EP1818429A2 - Procédé de culture de monocristal de GaN, procédé de fabrication d'un substrat de monocristal de GaN et substrat de monocristal de GaN - Google Patents

Procédé de culture de monocristal de GaN, procédé de fabrication d'un substrat de monocristal de GaN et substrat de monocristal de GaN Download PDF

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Publication number
EP1818429A2
EP1818429A2 EP07004045A EP07004045A EP1818429A2 EP 1818429 A2 EP1818429 A2 EP 1818429A2 EP 07004045 A EP07004045 A EP 07004045A EP 07004045 A EP07004045 A EP 07004045A EP 1818429 A2 EP1818429 A2 EP 1818429A2
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EP
European Patent Office
Prior art keywords
gan
growth
substrate
facet
dislocations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07004045A
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German (de)
English (en)
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EP1818429A3 (fr
Inventor
Kensaku Motoki
Takuji Okahisa
Naoki Matsumoto
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of EP1818429A2 publication Critical patent/EP1818429A2/fr
Publication of EP1818429A3 publication Critical patent/EP1818429A3/fr
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C30B29/406—Gallium nitride
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials

Definitions

  • the high dislocation density of the crystals induces few problems on the GaN LEDs, because the current density is small in the LEDs. However, such high density of dislocations will induce difficulties in the case of LDs (laser diodes) which require far larger current density than LEDs.
  • the high current density facilitates the degradation originating from the defects in a short time.
  • Current GaInN blue light LDs made upon sapphire substrates are still suffering from a short lifetime.
  • the GaInN blue light LDs have not attained to the practical level yet due to the rapid degradation and the short lifetime in contradiction to the GaInN LEDs. 10 9 cm -2 dislocations seem to reduce the lifetime of the GaInN LDs.
  • the sapphire substrates originate plenty of dislocations in the GaN and GaInN layers grown on the substrates.
  • Fig.14 shows the section of a sapphire substrate1, a GaN thin film piled on the substrate (which can be omitted), and a mask 2 with stripes 3 extending in the [11 2 0] direction on the thin GaN film.
  • the masked sapphire substrate is introduced into a furnace for growing a GaN layer on the substrate 1.
  • the GaN growth is selectively initiated on the exposed parts of the sapphire within the windows 3.
  • the GaN film does not pile on the mask 2. (11 2 2) planes, ( 11 22) planes dominantly grow within the windows 3.
  • Triangle-sectioned ridges 4 are formed along the stripe windows 3 having the (11 2 2) planes and the ( 11 22) planes.
  • the GaN film takes over the dislocations from the substrate.
  • Vertical lines 6 show the dislocations which grow upward in parallel with the direction of growth in the GaN film.
  • the dislocations are gathered into the middle planes 11 as shown in Fig.17.
  • the planes 11 are called "defect assembly plane”.
  • the GaN crystal grows in two-dimension on c-plane (0001), keeping a mirror flat surface 10. It is not easy to maintain the mirror-plane growth. But they believe that the mirror-plane growth should be kept even at the intermediate steps for making a flat smooth GaN single crystal. Fine regulation of the gas pressures, gas supplies and temperature keeps the flat smooth surface of the GaN crystal.
  • Fig.17 shows the smooth flat surface of c-plane (0001) after the integration of the grains.
  • the grains extending from the windows are integrated with at a thickness of about 6 ⁇ m. Then, the crystal grows in two dimensions vertically on the flat c-plane, piling c-planes one by one. The two dimensional growth maintains the mirror flatness of the surface.
  • the Inventors made various GaN crystals from a 0.2mm thickness to a 0.6mm thickness.
  • the lateral overgrowth method decreased the dislocation density till about 1 ⁇ 10 7 cm -2 . However, the method could not reduce the dislocation to low density of less than 1 ⁇ 10 7 cm -2 .
  • the GaN crystals were not good enough to be a substrate for making LDs.
  • the mirror surface growth has a drawback of requiring high temperature.
  • the high temperature gives serious damage to the GaAs substrate which is weak to heat.
  • the high temperature incurs no problem for the conventional sapphire substrate which has far higher resistance against heat than GaAs.
  • the GaAs substrate requires lower temperature than the conventional sapphire substrate.
