EP1634680A4 - Procede de detection de serrage par depression et detecteur de serrage par depression - Google Patents

Procede de detection de serrage par depression et detecteur de serrage par depression

Info

Publication number
EP1634680A4
EP1634680A4 EP04734951A EP04734951A EP1634680A4 EP 1634680 A4 EP1634680 A4 EP 1634680A4 EP 04734951 A EP04734951 A EP 04734951A EP 04734951 A EP04734951 A EP 04734951A EP 1634680 A4 EP1634680 A4 EP 1634680A4
Authority
EP
European Patent Office
Prior art keywords
depression
clamp
detection method
detector
clamp detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04734951A
Other languages
German (de)
English (en)
Other versions
EP1634680A1 (fr
Inventor
Yuji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koganei Corp
Original Assignee
Koganei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koganei Corp filed Critical Koganei Corp
Publication of EP1634680A1 publication Critical patent/EP1634680A1/fr
Publication of EP1634680A4 publication Critical patent/EP1634680A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Feeding Of Workpieces (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP04734951A 2003-05-27 2004-05-26 Procede de detection de serrage par depression et detecteur de serrage par depression Withdrawn EP1634680A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003148948A JP2004351527A (ja) 2003-05-27 2003-05-27 吸着検出方法および吸着検出装置
PCT/JP2004/007567 WO2004106010A1 (fr) 2003-05-27 2004-05-26 Procede de detection de serrage par depression et detecteur de serrage par depression

Publications (2)

Publication Number Publication Date
EP1634680A1 EP1634680A1 (fr) 2006-03-15
EP1634680A4 true EP1634680A4 (fr) 2009-11-11

Family

ID=33487139

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04734951A Withdrawn EP1634680A4 (fr) 2003-05-27 2004-05-26 Procede de detection de serrage par depression et detecteur de serrage par depression

Country Status (4)

Country Link
US (1) US7263890B2 (fr)
EP (1) EP1634680A4 (fr)
JP (1) JP2004351527A (fr)
WO (1) WO2004106010A1 (fr)

Families Citing this family (43)

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Publication number Priority date Publication date Assignee Title
JP4682867B2 (ja) * 2006-02-20 2011-05-11 パナソニック株式会社 電子部品実装方法
WO2007105608A1 (fr) * 2006-03-07 2007-09-20 Matsushita Electric Industrial Co., Ltd. Procédé de détermination des conditions de montage d'un composant
KR20080060415A (ko) * 2006-12-27 2008-07-02 미래산업 주식회사 핸들러의 전자부품 픽커
US7793819B2 (en) * 2007-03-19 2010-09-14 Infineon Technologies Ag Apparatus and method for connecting a component with a substrate
JP5309631B2 (ja) * 2008-03-14 2013-10-09 澁谷工業株式会社 分類装置
MY148052A (en) * 2008-03-31 2013-02-28 Visdynamics Res Sdn Bhd A transferring unit
JP5085749B2 (ja) * 2011-02-21 2012-11-28 ファナック株式会社 棒状部材の搬送装置
WO2013120802A1 (fr) 2012-02-13 2013-08-22 J. Schmalz Gmbh Procédé de fonctionnement d'un générateur de dépression et générateur de dépression pour la mise en œuvre de ce procédé
JP2013179137A (ja) * 2012-02-28 2013-09-09 Tokyo Institute Of Technology 力発生装置
FR2991607B1 (fr) * 2012-06-07 2014-06-27 Peugeot Citroen Automobiles Sa Detection de rupture sur piece d'emboutissage lors de leur manipulation avec un prehenseur a ventouses.
US8814113B1 (en) * 2013-03-13 2014-08-26 Tru-Miles Hardware Co., Ltd. Sucker with pressure early warning detection function
JP6122324B2 (ja) * 2013-03-27 2017-04-26 株式会社アマダホールディングス ワーク搬送方法及び装置
TWI565642B (zh) * 2013-04-03 2017-01-11 Hon Tech Inc Electronic component picking unit and its application equipment
GB201311049D0 (en) * 2013-06-21 2013-08-07 Medical Res Council Speciman handling device
JP2015003378A (ja) * 2013-06-24 2015-01-08 ファナック株式会社 力センサを備えた電動ハンド
US9999977B2 (en) 2015-08-26 2018-06-19 Berkshire Grey, Inc. Systems and methods for providing vacuum valve assemblies for end effectors
EP3341163B1 (fr) 2015-08-26 2023-04-19 Berkshire Grey Operating Company, Inc. Systèmes et procédés de fourniture de détection de contact dans un bras articulé
US11370128B2 (en) 2015-09-01 2022-06-28 Berkshire Grey Operating Company, Inc. Systems and methods for providing dynamic robotic control systems
ES2845683T3 (es) 2015-09-01 2021-07-27 Berkshire Grey Inc Sistemas y métodos para proporcionar sistemas de control robótico dinámico
US10399236B2 (en) 2015-09-08 2019-09-03 Berkshire Grey, Inc. Systems and methods for providing dynamic vacuum pressure in an articulated arm end effector
ES2922990T3 (es) * 2016-01-08 2022-09-22 Berkshire Grey Operating Company Inc Sistemas de adquisición y movimiento de objetos
EP3243608B1 (fr) * 2016-05-09 2022-04-06 J. Schmalz GmbH Procede de surveillance des etats de fonctionnement d'un actionneur commande par pression et actionneur commande par pression
JP6906158B2 (ja) * 2017-02-15 2021-07-21 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
WO2018165017A1 (fr) 2017-03-06 2018-09-13 Berkshire Grey, Inc. Systèmes et procédés pour déplacer efficacement divers objets
TWM542615U (zh) 2017-03-10 2017-06-01 Xin-Bo Huang 具高低壓吹氣分離的真空吸取裝置
CN116945132A (zh) 2017-08-02 2023-10-27 伯克希尔格雷营业股份有限公司 用于获取和移动具有复杂的外表面的物体的系统和方法
US10668630B2 (en) 2017-08-22 2020-06-02 Emerging Acquisitions, Llc High speed manipulation of non-uniform ojects
JP6978877B2 (ja) * 2017-09-04 2021-12-08 キヤノン株式会社 インプリント装置および物品製造方法
WO2019058529A1 (fr) * 2017-09-22 2019-03-28 株式会社Ｆｕｊｉ Machine de montage de composant et procédé de relance pour saisir des composants
JP6838166B2 (ja) * 2017-09-22 2021-03-03 株式会社Ｆｕｊｉ 部品装着機、および部品落下の判定方法
CA3080961C (fr) 2017-11-07 2023-10-03 Berkshire Grey, Inc. Systemes et procedes permettant de fournir une pression de vide dynamique au niveau d'un effecteur d'extremite a l'aide d'une source de vide unique
JP2019155536A (ja) * 2018-03-13 2019-09-19 株式会社東芝 保持装置、飛行体、および搬送システム
US10335947B1 (en) 2019-01-18 2019-07-02 Mujin, Inc. Robotic system with piece-loss management mechanism
JP2020147305A (ja) * 2019-03-12 2020-09-17 株式会社イシダ 吸着装置
WO2021126876A1 (fr) 2019-12-16 2021-06-24 AMP Robotics Corporation Dispositif de transporteur pneumatique bidirectionnel pour le tri de matériaux et autres applications
EP4076871A1 (fr) 2019-12-16 2022-10-26 Amp Robotics Corporation Dispositif de groupe de pinces à ventouse pour le tri de matériau et d'autres applications
WO2022020178A1 (fr) 2020-07-22 2022-01-27 Berkshire Grey, Inc. Systèmes et procédés de traitement d'objet en utilisant un dispositif de préhension à vide qui réalise une rétention d'objet par inversion d'enveloppe
CA3189565A1 (fr) 2020-07-22 2022-01-27 Berkshire Grey Operating Company, Inc. Systemes et procedes de traitement d'objets a l'aide d'un dispositif de prehension a depression a affaissement passif
CA3201277A1 (fr) 2020-11-19 2022-05-27 Berkshire Grey Orerating Company, Inc. Systemes et procedes de traitement d'objets faisant appel a des dispositifs de prehension pour des objets ayant une faible aptitude a conserver une pose
EP4114164A1 (fr) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Détermination d'une valeur de qualité lors du montage d'un élément électrique
CN113597260B (zh) * 2021-07-30 2022-05-31 深圳聚信时代实业有限公司 一种检测smt贴装压力的方法与装置
CA3248499A1 (fr) 2022-01-21 2023-07-27 Berkshire Grey Operating Company, Inc. Systèmes et procédés de traitement d'objets avec des dispositifs à mouvement programmable utilisant des dispositifs de préhension à mouvement de lacet
JP7217379B1 (ja) 2022-08-23 2023-02-02 株式会社ユーシン精機 成形品取出機

