EP1637017A2 - Bauteile für passive elektronische bauelemente und verfahren zur herstellung - Google Patents

Bauteile für passive elektronische bauelemente und verfahren zur herstellung

Info

Publication number
EP1637017A2
EP1637017A2 EP04767412A EP04767412A EP1637017A2 EP 1637017 A2 EP1637017 A2 EP 1637017A2 EP 04767412 A EP04767412 A EP 04767412A EP 04767412 A EP04767412 A EP 04767412A EP 1637017 A2 EP1637017 A2 EP 1637017A2
Authority
EP
European Patent Office
Prior art keywords
strip
layer
sandblasting
laminated
laminated strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04767412A
Other languages
English (en)
French (fr)
Inventor
Martin Gijs
Jean-Pierre Reyal
Farid Amalou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aperam Alloys Imphy SAS
Original Assignee
Imphy Alloys SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imphy Alloys SA filed Critical Imphy Alloys SA
Publication of EP1637017A2 publication Critical patent/EP1637017A2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/046Printed circuit coils structurally combined with ferromagnetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13Amorphous metallic alloys, e.g. glassy metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13Amorphous metallic alloys, e.g. glassy metals
    • H01F10/131Amorphous metallic alloys, e.g. glassy metals containing iron or nickel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/26Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/265Magnetic multilayers non exchange-coupled
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13Amorphous metallic alloys, e.g. glassy metals
    • H01F10/138Amorphous metallic alloys, e.g. glassy metals containing nanocrystallites, e.g. obtained by annealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0233Manufacturing of magnetic circuits made from sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/042Printed circuit coils by thin film techniques
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/04Processes
    • Y10T83/0591Cutting by direct application of fluent pressure to work

