notamment, il est dès lors difficile de percer des trous étroits. Selon l'invention, il est prévu un second faisceau laser (12) diffusé par l'intermédiaire d'un second expanseur de faisceau (13) et également focalisé sur le substrat (7) par l'intermédiaire de l'unité de déflexion (5) et du dispositif de représentation optique. l'agrandissement du second expanseur de faisceau (13) et le désalignement permettent de moduler la position et la longueur de la seconde plage de profondeurs de champ (15). L'utilisation successive des deux faisceaux laser permet de percer des trous étroits même dans des substrats (7) épais.
EP00988633A 1999-11-29 2000-11-21 Dispositif pour usiner des substrats et procede mis en oeuvre a l'aide dudit dispositif Withdrawn EP1276587A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16792199P 1999-11-29 1999-11-29
US167921P 1999-11-29
PCT/DE2000/004097 WO2001039920A1 (fr) 1999-11-29 2000-11-21 Dispositif pour usiner des substrats et procede mis en oeuvre a l'aide dudit dispositif

Publications (1)

Publication Number Publication Date
EP1276587A1 true EP1276587A1 (fr) 2003-01-22

Family

ID=22609363

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00988633A Withdrawn EP1276587A1 (fr) 1999-11-29 2000-11-21 Dispositif pour usiner des substrats et procede mis en oeuvre a l'aide dudit dispositif

Country Status (6)

Country Link
US (1) US6437283B1 (fr)
EP (1) EP1276587A1 (fr)
JP (1) JP2003517931A (fr)
KR (1) KR20020085893A (fr)
CN (1) CN1433350A (fr)
WO (1) WO2001039920A1 (fr)

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JP3522654B2 (ja) * 2000-06-09 2004-04-26 住友重機械工業株式会社 レーザ加工装置及び加工方法
JP4320926B2 (ja) * 2000-06-16 2009-08-26 パナソニック株式会社 レーザ穴加工方法及び装置
US6854642B2 (en) * 2001-10-19 2005-02-15 Chesterfield Holdings, L.L.C. System for vending products and services using an identification card and associated methods
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
EP1680255A4 (fr) * 2003-10-17 2008-10-08 Gsi Lumonics Corp Champ de balayage souple
EP1577048A1 (fr) * 2004-03-18 2005-09-21 Trotec Produktions- und Vertriebs GMBH Machine d'usinage avec deux dispositifs d'usinage différents et méthode de commande de ce dernier
JP2005324248A (ja) * 2004-04-15 2005-11-24 Denso Corp レーザ加工方法及びレーザ加工装置
KR101074408B1 (ko) 2004-11-05 2011-10-17 엘지디스플레이 주식회사 펨토초 레이저 발생장치 및 이를 이용한 기판의 절단방법
US7586684B2 (en) * 2005-01-21 2009-09-08 New York University Solute characterization by optoelectronkinetic potentiometry in an inclined array of optical traps
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
JP4884152B2 (ja) * 2006-09-27 2012-02-29 株式会社小松製作所 極端紫外光源装置
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
US8212177B2 (en) * 2007-08-15 2012-07-03 Caterpillar Inc. Variable focus laser machining system
US8294062B2 (en) * 2007-08-20 2012-10-23 Universal Laser Systems, Inc. Laser beam positioning systems for material processing and methods for using such systems
WO2011018989A1 (fr) * 2009-08-11 2011-02-17 浜松ホトニクス株式会社 Dispositif d’usinage laser et procédé d’usinage laser
KR20120086688A (ko) 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE202010006047U1 (de) * 2010-04-22 2010-07-22 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Strahlformungseinheit zur Fokussierung eines Laserstrahls
KR101283557B1 (ko) * 2010-05-20 2013-07-15 (주)미래컴퍼니 레이저 가공장치
US8884184B2 (en) 2010-08-12 2014-11-11 Raydiance, Inc. Polymer tubing laser micromachining
US9120181B2 (en) 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
US9157801B2 (en) * 2011-06-21 2015-10-13 Alakai Defense Systems, Inc. Laser detection system having an output beam directed through a telescope
US10239160B2 (en) * 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
JP5908009B2 (ja) * 2013-08-20 2016-04-26 三菱重工業株式会社 レーザ加工方法及びレーザ加工装置
CN104741799B (zh) * 2015-04-21 2017-08-22 大族激光科技产业集团股份有限公司 硬脆材料的激光钻孔方法
CN104858551A (zh) * 2015-06-08 2015-08-26 苏州向隆塑胶有限公司 光学微结构的制造方法、机台及其导光板
DE102015224963B3 (de) * 2015-12-11 2017-04-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Bestimmung der Referenz-Fokuslage eines Laserstrahls
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Also Published As

Publication number Publication date
JP2003517931A (ja) 2003-06-03
US6437283B1 (en) 2002-08-20
WO2001039920A1 (fr) 2001-06-07
KR20020085893A (ko) 2002-11-16
US20020063113A1 (en) 2002-05-30
CN1433350A (zh) 2003-07-30

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