Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
  • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
  • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
  • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
  • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
  • B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
  • B01L2200/12—Specific details about manufacturing devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/06—Auxiliary integrated devices, integrated components
  • B01L2300/0627—Sensor or part of a sensor is integrated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/06—Auxiliary integrated devices, integrated components
  • B01L2300/0627—Sensor or part of a sensor is integrated
  • B01L2300/0645—Electrodes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/08—Geometry, shape and general structure
  • B01L2300/0887—Laminated structure
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/18—Means for temperature control
  • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
  • B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2400/00—Moving or stopping fluids
  • B01L2400/04—Moving fluids with specific forces or mechanical means
  • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
  • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
  • B01L2400/0427—Electrowetting
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/01—Manufacture or treatment
  • H10W72/015—Manufacture or treatment of bond wires
  • H10W72/01515—Forming coatings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires

Definitions

• the invention relates to the field of fluidic components, applied in particular to biological analysis devices.
• the invention can in particular be applied to fluidic components having, on the one hand, deep structuring (reservoir and / or capillary and / or closure of the component) and, on the other hand, electrode structuring.
• APS components made in CMOS technology are known from, for example, F. Mallard et al., Published in "Biosensors and Bioelectronics," Vol. 20, 2005, p. 1813-1820.
• An APS chip has an active area, itself having a matrix of pixels, surrounded in whole or in part, a zone of microelectronic electronic processing circuits. The latter is surrounded by the area of electrical contacts. These contacts are located at the periphery of the component (on 1, or 2, or 3 or 4 sides).
• a pixel consists of an active zone (photodetector) and an electronic signal preprocessing function zone.
• the detection surface (sum of all the surfaces of the photodetectors) of the detection matrix therefore has a filling rate of much less than 100%.
• FIG. 1 shows a sectional view of the technological stack concerned. This figure represents the structure of a single detector, not a matrix of detectors.
• This figure shows the central zone 2, at the periphery of which the contacts 4 consist of metal studs covered with a passivation layer (oxide) 5.
• the extruded parts of these studs not shown in the figure, allow the resumption of electrical contacts.
• Intermediate zone 6 normally consists of electronic signal processing functions coming from the central detection zone 2.
• the chip is glued on a support memory film 12, of the PCB type, comprising two metal levels: one on each face and a level 14 of via allowing contacting of the two faces.
• a contact connection 16 with the memory film 12 is performed to resume the electrical contacts of the chip.
• a passivation resin 18 is deposited and crosslinked over the whole of this connection to protect the entire electrical part of the component (contacts on the chip, connection wires and electrical side of the memory film).
• the memory film carrying the chip is assembled with a cover 20, comprising fluidic structures to form a fluid cavity, carried on the component.
• the resin covers all the metal surfaces, while having a minimum distribution on the surface of the chip, otherwise encroach on the active area.
• 500 ⁇ m is to be expected between the contacts and the active area of the chip. This represents an important lost place on the chip.
• the thickness of the resin 18 above the surface of the chip-memory film assembly 12 is a parameter that is not very reproducible. This adds an additional constraint to the depth of the fluidics of the component. This constraint considerably limits any work on the reduction of the volume of the fluidic cavity.
• the implementation of a bonnet carryover implies the existence of a transfer zone 13 between this cover and the support of the detection chip, a transfer zone that must be sealed, resulting in an enlargement additional room.
• the non-reproducible nature of the form of the passivation following the creep of the resin 18 does not allow good control of the fluid flows in the component, and for example imposes dead zones in the corners of the components.
• the volume of the fluidic part defined in fact by the depth p structured in the cover 20, is difficult to reproduce.
• this assembly architecture imposes, in the biological reaction chamber, the presence of a resin or a polymer whose nature must be taken into account in the development of biological protocols. Functionalization (for example by biological probes) before assembly is also problematic. The presence of metals (such as electrical contact recovery pads) on the surface of the chip renders unusable any biological functionalization protocol that uses oxidation or reduction steps, with bases and acids.
• the fluidic part of the component is produced on a 350 ⁇ m thick substrate and a depth of 72 ⁇ m ⁇ 4 ⁇ m (for 60 minutes of etching). There remains a thickness of silicon, of the order of 278 microns, under the fluidic part.
• the realized detector collects the electron-hole pairs created by the absorption of the photons coming from the fluidic part of the component. Given the absorption of silicon, these pairs are created in a layer of the order of 10 microns thick, under the fluidic part. These pairs are collected by the junctions made on the back of the component. They must therefore travel a thick silicon (262 microns) before being collected by the junctions.
• Figure 4 of this document shows a chip of 1 x 2 cm 2 , with 9 times of electrical contact, which represents at best 4 detectors on the chip.