Definitions

  • the present invention relates to a method of manufacturing parts for passive electronic components obtained by cutting from a laminated strip consisting of a stack of thin and fragile metal strips, and in particular thin metal strips of nanocrystalline alloy.
  • Nanocrystalline alloys and in particular nanocrystalline alloys of the Fe Cu Nb B Si or Fe Zr B Si type, or of other types still, are well known. These alloys, which have excellent magnetic properties, are obtained by heat treatment of amorphous alloy strips obtained by ultra-rapid solidification of a liquid metal.
  • These strips which are particularly suitable for the manufacture of a magnetic core with very high permeability, in particular at low frequency, have the disadvantage of being extremely fragile.
  • Magnetic cores are thus obtained which have excellent magnetic properties, but which have the drawback of having only one possible shape which is that of a coil.
  • the object of the present invention is to remedy these drawbacks by proposing a means for manufacturing parts for passive electronic components, in particular magnetic electronic components, consisting of a stack of thin metal strips. and fragile, and in particular strips of nanocrystalline alloy, and having very diverse shapes.
  • the subject of the invention is a method of manufacturing parts for passive electronic components according to which a laminated strip is produced, consisting of at least one stack of a thin and fragile metallic strip and a layer of a material.
  • the layer of an adhesive material of the at least one stack is a layer of a hard and fragile adhesive material.
  • a cover made of a material resistant to sandblasting is provided on one face of the laminated strip, having openings having at least one shape in which it is desired to etch the at least one laminated strip.
  • the cover is for example a steel strip resistant to etching by sandblasting, or an elastic layer such as a layer of paint deposited by screen printing, or a layer of elastic photosensitive resin which is exposed to radiation and for example to ultraviolet rays or to electron beams through a mask with adapted cut-outs which are developed by immersion in a bath.
  • the laminated strip can consist of at least two alternating stacks of thin metal strips and layers of a hard and fragile adhesive material, the at least two alternating stacks being superimposed and separated by an adherent layer of which at least part of the surface is made of an elastic material resistant to etching by sandblasting.
  • the laminated strip is glued on a support strip.
  • the cut laminated strip and the support strip can be separated.
  • the laminated strip disposed on the support strip in an enclosure for etching by sanding comprising at least one sanding nozzle producing a jet of abrasive particles, a relative movement of the strip is made.
  • laminate and at least one sandblasting nozzle in order to carry out a sweeping of the surface of the laminated strip by the jet of abrasive particles.
  • the thin metal strips are made of a material chosen from the following alloys: nanocrystalline magnetic alloys, brittle iron-cobalt magnetic alloys, brittle iron-platinum, brittle iron-silicon, brittle iron-nickel, brittle nickel-chromium alloys , brittle molybdenum alloys and brittle tungsten alloys.
  • the support strip may be a strip comprising a layer of polymer and a layer of conductive material such as copper which, in addition, may comprise before cutting by sandblasting at least one electronic component which is protected at the time of cutting by sandblasting by a layer of elastic material.
  • the invention also relates to a part capable of being obtained by the method according to the invention, which is for example a core of passive inductive electronic component which can comprise an air gap and which can also comprise at least two parts of different thicknesses.
  • the part can also constitute an electrical resistance or a capacity.
  • the invention also relates to a plate intended to be incorporated in a printed circuit, consisting of a layer of conductive material and of a layer of elastic polymer material, on which is glued a piece of electronic component capable of being obtained by process according to the invention.
  • the invention further relates to a method of manufacturing an inductive passive electronic component of the type comprising a part cut from a laminated strip consisting of a stack of thin metal strips of a magnetic alloy, in which said part is manufactured by the method according to the invention, and at least one coil is made and the component is coated with a protective material.
  • the passive electronic component is capacitive or resistive
  • the component comprises a part cut from a laminated strip consisting of a stack of thin metal strips and electrical connection means.
  • the connection means and the coating of the component are also produced with a protective material.
  • the invention finally relates to a method of manufacturing a printed circuit comprising at least one passive electronic component comprising at least one part made of a laminated metallic material according to which at least one stacks and adheres by gluing a plate consisting of a layer of conductive material and a layer of elastic polymer material on which is glued a part obtained by cutting by sanding, and at least one plate comprising a layer of polymer material.
  • the process of cutting by sanding a laminated strip consisting of an alternating stack of strip of very fragile magnetic metallic material and layers of polymer has the advantage of making it possible to obtain magnetic pieces of very diverse shape free from cracking. , and therefore, having very good magnetic properties.
  • FIG. 1A schematically represents a stack of nanocrystalline strips bonded by a hard and fragile adhesive, arranged on a support strip and on which a mask is placed.
  • FIG. 1B shows the previous stack after sanding.
  • Figure 2A shows a laminated strip according to Figure 2A consisting of stacked and glued nanocrystalline strips, in which a layer of adhesive is made of elastic adhesive.
