EP1396559A4 - Palladium-platierungslösung - Google Patents

Palladium-platierungslösung

Info

Publication number
EP1396559A4
EP1396559A4 EP01941060A EP01941060A EP1396559A4 EP 1396559 A4 EP1396559 A4 EP 1396559A4 EP 01941060 A EP01941060 A EP 01941060A EP 01941060 A EP01941060 A EP 01941060A EP 1396559 A4 EP1396559 A4 EP 1396559A4
Authority
EP
European Patent Office
Prior art keywords
plating solution
palladium plating
palladium
solution
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01941060A
Other languages
English (en)
French (fr)
Other versions
EP1396559A1 (de
Inventor
Takeumi Akimoto
Yotaro Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Chemicals Co Ltd
Original Assignee
Kojima Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000211927A external-priority patent/JP3601005B2/ja
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Publication of EP1396559A1 publication Critical patent/EP1396559A1/de
Publication of EP1396559A4 publication Critical patent/EP1396559A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP01941060A 1999-10-27 2001-06-15 Palladium-platierungslösung Withdrawn EP1396559A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34239299 1999-10-27
JP2000211927A JP3601005B2 (ja) 1999-10-27 2000-06-09 パラジウムめっき液
PCT/JP2001/005107 WO2002103084A1 (en) 1999-10-27 2001-06-15 Palladium plating solution

Publications (2)

Publication Number Publication Date
EP1396559A1 EP1396559A1 (de) 2004-03-10
EP1396559A4 true EP1396559A4 (de) 2006-10-11

Family

ID=27278780

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01941060A Withdrawn EP1396559A4 (de) 1999-10-27 2001-06-15 Palladium-platierungslösung

Country Status (4)

Country Link
EP (1) EP1396559A4 (de)
CN (1) CN1249270C (de)
GB (1) GB2382353B (de)
WO (1) WO2002103084A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400190A (zh) * 2010-09-17 2012-04-04 日本电镀工程股份有限公司 铱电镀液及其电镀方法
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
ITFI20120098A1 (it) * 2012-05-22 2013-11-23 Bluclad Srl Bagno galvanico a base di palladio e fosforo, suo uso in processi galvanici e leghe ottenute applicando il processo galvanico a detti bagni.
WO2016035645A1 (ja) * 2014-09-04 2016-03-10 日本高純度化学株式会社 パラジウムめっき液及びそれを用いて得られたパラジウム皮膜
AT516876B1 (de) * 2015-03-09 2016-11-15 Ing W Garhöfer Ges M B H Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen
CN105441998A (zh) * 2015-10-30 2016-03-30 无锡市嘉邦电力管道厂 含亚硝酸钠、四正丙基溴化铵的钯电镀镀及其电镀方法
CN105332023A (zh) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 一种含四正丙基溴化铵的钯电镀液及其电镀方法
CN105332021A (zh) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 含亚硝酸钠、四苯基溴化砷鎓的钯电镀液及其电镀方法
CN105332024A (zh) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 一种含溴化异丙基三苯基磷鎓的钯电镀液及其电镀方法
CN105316722A (zh) * 2015-11-20 2016-02-10 无锡市嘉邦电力管道厂 一种含四苯基溴化砷鎓的钯电镀液及其电镀方法
CN105543913A (zh) * 2016-02-25 2016-05-04 盈昌集团有限公司 钯钴合金电镀液及用其电镀眼镜框架的工艺
CN106757203A (zh) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 一种钼合金表面化学镀钯的渡液及其应用
CN106757207A (zh) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 一种用于pcb板化学镀镍钯合金的方法
CN106757204A (zh) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 一种在不锈钢表面镀钯的渡液及其应用
CN108004573B (zh) * 2017-12-12 2020-10-16 安徽启东热能科技有限公司 一种气液分离盘盘体的表面处理工艺
CN119571402B (zh) * 2025-02-05 2025-04-04 深圳创智芯联科技股份有限公司 应用于先进封装凸块工艺的电镀厚钯溶液及电镀方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0757121A1 (de) * 1995-08-04 1997-02-05 DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter Alkalisches oder neutrales Bad zur galvanischen Abscheidung von Palladium oder Legierungen des Palladiums

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3317493A1 (de) * 1983-05-13 1984-11-15 W.C. Heraeus Gmbh, 6450 Hanau Galvanische abscheidung von palladium-ueberzuegen
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
JPH0711476A (ja) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk パラジウムめっき液
JPH07278870A (ja) * 1994-04-08 1995-10-24 Kojima Kagaku Yakuhin Kk パラジウムめっき液
JP3379412B2 (ja) * 1997-05-30 2003-02-24 松下電器産業株式会社 パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
JP4249292B2 (ja) * 1998-07-10 2009-04-02 株式会社大和化成研究所 錫及び錫合金メッキ浴
JP2000303199A (ja) * 1999-02-17 2000-10-31 Nisshin Kasei Kk パラジウム合金めっき液、パラジウム−銅合金めっき部材及び殺菌性部材
JP3601005B2 (ja) * 1999-10-27 2004-12-15 小島化学薬品株式会社 パラジウムめっき液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0757121A1 (de) * 1995-08-04 1997-02-05 DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter Alkalisches oder neutrales Bad zur galvanischen Abscheidung von Palladium oder Legierungen des Palladiums

Also Published As

Publication number Publication date
CN1249270C (zh) 2006-04-05
GB2382353B (en) 2004-10-27
WO2002103084A9 (fr) 2003-04-24
EP1396559A1 (de) 2004-03-10
WO2002103084A1 (en) 2002-12-27
GB0128788D0 (en) 2002-01-23
CN1420947A (zh) 2003-05-28
GB2382353A (en) 2003-05-28

Similar Documents

Publication Publication Date Title
GB0025989D0 (en) Plating catalysts
EP1018568A4 (de) Vorrichtung zum plattieren
EP1118915A4 (de) Uhr
DE69830287D1 (de) Stromloses Plattierverfahren
EP1052311A4 (de) Elektroplattierungsvorrichtung
GB2382353B (en) Palladium Plating Solution
EP1227173A4 (de) Stromloses plattierungsverfahren
GB0030217D0 (en) Structure
EP1159028A4 (de) Elektrolysevorrichtung
AU2001277856A1 (en) Electroless rhodium plating
GB0012739D0 (en) Bath
GB9926080D0 (en) Structure
EP1086262A4 (de) Bad für die elektrobeschichtung
GB9806539D0 (en) Electroplating solution
GB9900138D0 (en) Fixings holder
GB2351503B (en) Alloy plating
GB0027081D0 (en) Solution
GB9903173D0 (en) Bath salt
AU2001274534A1 (en) Palladium plating solution
GB9920025D0 (en) Palladium complexes
GB2351657B (en) Concealed-tap bath
GB9926472D0 (en) Bath time
TW491318U (en) Board structure
TW426125U (en) Hose-clips structure improvement
GB9913144D0 (en) Bath

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20020222

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

EL Fr: translation of claims filed
A4 Supplementary search report drawn up and despatched

Effective date: 20060912

17Q First examination report despatched

Effective date: 20091104

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20101019