• the photodetector technology used in this document is therefore atypical and allows only one component that provides a number of constraints.
• the last step of producing an APS chip (and CMOS in general), before chip cutting usually consists in performing a step of thinning substrates to facilitate the packaging steps.
• the substrates are thinned to a thickness of, for example, between 700 ⁇ m and 100 ⁇ m. It also seeks a structure, and a method for achieving it, in which the problems posed by the implementation of a transfer technique, in particular the alignment of the fluidic vis-à-vis the active surface, do not do not arise.
• the invention relates to a chip or a fluidic component or an analysis device comprising: at least one substrate made of a material that can be etched, and an etching stop layer of this material, this layer having a first and a second side,
• a fluidic part for receiving said fluid, produced in the substrate, from the second side of the etch stop layer.
• the means for detecting at least one property of a fluid and / or for activating this fluid are produced on a first side of the etch stop layer: one and / or the other of these means may be formed in or on the etch stop layer, or in or on a layer on the barrier layer.
• Means for detecting the properties of a fluid are means that make it possible to characterize one or more physical and / or chemical properties of this fluid, for example temperature, and / or the photonic activity, and / or the pH, and / or the salinity, and / or the electrochemical potential, etc.
• Means for activating a fluid are means that make it possible to modify one or more physical and / or chemical properties of this fluid, for example means of heating, and / or agitation and / or illumination of the fluid. fluid.
• a face of a component comprising a stop layer for example the rear face of an APS chip, is used for producing the fluidic part of the device in at least part of the substrate that would otherwise be, according to the known techniques, eliminated.
• the fluidic part and the detection and / or activation part are separated by the stop layer. The latter eliminates any flow or fluid communication between the fluidic part and the detection and / or activation part.
• the component according to the invention further comprises a cover which closes the fluidic part.
• This cover is preferably placed in a sealed manner.
• the seal can be obtained by depositing an epoxy adhesive by screen printing, prior to assembly of the fluid component and the cover. Such an assembly method is described in patent application WO-A-2004/112961, in the names of the applicants.
• the assembly of the cover and the fluid component, facing the fluidic part is reversible.
• the cover comprises fluidic communication means allowing a fluidic exchange between the fluidic part and any external fluidic element.
• fluidic communication means may be, for example, through holes surmounted by a connector base, for connecting the fluid component to a pump or a pressure tank.
• the cover may be constituted by a more complex fluidic element, such as a fluidic card, for example of the "Lab on a card” type, or a microfluidic component.
• this microfluidic component is a fluidic component according to the invention.
• a surface layer may also be formed on the barrier layer, on the side of the detection and / or activation means.
• the detection / and or activation means are formed in a surface layer on the stop layer of the fluid component.
• This layer is preferably made of a semiconductor material.
• the barrier layer and the substrate may be the three layers of an SOI (silicon on insultor) substrate.
• Detection means may be at least partly made in or on this surface layer.
• an SOI substrate for producing the detector part for example in a CMOS technology
• the chip or the fluid component or the analysis device according to the invention are used for example in a CMOS technology.
• the fluidic part is thus defined in, or under, the chip, the latter being for example made in a CMOS technology.
• the barrier layer forms a stop layer of the etching on the rear face to define the depth of the fluidic part of the component in the support.
• the latter is for example silicon or, more generally, semiconductor material.
• the detection means may comprise at least one photodetector.
• a device according to the invention may further comprise a passivation and / or stiffening layer.
• This layer is made for example of silicon oxide directly on the detection / activation means or on the surface layer.
• Means for detecting electrical properties of a fluid can be made, for example at least in part in the etch stop layer.
• Part of these means is in contact with the fluidic part.
• means for activating a fluid by electrowetting may also be carried out, possibly with electronic means for controlling the means for activating a fluid by electrowetting.
• Fluid reservoirs may also be made in the substrate.
• the barrier layer, and optionally the surface layer formed on the barrier layer have a thickness less than 10 microns.
• the fluidic part which makes it possible to receive a fluid, can have a well-controlled depth, for example less than 300 ⁇ m or 100 ⁇ m.
• the detection and / or activation means may be connected to depassivated electrodes located on the first side of said etch stop layer.
• the invention also makes it possible to produce a matrix of high density detectors comprising a plurality of components as described above, separated from each other by a distance less than
• the technology for producing the fluidic part is therefore adapted to a microelectronic technology, for example of the CMOS type.
• Deep etching of the semiconductor material of the support is carried out, so that an emission of photons from the fluid can reach the detection means made on the other side of the component.
• a chip or a component according to the invention may comprise a stiffening substrate.
• Functionalization for example with biological probes, such as nucleic probes, may further be performed in the fluidic portion for receiving the fluid.