  • Figure 2B shows a laminated strip according to Figure 2A consisting of stacked and glued nanocrystalline strips, of which an adhesive layer consists of an elastic adhesive, after sanding.
  • Figure 3A shows a laminated strip according to Figure 2A consisting of nanocrystalline strips stacked and glued together, of which an adhesive layer is partially made of an elastic adhesive.
  • the laminated strip is placed on a support and a cover is placed on the strip.
  • Figure 3B shows the strip of the previous figure after sanding.
  • FIG. 4 shows an assembly consisting of a support strip, a laminated strip consisting of bonded nanocrystalline strips and a cover.
  • Figure 5 shows the part obtained after sandblasting.
  • Figure 6 is a schematic representation of the method of manufacturing a part for magnetic component cut by sandblasting from a laminated strip comprising nanocrystalline strips.
  • FIGS 7A and 7B show schematically the manufacture of a printed circuit comprising a magnetic core obtained by cutting a nanocrystalline material.
  • the general principle of the invention consists in manufacturing parts for passive electronic components, and in particular passive magnetic electronic components such as inductors or magnetic cores, obtained by cutting by sandblasting of laminated strips consisting of an alternating stack of strips. brittle metals and layers of hard, brittle adhesive material.
  • the fragile metallic material has magnetic properties suitable for the manufacture of magnetic electronic components.
  • This material is in particular a nanocrystalline magnetic material of the Fe-Cu-Nb-B-Si or Fe-Zr-B-Si type for example. Such materials are described for example in European patent EP 0 271 657 or in European patent EP 0 299 498.
  • This nanocrystalline material is obtained by heat treatment of an amorphous strip obtained by ultra-solidification. fast of a metallic liquid alloy.
  • a thin strip has a thickness of between a few microns and a few tens of microns, in particular between 5 to 50 microns, and in general of the order of 20 microns.
  • the hard and brittle adhesive material is a polymeric material and for example an adhesive which is either naturally hard and brittle, or which is made hard and brittle by a suitable heat treatment.
  • These materials generally called thermosets, are in particular unsaturated polyesters, epoxides, phenolics and polyimides.
  • the laminated strip marked generally by 1 is homogeneous. It consists of identical thin metal strips 2, and intermediate layers of identical hard and fragile adhesive material 3.
  • the laminated strip 1 is glued to a support strip 5, and a cover 4 is arranged on its upper face.
  • the laminated strip generally identified by 10 consists of a first homogeneous laminated layer 11, consisting of a stack of identical thin metal strips 21 separated by layers of hard adhesive material and fragile 31 and a second laminated layer 12 consisting of a stack of strips thin metal 22 separated by layers 32 of hard and brittle adhesive material.
  • the two laminated layers are separated by an intermediate layer 33 of an elastic adhesive material.
  • the elastic intermediate layer 33 extends over the entire surface 2 of the laminated strip.
  • the laminated strip thus obtained is heterogeneous.
  • a cover 40 and a support strip 50 are shown in the figure.
  • the heterogeneous laminated strip generally identified by 100 is constituted as in the previous case by a first laminated layer 110 made up of a stack of thin metal strips 210 separated by layers 310 of hard and fragile adhesive material and by a second laminated layer 120 made up of a stack of thin metal strips 220 separated by layers of hard and fragile adhesive material 320, the two laminated layers 110 and 120 being separated by an intermediate layer 330, of which a part 331 is made of a hard and fragile material, and another part 332 is made of an elastic adhesive material .
  • a support strip 500 and a cover 400 have also been shown.
  • heterogeneous laminated strips can be envisaged in which several laminated layers made up of thin metal strips adhered by layers of hard and fragile material are separated by intermediate layers made partially or completely of an elastic material. When the intermediate layers are only partially made of elastic material, the parts which are not made of elastic material are made of hard and brittle adhesive material.
  • the homogeneous or heterogeneous laminated strip can be manufactured by any suitable process, and in particular by the processes described in French patent application FR 2 788 455.
  • a homogeneous laminated strip it is possible to proceed in the following way: by simultaneously unrolling on the one hand a reel of a strip of flexible and resistant adhesive polymer material and a reel of a strip of thin and fragile metallic material of nanocrystalline material, the strip is glued in thin metallic material on the strip of adhesive, flexible and resistant polymer material. Then a plurality of strips are thus produced, made up of a layer of flexible and resistant polymer material and of an adherent layer of thin metallic material. Then a plurality of these laminated strips is stacked so as to constitute a laminated composite strip comprising thin metal strips separated by layers of adhesive, flexible and resilient polymer material.
  • the laminated strip thus formed is then subjected to a heat treatment intended to make the layers of adhesive polymer material hard and fragile.
  • a first laminated strip is produced by gluing a thin metal strip on a strip of flexible and resistant adhesive polymer material. Then the thin metal surface is coated with a layer of an adhesive which will be hard and fragile after drying, such as for example an epoxy adhesive. Then a thin metal strip is placed on this layer of adhesive, which is made to adhere. Then we coat the metal surface with a layer of glue which will become hard and brittle after drying, and we have a new metal strip on this layer of glue thin that we adhere to. And we continue the process until we get a laminated strip of the desired thickness.
