EP1935064A1 - Schleifringkörper zur kontinuierlichen stromübertragung - Google Patents
Schleifringkörper zur kontinuierlichen stromübertragungInfo
- Publication number
- EP1935064A1 EP1935064A1 EP06806060A EP06806060A EP1935064A1 EP 1935064 A1 EP1935064 A1 EP 1935064A1 EP 06806060 A EP06806060 A EP 06806060A EP 06806060 A EP06806060 A EP 06806060A EP 1935064 A1 EP1935064 A1 EP 1935064A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- slip ring
- nickel
- gold
- ring body
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 16
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 6
- 239000003353 gold alloy Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 63
- 229910052759 nickel Inorganic materials 0.000 claims description 32
- 230000005540 biological transmission Effects 0.000 claims description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- -1 platinum group metals Chemical class 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000005275 alloying Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000012876 carrier material Substances 0.000 claims 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 3
- 229910001369 Brass Inorganic materials 0.000 description 7
- 239000010951 brass Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 229910015373 AuCo Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- OVKMDTVKFLNYRN-UHFFFAOYSA-N [Cd].[Cu].[Au] Chemical compound [Cd].[Cu].[Au] OVKMDTVKFLNYRN-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/022—Details for dynamo electric machines characterised by the materials used, e.g. ceramics
- H01R39/025—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/08—Slip-rings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49009—Dynamoelectric machine
- Y10T29/49011—Commutator or slip ring assembly
Definitions
- the present invention relates to slip ring bodies for slip ring transformers for continuous power transmission and a galvanic process for their preparation.
- Rotary current transformers with contact systems made of stainless steel or precious metal coatings are mainly used when high demands are placed on the quality (voltage fluctuation during rotation) of the current transmission, service life and ease of maintenance. There is a distinction between sliding contacts with and without power interruption:
- Typical designs for continuous power transmission are cylindrical slip ring transformers or flat transmission systems with printed circuit boards.
- the electrical load spectrum ranges from data ( ⁇ 1A) to power transmission (100-500A).
- For transferring higher currents (> 2A) depending on the application, several precious metal sliding contacts are arranged in parallel on a grinding path.
- load currents of up to 500 A can be transmitted.
- a simple gold-cobalt plating on a nickel-plated copper-based support exhibits variations in voltage drop and thus interferes with transmission performance. After about 3 to 5 million revolutions, the voltage drop increases very significantly, so that the slip ring is no longer useful.
- Galvanic layer systems have at least two different layers on a support.
- Conventional galvanic layer systems for power transmission have on a brass substrate on an approximately 0.5 micron thick copper layer and applied thereto 2 to 5 microns thick nickel layer on which in turn a gold-copper-cadmium layer is applied in a thickness of 5 to 15 microns , With this layer system, a longer service life is achieved compared to simple galvanic layers on a carrier. However, a significantly increased voltage drop is tolerated compared to a simple gold-cobalt coating. In addition, cadmium is undesirable for environmental or health reasons.
- the sliding contact surface on a hard base is made thinner than hitherto usual. This allows the voltage drop with previously unattainable quality (variations in voltage drop) to 5 000 000 revolutions to a constant value well below 0.5 V at 2 A to lower. In the course to at least 10 000 000 revolutions is still at least as good a quality achieved, as was previously achievable in the prior art for the first 1 000 000 revolutions.
- the hardness must in any case be higher than the hardness of the nickel previously used as a diffusion barrier layer. Platinum group metals and phosphorus doped nickel have sufficient hardness for the present invention.
- the slip ring transformers according to the invention are suitable for all applications of electrical energy and data transmission for rotating systems, in particular wind turbines, robots, welding robots, cable drums and radar systems, for all of which a permanently routed electrical connection would be unusable.
- the layer thickness of the sliding contact surface made of gold or a hard gold alloy is significantly reduced. According to the invention, not only a considerable reduction of the gold consumption is made possible, but also a prolonged duration.
- the present invention enables a reduction of the suitable depending on the application layer thickness of the sliding contact surface of gold or hard gold by at least 30%, in particular by at least 50%.
- Layer thicknesses of less than 10 .mu.m, in particular 1 to 5 .mu.m, preferably 2 to 3 .mu.m, have proven successful, in particular when using noble metal grinder wires made of Hera 277 (AuPdAg alloy). Over 15 microns, the gold order is increasingly uneconomical.
- the abrasion determines a minimum layer thickness with regard to the service life.
- the sliding contact surface of a sliding contact track is expediently web-shaped.
- the web may be disposed axially on the surface of a disk or radially on the outside of a ring.
- the sliding contact surface as a web on a sliding contact disk is usefully disc-shaped. On a disc, several tracks can be arranged radially next to each other. Circuit boards have proven themselves for this design.
- the sliding contact surface as a track on a sliding contact ring is usefully ring-shaped.
- Several rings can be arranged axially on one axis.
- Sliding contact surfaces made of a gold alloy, which has cobalt or nickel, have proven successful.