• the invention benefits in particular from the possibility of using the APS technology to produce a matrix of high density detectors (at a step which may be less than 10 ⁇ m), which is impossible with the technology described in the prior art. already cited.
• the inlet vias in the fluidic part are not made through the support of the substrate used. Therefore, no useful area is lost on the detection part of the component. This also makes it possible to perform chemical steps - in collective manufacturing - aggressive on the fluidic part, without giving access to the other side of the substrate (to avoid damage to the detection means located on the other side).
• the invention makes it possible to take advantage of the use of an SOI substrate and the associated CMOS technology. It also makes it possible to have an advantageous embodiment of the fluidic part.
• the invention also relates to a method for producing at least one fluidic component comprising: a) selecting a substrate made of a material that can be etched, provided with a stop layer for etching this material, b) the forming means for detecting properties of a fluid and / or activating this fluid, on a first side of said etch stop layer, c) forming a fluidic portion, for receiving said fluid, in the substrate, by etching of this substrate from the second side of the etch stop layer and stopping etching on this barrier layer.
• the latter makes it possible to produce the collective manufacture of the fluidic components. It is therefore possible to produce a plurality of fluidic components according to the invention.
• the method then comprises a final dissociation step of said fluid components, made collectively to make them independent of each other.
• the invention also relates to the use of a component, or a matrix, as described above, for carrying out a biological analysis.
• FIGS. 1 and 2 show a known device, of the APS-CMOS type, without and with protection and definition cap of the fluidic part
• FIGS. 3A and 3B represent components or substrates that can be used in the embodiment of a fluidic component according to the invention
• FIG. 4A schematically represents the implementation of a CMOS component on a semiconductor-on-insulator substrate
• FIG. 4B represents a substrate treated according to the invention with a cover on the side of the fluidic part
• FIGS. 5A and 5B show a device according to the invention with metallic electrodes and contact pickups facing the fluidic part of the component
• FIG. 6 represents a device according to the invention with metal electrodes in the fluidic part of the component and a CMOS structure isolated from the fluidic part by an oxide layer of an SOI substrate
• - Figures 7 and 8 show devices according to the invention with electrowetting displacement means.
• a simplified version of a detection chip is shown below, by the representation of a minimum version, for example of a single photodetector with two zones. implantation and two electrical contacts.
• the invention encompasses the embodiment with one or more more complex components.
• a stop layer is used to etch the fluidic part (or means for receiving a fluid) of a fluidic component, this stop layer possibly resulting, for example, from oxidation.
• FIG. 3A is shown a silicon substrate 70 on which a surface layer 72 is obtained by oxidation.
• the layer 72 could be a Si3N 4 silicon nitride layer.
• the layer 72 and the substrate 70 form a single substrate.
• FIG. 3B shows an SOI substrate 30, which typically comprises a support 32 made of semiconductor material, a layer 34 of dielectric material, and a surface layer 36 of semiconductor material
• the layer 72 or the layer 34 will serve as a stop layer during a step of etching the fluidic part in the substrate 70 or in the support 32.
• the fluidic portion can be easily made, its depth d being determined solely by the thickness of the part of the substrate or the support located under the barrier layer, minus any partial thinning of the substrate.
• the layer 72 (or all of the two layers 34 and 36) has a thickness e of a few ⁇ m, for example between 1 ⁇ m and 10 ⁇ m, while the substrate 70 or the support 32 has a thickness less than a few hundreds of ⁇ m, for example less than 500 ⁇ m or between 10 ⁇ m and 50 ⁇ m or 90 ⁇ m or between 10 ⁇ m and 300 ⁇ m.
• the present invention makes it possible to avoid the transfer techniques with alignment of the fluidic part on the detection or activation part, as explained below in the various examples.
• FIG. 4A shows, in the case of a CMOS chip, how this can be performed on an SOI substrate in the context of a device according to the present invention.
• a detector 38 here based on a component derived from CMOS technology, is formed in or on the SOI substrate semiconductor surface layer 36 on a first side of the barrier layer. Electrodes 37, 39 make it possible to ensure contacts with the detector. The assembly is disposed on the front face 41 of the SOI substrate.
• a method of producing the chip or detector 38 may be a known method applied to an SOI substrate. Thus known CMOS techniques are used to make the chip or detector.
• Figure 4B shows how can be arranged, directly under the chip, a second side of the barrier layer, a portion or a fluid chamber 40 of the component, by deep etching back of the SOI substrate.
• the support 32 is etched, the layer 34 forming a stop layer for etching.
• a passivation layer may be formed on the front face 41 of the detection part of the chip before performing the deep etching on the rear face 43. It is eliminated after this step of deep engraving.
• a stiffening substrate may be removably or not assembled on the front face 41 to prevent embrittlement of the substrate 32 during the deep etching step.