  • a laminated strip of the desired thickness is produced, then it is bonded to the surface of this laminated strip, for example by screen printing, a strip having the desired characteristics, that is to say either a strip which is entirely elastic, or a composite strip consisting of an elastic part and of a part liable to become hard and brittle. Then a second laminated strip produced by one or other of the methods described above is placed on this intermediate layer. Optionally, the operation is repeated the number of times desired.
  • the laminated strips which have just been described comprise a stack of a plurality of thin metal strips.
  • the method is also suitable for laminated strips comprising only a thin metallic layer adhering to a polymer layer.
  • the cache can be made in several ways.
  • the cover is a sufficiently thick metal strip, for example made of sand-resistant steel, and comprising cutouts having the shapes according to which one wishes to cut the laminated tape.
  • the cover may consist of a strip of elastic polymer material also comprising suitable cutouts.
  • the material must be elastic so that it can resist sanding.
  • the cover is produced by depositing on the surface of the laminated strip a layer of elastic paint resistant to sandblasting in patterns which correspond to the patterns in which it is desired to cut the laminated strip. This layer of paint is for example deposited by screen printing. It is also possible to deposit on the laminated strip, a layer of photosensitive resin which is exposed to radiation such as ultraviolet rays or to an electron beam through a mask of suitable shape and which is developed in a bath which dissolves the non-irradiated parts.
  • the cover is a cover of the "contact cover” type, that is to say made up of a plate having openings, it is not possible to produce parts disconnected from each other just after sandblasting.
  • the cover is made, for example, of a layer of photosensitive resin, it is possible to produce parts that are disconnected from each other and in particular small toroids placed inside the tori of larger diameter.
  • the laminated strip 1, 10 or 100 can be placed on a support strip 5, 50 or 500 or on a support plate, made of a material with good mechanical strength and resistant to sanding.
  • the laminated strip can be bonded to this support strip either with a soluble adhesive or with a resistant adhesive.
  • the support strip may, depending on the applications envisaged, be made either of a resistant metallic material such as steel, or of an elastic polymer material, or else of a polymer material comprising on its underside a conductive metallic layer d electricity such as a layer of copper.
  • the assembly constituted by the laminated strip 1, the cover 4, and possibly the support strip 5 is passed through a sandblasting enclosure 80, under sandblasting nozzles 81 which project onto the upper surface, that is to say onto the surface which comprises the cover, jets 82 of abrasive particles or abrasive sand.
  • abrasive particles are, for example, alumina or silica particles.
  • the abrasive sand abrades the laminated strip until it reaches an abrasion-resistant layer. This abrasion of the laminated strip ensures the etching and cutting of the parts 6.
  • the sandblasting enclosure may include a plurality of nozzles which provide a projection of abrasive particles on a plurality of zones. However, the zones do not necessarily cover the entire surface to be sanded.
  • the sand jet which passes through the openings 7 left free by the mask 4 abrades the strip over its entire thickness until it reaches the support strip 5.
  • FIG. 1B the thickness of which is constant and equal to the thickness of the laminated strip.
  • the laminated strip is a composite laminated strip 10 as shown in FIG. 2A comprising a continuous intermediate layer 33
  • the sand jets penetrate through the spaces 70 left free by the mask 40, abrading the upper laminated layer 11 of the strip laminate, until reaching the intermediate layer 33 of elastic material.
  • a laminated strip is thus obtained, the thickness of which is not constant.
  • This laminated strip may for example be a strip on which parallel strips have been engraved which can constitute a diffraction grating for electromagnetic waves.
  • the laminated strip is a composite laminated strip 100, as shown in FIG. 3A, of which the intermediate layer 330 is a partially elastic and partially fragile intermediate layer, the zones 700 left free by the mask at the rights of the elastic intermediate layer 332 are only etched up to the elastic intermediate layer 332 while the zones 710 left free by the mask at the rights of the zones of the intermediate layer 331 which are hard and fragile, the etching is carried out up to the support layer 500.
  • FIG. 4 An example of implementation of the method for producing laminated nanocrystalline toroids is shown in FIG. 4 and in FIG. this strip using a soluble adhesive.
  • a cover 14 comprising cutouts 17 which delimit toroids 18A, 18B, 18C and 18D of various sizes, these toroids 18A, 18B, 18C and 18D are connected by attachment points 19A, 19B, 19C and 19D at the remaining parts of the cover 14.
  • This stack is sanded in order to be engraved. During sanding the parts of the strip 13 which are in line with the openings 17 are completely abraded until the sand reaches the support layer 15. After sanding the cover 14 is removed.
  • the cutouts of the laminated strip delimit parts 16A, 16B, 16C and 16D which are toroid-shaped toruses and which remain attached to a peripheral part of the laminated strip through attachment points.
  • the cut laminated strip 13 is then cleaned, possibly coated of a protective polymer and separated from the support strip 5. This gives a cut laminated strip 13 'shown in FIG. 5.
  • the parts 16A, 16B, 16C and 16D are then separated from the cut laminated strip from the strip 13 ', possibly by sandblasting, and a plurality of toroids is thus obtained which constitute parts for discrete magnetic electronic components.