- Suitable gold-cobalt alloys or gold-nickel alloys have 50 to 99.8% by weight of gold, 0.2 to 20% by weight of cobalt or nickel, and 0 to 30% of other alloying constituents.
- Other noble metals, copper and dopants with boron, carbon, silicon or phosphorus are suitable as further alloy constituents.
- the supporting base in particular an intermediate layer arranged on a nickel-plated carrier, consists of a hard material which supports the sliding contact surface, in particular the hardest material of the composite.
- a supporting base in particular an intermediate layer made of one or more platinum group metals (PGM) or alloys thereof or hardened nickel, has proved suitable.
- PGM platinum group metals
- a galvanic Pd deposition on a nickel-plated carrier has proved successful from a copper alloy such as brass, bronze or CuZr. To a limited extent, platinum group metals can be replaced by ferrous metals.
- a doping with B, C, Si, or P increases the hardness.
- a diffusion barrier layer of nickel the harder intermediate layer. If the intermediate layer of phosphorus-hardened nickel is carried out, the platinum group metals can be saved.
- a copper-based support e.g. Brass arranged a diffusion barrier layer of nickel.
- An intermediate layer of phosphorus-hardened nickel is deposited on the nickel diffusion barrier layer.
- a nickel-containing hard gold layer is applied as a sliding contact surface.
- the electrically conductive composite of sliding contact surface and the supporting intermediate layer in a thickness between 3 and 10 .mu.m, in particular between 4 and 8 microns and more preferably between 5 and 7 microns.
- the electrically conductive carrier is preferably a copper alloy.
- Proven copper alloys for continuous power transmission include zinc (brass), tin (bronze) or zirconium.
- the supporting base may be separated from the sliding contact surface by a thin layer, for example a diffusion barrier layer or an adhesion promoter. It is recommended that such a layer does not run over 1 micron thickness, since with increasing layer thickness of the thin layer, the supporting function of the supporting base is impaired.
- a thin layer for example a diffusion barrier layer or an adhesion promoter. It is recommended that such a layer does not run over 1 micron thickness, since with increasing layer thickness of the thin layer, the supporting function of the supporting base is impaired.
- the sliding contact surface with hardened underlay according to the invention is used as the surface of a slip ring transmitter (in particular in wind turbines or industrial robots) for the transmission of control signals, control and generator currents.
- a slip ring transmitter in particular in wind turbines or industrial robots
- FIG. 1 shows the voltage drop as a function of the revolutions for the sliding contact surface according to the invention
- FIG. 2 shows an oscillogram at the beginning of the current transmission in accordance with the invention
- Figure 3 shows an oscillogram after 4,000,000 revolutions
- Figure 4 shows an oscillogram after 10 000 000 revolutions
- Figs. 5a and 5b show slipring assemblies
- FIG. 6 shows a test arrangement for determining the voltage drop and the quality
- FIGS. 7 to 9 show comparative diagrams to FIG. 1;
- FIGS. 10 to 12 show comparison oscillograms to FIG. 2;
- Figs. 13 to 15 show comparative oscillograms to Fig. 3;
- Figures 16 to 18 show comparative oscillograms to Figure 4.
- a current transformer is designed as a ring, wherein the sliding contact surface is arranged on the outer surface of the ring.
- 2 .mu.m nickel are galvanically deposited on the outside of a brass or bronze ring and then 5 .mu.m nickel phosphorus.
- the nickel-phosphorus layer the nickel is doped with phosphorus, making the layer significantly harder than the nickel layer underlying the nickel-phosphorus layer.
- 4 ⁇ m of a gold-nickel alloy are deposited galvanically on the phosphorus-doped nickel layer. Compared to a slip ring without hardened nickel layer better quality of power transmission and higher wear resistance is achieved.
- a brass ring is galvanically provided on its outside with a 4 ⁇ m nickel layer. On this nickel layer, a 5 .mu.m thick palladium layer is applied galvanically. On the palladium layer, a hard gold alloy of gold and cobalt is applied in a thickness of 5 microns.
- the current transformer produced in this way is evaluated in an arrangement according to FIG. The two wiper wires are driven on different tracks.
- the sliding contact consists of Hera 277 (AuAgPd alloy).
- the voltage drop is shown at the beginning of the experiment.
- the oscillogram according to FIG. 2 shows the voltage drop after 4 million revolutions and the oscillogram according to FIG. 3 shows the voltage drop after 10 million revolutions.
- the trigger signal is recorded as a square pulse.
- the zero line for the voltage signal is always the top line of the second box from below.
- the voltage drop as a function of the revolutions is shown in the diagram according to FIG.
- the dotted line represents the upper value from the oscillograms, the dotted line the lower and the solid line the average.
- a plurality of slider tracks can be arranged radially on a disk.