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175799A (ja) * 1995-12-26 1997-07-08 Sanei Seiki Seisakusho:Kk 荷物吊上げ設備のための安全装置
JPH11300672A (ja) * 1998-04-21 1999-11-02 Sony Corp 真空吸着装置

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JP3013480B2 (ja) * 1991-03-12 2000-02-28 安藤電気株式会社 Ｉｃソケットのｉｃコンタクト機構
JPH06305608A (ja) * 1993-04-21 1994-11-01 Toyota Motor Corp ワーク吸着装置
JPH0983193A (ja) * 1995-09-13 1997-03-28 Matsushita Electric Ind Co Ltd 電子部品実装機の部品吸着ヘッド
US5654631A (en) * 1995-11-15 1997-08-05 Xilinx, Inc. Vacuum lock handler and tester interface for semiconductor devices
JPH10128690A (ja) 1996-10-29 1998-05-19 Yokogawa Electric Corp 電子式圧力スイッチ及びこれを用いた真空部品吸着装置
US5961169A (en) * 1998-07-27 1999-10-05 Strasbaugh Apparatus for sensing the presence of a wafer
JP2000117676A (ja) 1998-10-13 2000-04-25 Ando Electric Co Ltd Ｉｃの吸着機構および水平搬送式オートハンドラ
JP2001054886A (ja) 1999-08-16 2001-02-27 Koganei Corp 吸着搬送方法および吸着搬送装置
DE10140248B4 (de) 2001-08-09 2006-09-28 J. Schmalz Gmbh Unterdruckhandhabungseinrichtung
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175799A (ja) * 1995-12-26 1997-07-08 Sanei Seiki Seisakusho:Kk 荷物吊上げ設備のための安全装置
JPH11300672A (ja) * 1998-04-21 1999-11-02 Sony Corp 真空吸着装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2004106010A1 *

Also Published As

Publication number Publication date
WO2004106010A1 (fr) 2004-12-09
EP1634680A1 (fr) 2006-03-15
JP2004351527A (ja) 2004-12-16
US7263890B2 (en) 2007-09-04
US20060247813A1 (en) 2006-11-02

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RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 13/04 20060101ALI20090828BHEP

Ipc: H01L 21/68 20060101ALI20090828BHEP

Ipc: B65G 47/91 20060101ALI20090828BHEP

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