  • the toroids thus obtained can have very diverse dimensions which can range from a few millimeters in diameter or even a millimeter in diameter up to several millimeters in diameter, with thicknesses which range from a few tens of microns to a few hundred microns, or even more depending the number of layers of nanocrystalline strips which have been stacked to produce the laminated strip.
  • These toroids thus obtained can then be coated and then wound so as to manufacture passive magnetic electronic components, such as inductors, transformers, rotors or stators of micromotors, or any other component of the magnetic type.
  • the method makes it possible to manufacture toroids comprising an air gap.
  • the laminated strip is a heterogeneous laminated strip comprising an intermediate layer of a totally or partially elastic material
  • magnetic parts are obtained which have very thick zones and thin zones. These parts can have various shapes which correspond to particular applications that a person skilled in the art knows how to determine.
  • we clean the pre-cut laminated strip then we separate the different elementary parts and they are conditioned so that they can be used later as parts incorporated in electronic components. These components are for example inductors, transformers, filters, antennas, rotors or stators of micromotors for watches.
  • the process as just described makes it possible to manufacture discrete electronic components. But it also makes it possible to manufacture electronic components incorporated in printed circuits.
  • To make magnetic electronic components incorporated in printed circuits one can proceed in several ways. One can in particular, arrange the laminated strip consisting of stacked nanocrystalline strips, on a support plate consisting on the one hand of a layer of polymer material capable of becoming one of the layers of a printed circuit, this polymer layer being coated on its underside with a layer of copper which can be etched by chemical etching to form conductive elements as is done in a manner known per se in the manufacture of printed circuits.
  • the laminated strip is glued to the support plate by means of an elastic protective glue so that the sanding which cuts the part in the laminated strip does not cut the support polymer plate.
  • the assembly is cleaned but the piece obtained is not removed from the support plate. On the contrary, this part is left on the support plate.
  • a plate 51 is obtained on which is glued a piece of inductive electronic component 54 in the form of a torus.
  • the plate 51 comprises a layer 52 of polymer material on which is glued the electronic component part 54, and a lower layer 53 of copper.
  • a second plate 55 is then glued to the upper face of the plate provided with its part 54, consisting of a layer of polymer material 56 and an upper layer 57 of conductive material such as copper.
  • the copper layers 53 and 57 are then etched by chemical etching so as to form conductors 58 arranged radially relative to the torus 54 which is included between the two outer layers 51 and 55 of the printed circuit shown in FIG. 7B.
  • the conductors 58 of the upper face and the lower face are connected by conductive passages 59 consisting of holes whose walls are coated with a conductive material, so as to form windings.
  • a printed circuit is thus obtained comprising an inductor or an integrated transformer.
  • the technique of manufacturing conductors is a technique known in itself in the manufacture of printed circuits. Note that the etching of the conductors in the copper layers can be done not after assembly of the plates constituting the printed circuit, but before this operation. The order in which these operations are carried out is only a question of manufacturing convenience.
  • the support layer on which the laminated strip intended to be cut has been deposited may previously comprise electronic circuits which must be protected during the sanding operation.
  • a protective layer of an elastic material resistant to sandblasting is placed on the support layer.
  • the support plates of polymer material can be composite plates made of a woven material and impregnated with resin usually used in the manufacture of printed circuits.
  • the invention as just described is also applicable to the manufacture of passive electronic components made of materials other than nanocrystalline materials, provided that these materials are metallic materials which are in the form of thin, hard strips and fragile, ie likely to be engraved by sandblasting. These materials are for example materials such as certain iron-cobalt, iron-platinum, iron-silicon, iron-nickel alloys, certain alloys of the nickel-chromium type or certain alloys of molybdenum or certain alloys of tungsten. Those skilled in the art know these alloys.
  • the passive electronic components obtained by this process can also be electronic components of the capacitive type or of the resistive type.
  • to make a capacitive component it suffices to make a connection on a metal layer and a connection on another metal layer, the two metal layers being separated by at least one insulating layer having suitable dielectric properties.
  • To obtain a resistive component it is sufficient to create two electrical connections on the same metal layer.
  • a manufacturing process which comprises a plurality of successive sandblasting operations is also part of the invention.
  • the method can be applied to the cutting of parts in laminated strips comprising a single thin and fragile metallic strip or a thin and fragile metallic strip • bonded to an elastic and sandblast-resistant polymer strip, which elastic polymer strip can be bonded to a laminated strip comprising one or more thin and fragile metallic strips and optionally one or more layers of a hard and fragile adhesive material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
EP04767412A 2003-06-23 2004-06-22 Bauteile für passive elektronische bauelemente und verfahren zur herstellung Withdrawn EP1637017A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0307563A FR2856552B1 (fr) 2003-06-23 2003-06-23 Procede de fabrication de pieces pour composants electroniques passifs et pieces obtenues
PCT/FR2004/001556 WO2005002308A2 (fr) 2003-06-23 2004-06-22 Pieces pour composants electroniques passifs et procede de fabrication