  • the Inventors prefer the GaAs substrate to the sapphire substrate for the mentioned reasons.
  • the GaAs substrate can be easily removed by etching after the GaN growth unlike the sapphire which cannot be eliminated due to the chemical stubbornness.
  • the method of decreasing defects of the present invention has been clarified hitherto. An important problem is still left unexplained.
  • the reduction method explained till now is restricted to the region at which facets exist because the reduction is originated from the facet growth. If the crystal surface includes smooth, flat c-axis growing parts without facets, the flat regions would be free from the function of reducing defects.
  • the normal c-axis growth expands parallely dislocations in the c-axis direction without reducing the dislocations.
  • the present invention proposes a method of growing a GaN single crystal maintaining the facet structure and reducing defects by producing defect-accumulating lines which are vertical to the average growing surface (Claim 4).
  • the desirable range of the diameters of the pits consisting of the facets or the complex pits as assemblies of the pits is 10 ⁇ m to 2000 ⁇ m (Claim 29). Too small diameter of the pits has poor effect of reducing the dislocations. Too big diameter of the pits is uneconomical by increasing the loss on the polishing process which eliminates the pits and obtains a smooth surface.
  • the substrate crystal should be a single crystal belonging to the hexagonal symmetry group or the cubic symmetry group.
  • the (111) plane of the cubic symmetry crystal has three-fold symmetry.
  • the (0001) plane of the hexagonal symmetry crystal has six-fold symmetry.
  • the surfaces of the grown crystals depend upon the growth conditions. Some samples (A, C) have flat, smooth mirror surfaces. Other samples (B, E, F, G) have rugged surfaces covered with plenty of facets and pits. Mirror-surface grown Samples A and C have a flat c-plane surface fully immune from facets. Nearly mirror-surface grown Sample D includes about 10% facet regions.
  • the GaN surfaces of all the samples are ground. Then, the surfaces are finished by a polishing machine till the roughness attains to less than Rmax1.5nm.
  • the samples are shaped as mirror wafers.
  • Sample A grows without the mask.
  • Sample B belongs to this invention.
  • Sample A is a mirror-surface GaN crystal grown on the conditions of a higher temperature, lower NH 3 partial pressure and lower HCI partial pressure.
  • the EPD of Sample A is 10 8 cm -2 which is higher than the prior EPD level of 10 7 cm -2 .
  • the samples are sliced into thin film.
  • the defects are investigated in the vertical direction by the TEM observation.
  • Linear defect assemblies vertical to the surface are seen at the centers of the growing pits comprising facets which are the centers of the etch pits.
  • Planar defect assemblies containing the linear defect assemblies are observed.
  • a plurality of dislocations are observed at the centers of the pits. However, few dislocations exist at the other parts except the centers of the pits.
  • the cathode luminescence shows the existence of deformed pits having round walls deviating from an exact hexagon. However, the effect of decreasing dislocations is equivalent to the exact hexagonal concave pits.
  • the GaN wafers are estimated. Three typical wafers are chosen. Sample S is taken from the bottom part near the substrate. Sample T is taken from the middle part. Sample U is cut from the top part. The EPD is measured for the samples by the method similar to Embodiment 1. ⁇ Sample S EPD: 7 ⁇ 10 3 cm -2 ⁇ Sample T EPD: 5 ⁇ 10 3 cm -2 ⁇ Sample U EPD: 3 ⁇ 10 3 cm -2

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
EP07004045A 1999-09-28 2000-09-27 Substrat monocristallin de GaN Withdrawn EP1818429A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27388299A JP4145437B2 (ja) 1999-09-28 1999-09-28 単結晶ＧａＮの結晶成長方法及び単結晶ＧａＮ基板の製造方法と単結晶ＧａＮ基板
EP00121025A EP1088914B1 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance de GaN monocristallin, procédé pour la préparation d'un substrat de GaN monocristallin et le substrat ainsi obtenu

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP00121025A Division EP1088914B1 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance de GaN monocristallin, procédé pour la préparation d'un substrat de GaN monocristallin et le substrat ainsi obtenu
EP00121025.1 Division 2000-09-27

Publications (2)

Publication Number Publication Date
EP1818429A2 true EP1818429A2 (fr) 2007-08-15
EP1818429A3 EP1818429A3 (fr) 2010-07-21

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Family Applications (3)