- the disc is similarly coated on one of the disc surfaces, as previously described for the outer surfaces of the rings.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Wind Motors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005047799A DE102005047799A1 (de) | 2005-10-05 | 2005-10-05 | Schleifringkörper zur kontinuierlichen Stromübertragung |
| PCT/EP2006/009651 WO2007039302A1 (de) | 2005-10-05 | 2006-10-05 | Schleifringkörper zur kontinuierlichen stromübertragung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1935064A1 true EP1935064A1 (de) | 2008-06-25 |
Family
ID=37634194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06806060A Withdrawn EP1935064A1 (de) | 2005-10-05 | 2006-10-05 | Schleifringkörper zur kontinuierlichen stromübertragung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090058219A1 (de) |
| EP (1) | EP1935064A1 (de) |
| JP (1) | JP2009533544A (de) |
| CN (1) | CN101278449A (de) |
| DE (1) | DE102005047799A1 (de) |
| WO (1) | WO2007039302A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010048189B4 (de) * | 2010-10-13 | 2012-11-15 | Heraeus Materials Technology Gmbh & Co. Kg | Edelmetallhaltiges Kontaktstück auf einem Federträger mit rotationssymmetrischem Biegemoment |
| DE102011015579B4 (de) * | 2011-03-30 | 2017-03-23 | Heraeus Deutschland GmbH & Co. KG | Elastischer Schleifkontakt und Verfahren zu dessen Herstellung |
| CN103460524A (zh) * | 2011-04-04 | 2013-12-18 | Gat传动技术有限公司 | 用于传输电信号的滑环 |
| DE102011106518B4 (de) * | 2011-06-15 | 2017-12-28 | Heraeus Deutschland GmbH & Co. KG | Draht für Schleifkontakte und Schleifkontakte |
| EP3605751B1 (de) | 2013-08-16 | 2021-10-06 | Schleifring GmbH | Schleifringanordnung und komponenten davon |
| CN113394637B (zh) * | 2021-05-31 | 2023-09-01 | 扬州海通电子科技有限公司 | 一种多接触模块滑环的电流分布调节方法 |
| IT202300020190A1 (it) * | 2023-09-29 | 2025-03-29 | Spm Special Machine S R L | Gruppo di conduzione di corrente elettrica |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5066550A (en) * | 1989-07-27 | 1991-11-19 | Yazaki Corporation | Electric contact |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469704A (en) * | 1977-11-15 | 1979-06-05 | Matsushita Electric Works Ltd | Commutating device for motor |
| US4337133A (en) * | 1979-06-20 | 1982-06-29 | Bell Telephone Laboratories, Incorporated | Hard gold surfaces |
| US4281328A (en) * | 1980-01-28 | 1981-07-28 | General Dynamics, Pomona Division | Slip ring assembly |
| JPS595581A (ja) * | 1982-06-30 | 1984-01-12 | 田中貴金属工業株式会社 | 整流子用接触片材料 |
| US4480014A (en) * | 1983-10-26 | 1984-10-30 | At&T Technologies, Inc. | Electrical contact means with gold-nickel alloy overlay |
| DD221885A1 (de) * | 1983-11-29 | 1985-05-02 | Elektromasch Forsch Entw | Elektrischer gleitkontakt, insbesondere fuer kommutierungssysteme |
| DE3476684D1 (en) * | 1984-05-11 | 1989-03-16 | Burlington Industries Inc | Amorphous transition metal alloy, thin gold coated, electrical contact |
| GB2186597B (en) * | 1986-02-17 | 1990-04-04 | Plessey Co Plc | Electrical contact surface coating |
| IN166545B (de) * | 1986-06-30 | 1990-06-02 | Siemens Ag | |
| JP2992622B2 (ja) * | 1990-12-29 | 1999-12-20 | 株式会社徳力本店 | 摺動接触材料 |
| US6984915B2 (en) * | 2002-01-22 | 2006-01-10 | Electro-Tec Corp. | Electrical slip ring platter multilayer printed circuit board and method for making same |
| JP4362599B2 (ja) * | 2004-03-05 | 2009-11-11 | Dowaメタルテック株式会社 | 金属部材およびそれを用いた電気接点 |
-
2005
- 2005-10-05 DE DE102005047799A patent/DE102005047799A1/de not_active Ceased
-
2006
- 2006-10-05 EP EP06806060A patent/EP1935064A1/de not_active Withdrawn
- 2006-10-05 WO PCT/EP2006/009651 patent/WO2007039302A1/de not_active Ceased
- 2006-10-05 JP JP2008533940A patent/JP2009533544A/ja active Pending
- 2006-10-05 CN CNA2006800365485A patent/CN101278449A/zh active Pending
-
2008
- 2008-04-04 US US12/062,614 patent/US20090058219A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5066550A (en) * | 1989-07-27 | 1991-11-19 | Yazaki Corporation | Electric contact |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2007039302A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009533544A (ja) | 2009-09-17 |
| DE102005047799A1 (de) | 2007-05-24 |
| US20090058219A1 (en) | 2009-03-05 |
| WO2007039302A1 (de) | 2007-04-12 |
| CN101278449A (zh) | 2008-10-01 |
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