Publications (1)

Publication Number Publication Date
EP1637017A2 true EP1637017A2 (de) 2006-03-22

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EP04767412A Withdrawn EP1637017A2 (de) 2003-06-23 2004-06-22 Bauteile für passive elektronische bauelemente und verfahren zur herstellung

Country Status (9)

Country Link
US (2) US7640641B2 (de)
EP (1) EP1637017A2 (de)
JP (2) JP4381414B2 (de)
KR (1) KR101104385B1 (de)
CN (1) CN1830232B (de)
BR (1) BRPI0411684A (de)
CA (2) CA2774224A1 (de)
FR (1) FR2856552B1 (de)
WO (1) WO2005002308A2 (de)

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JP6296407B1 (ja) * 2017-02-02 2018-03-20 株式会社伸光製作所 多列型プリント基板とその製造方法
JP6261104B1 (ja) * 2017-03-30 2018-01-17 株式会社伸光製作所 プリント基板の製造方法
JP7619756B2 (ja) * 2018-11-09 2025-01-22 マグネコンプ コーポレーション ラップアラウンド電極を有する圧電マイクロアクチュエータの製造方法
EP3736839A1 (de) * 2019-05-06 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit eingebettetem magnetstapel
EP3840547A1 (de) * 2019-12-20 2021-06-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit eingebetteter magnetischer einlage und integrierter spulenstruktur
JP7441490B2 (ja) * 2020-01-27 2024-03-01 相模ピーシーアイ株式会社 プリント基板の加工方法
WO2022054725A1 (ja) * 2020-09-09 2022-03-17 アルプスアルパイン株式会社 磁性コアおよび磁気部品

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Also Published As

Publication number Publication date
CA2529899A1 (fr) 2005-01-06
FR2856552B1 (fr) 2005-10-21
FR2856552A1 (fr) 2004-12-24
WO2005002308A3 (fr) 2005-03-17
BRPI0411684A (pt) 2006-08-29
JP4917632B2 (ja) 2012-04-18
US20090314521A1 (en) 2009-12-24
WO2005002308A2 (fr) 2005-01-06
JP4381414B2 (ja) 2009-12-09
KR101104385B1 (ko) 2012-01-16
KR20060017651A (ko) 2006-02-24
CN1830232A (zh) 2006-09-06
US7640641B2 (en) 2010-01-05
US8362361B2 (en) 2013-01-29
JP2007520872A (ja) 2007-07-26
JP2009224800A (ja) 2009-10-01
US20070119284A1 (en) 2007-05-31
CN1830232B (zh) 2012-05-30
CA2529899C (fr) 2013-01-15
CA2774224A1 (fr) 2005-01-06

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