Application Number Title Priority Date Filing Date
EP00121025A Expired - Lifetime EP1088914B1 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance de GaN monocristallin, procédé pour la préparation d'un substrat de GaN monocristallin et le substrat ainsi obtenu
EP06025258A Withdrawn EP1775355A3 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance d'un monocristal de nitrure de gallium
EP07004045A Withdrawn EP1818429A3 (fr) 1999-09-28 2000-09-27 Substrat monocristallin de GaN

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP00121025A Expired - Lifetime EP1088914B1 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance de GaN monocristallin, procédé pour la préparation d'un substrat de GaN monocristallin et le substrat ainsi obtenu
EP06025258A Withdrawn EP1775355A3 (fr) 1999-09-28 2000-09-27 Procédé pour la croissance d'un monocristal de nitrure de gallium

Country Status (7)

Country Link
US (1) US6468347B1 (fr)
EP (3) EP1088914B1 (fr)
JP (1) JP4145437B2 (fr)
KR (1) KR100404865B1 (fr)
CN (3) CN1273654C (fr)
DE (1) DE60033610T2 (fr)
TW (1) TW508836B (fr)

Cited By (6)

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WO2009151642A1 (fr) * 2008-06-12 2009-12-17 Sixpoint Materials, Inc. Procédé de mise à l'essai de tranches de nitrure du groupe iii et tranches de nitrure du groupe iii avec des données d'essai
US8236267B2 (en) 2008-06-04 2012-08-07 Sixpoint Materials, Inc. High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal
US8728234B2 (en) 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
US8764903B2 (en) 2009-05-05 2014-07-01 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
US8852341B2 (en) 2008-11-24 2014-10-07 Sixpoint Materials, Inc. Methods for producing GaN nutrient for ammonothermal growth
US9803293B2 (en) 2008-02-25 2017-10-31 Sixpoint Materials, Inc. Method for producing group III-nitride wafers and group III-nitride wafers

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US9441311B2 (en) 2006-04-07 2016-09-13 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
US10087548B2 (en) 2006-04-07 2018-10-02 Sixpoint Materials, Inc. High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal
US9803293B2 (en) 2008-02-25 2017-10-31 Sixpoint Materials, Inc. Method for producing group III-nitride wafers and group III-nitride wafers
US8236267B2 (en) 2008-06-04 2012-08-07 Sixpoint Materials, Inc. High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal
US8728234B2 (en) 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
US9985102B2 (en) 2008-06-04 2018-05-29 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
WO2009151642A1 (fr) * 2008-06-12 2009-12-17 Sixpoint Materials, Inc. Procédé de mise à l'essai de tranches de nitrure du groupe iii et tranches de nitrure du groupe iii avec des données d'essai
US8357243B2 (en) 2008-06-12 2013-01-22 Sixpoint Materials, Inc. Method for testing group III-nitride wafers and group III-nitride wafers with test data
US8557043B2 (en) 2008-06-12 2013-10-15 Sixpoint Materials, Inc. Method for testing group III-nitride wafers and group III-nitride wafers with test data
US8585822B2 (en) 2008-06-12 2013-11-19 Sixpoint Materials, Inc. Method for testing group III-nitride wafers and group III-nitride wafers with test data
US8852341B2 (en) 2008-11-24 2014-10-07 Sixpoint Materials, Inc. Methods for producing GaN nutrient for ammonothermal growth
US8764903B2 (en) 2009-05-05 2014-07-01 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride

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CN100477089C (zh) 2009-04-08
DE60033610D1 (de) 2007-04-12
EP1088914B1 (fr) 2007-02-28
CN1273654C (zh) 2006-09-06
KR100404865B1 (ko) 2003-11-07
EP1088914A1 (fr) 2001-04-04
CN1870223A (zh) 2006-11-29
TW508836B (en) 2002-11-01
JP2001102307A (ja) 2001-04-13
KR20010050558A (ko) 2001-06-15
JP4145437B2 (ja) 2008-09-03
US6468347B1 (en) 2002-10-22
DE60033610T2 (de) 2007-06-21
CN1289865A (zh) 2001-04-04
EP1818429A3 (fr) 2010-07-21
CN1908251A (zh) 2007-02-07
EP1775355A3 (fr) 2010-06-02
CN1908251B (zh) 2010-07-28
EP1775355A2 (fr) 2007-04-18
HK1094484A1 (zh) 2007-03-30

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