• the fluidic part of a device according to the invention is thus controlled. Indeed, by a method according to the invention, the steps of producing the fluidics implement alignment methods, such as those used in micro technology, which ensure positioning accuracy and collective manufacturing.
• the invention makes it possible to avoid the precise control phase of the the engraving depth. Indeed, in the invention, it stops on the barrier layer, here the layer 34 of silicon oxide.
• a cover 49 which is preferably plane, is assembled with the fluidic component. This cover is for example glass, silicon, plastic or metal.
• Such a component is compatible with the functionalization processes of the substrates.
• the part or the fluidic chamber is made on the face opposite to that carrying the electrical part 38 of the substrate, it is possible to carry out functionalization chemical steps on a face 45 of the substrate, fluidic side, without touching its other face. It is therefore possible to carry out these steps on the side of the fluidic part 40 and then possibly locate biological probes at the bottom of this fluidic part.
• the component thus produced is compatible with a functionalization chemistry, as described in FR 2 818 662, of placing biological probes inside the fluidic part.
• the invention makes good use of the support portion 32 of semiconductor material, here silicon, which is considered unnecessary in the context of known techniques and often removed by thinning of the substrate after manufacture of the chip.
• the invention does not require passivation of contact recovery electrodes 37, 39, since these are located on the face 41 of the substrate (on the side of the stop layer dedicated to the detection), opposite the face 43 from which the fluidic portion or chamber 40 (on the other side of the barrier layer) is made.
• no fluid communication is established between these two faces 41, 43 or between the chamber 40 and the detection part.
• the study of the interface zone 33 between the fluidic part and the barrier layer can easily show that there has been no transfer, but that one and the same substrate has been used for both parts.
• the invention furthermore avoids the loss of space which would have been necessary on the component to allow a passivation resin (such as the resin 18 of FIG. 2) to flow or to seal the fluidic part of the component (because in particular a transfer step, such as that for deferring the cover 20 in the case of Figure 2).
• a passivation resin such as the resin 18 of FIG. 2
• CMOS complementary metal-oxide-semiconductor
• BiCMOS complementary metal-oxide-semiconductor
• a fluidic component according to the invention is directly compatible with the technique of postponements on circuit (contacts by microbeads, etc.) of "pick and place” type, techniques which are already developed for silicon chips. This is the postponement of the component completed on an external circuit.
• the invention provides a real simplification with regard to the packaging and implementation of the component.
• the invention may have other applications than that explained above, with the same advantages as those mentioned above.
• a electrical detection for example by CMOS chip, can also be carried out within the scope of the invention.
• CMOS chip it is possible, during the formation of the CMOS chip, to produce one of the metal levels by etching the entire semiconductor surface layer of the front face of an SOI substrate 30 (see structure of FIG. 3B ) to the layer 34 of silicon oxide, which forms a barrier layer on the support 32.
• Metal electrodes 50 which will be opposite the portion or the fluid chamber 40 in the final component, are then formed .
• the etching of the fluidic part 40 of the component is then possible, as in the previous embodiment, from the rear face of the SOI, with a stop on the oxide 34 and on the metal layer of the chip.
• Electric vias 52 are made through the layer 34 to connect the electrodes 50 to passivated contacts 56, located on the other side 35, not exposed to the fluid, of the layer 34.
• the electrodes 50, exposed to a fluid located in the fluidic part 40, will allow access to electrical properties of the latter.
• the semiconductor surface layer 36 of the front face may not be eliminated: thus, in FIG. 5B, there is shown an embodiment in which part of this surface layer 36 of semiconductor remains. In this In this case, the contacts 56 can be formed on the front face of this same layer 36.
• the component of FIG. 5A can also be obtained starting from a starting substrate such as that of FIG. 3A, comprising a substrate 70 with a surface barrier layer.
• CMOS structure 60 is formed in the layer 36 and is isolated from the fluidic portion of the component by the oxide layer 34 of the SOI substrate.
• the reference 65 designates a passivation layer on the front face 41 of the substrate.
• Contact resumptions 67, 69 are also formed on the front face and partially depassivated.
• the technology for moving and handling drops or fluids by electrowetting known for example from document FR 2 841 063 or the article by MG Polack et al. "Electrowetting based actuation of droplets for integrated microfluidics", Lab Chip, 2002, 2, 96-101, can also be used in the production of a device according to the invention. It implements a fluidic structuring around the areas of metal electrodes electrowetting. In combination with such a fluid displacement component by electrowetting, one can also make reagent distribution tanks or define a closed volume of the active part of the component, or define a volume of oil.
• the invention can, again, be used to provide a simplification of the packaging and use of such components.
• a semiconductor substrate 70 may be used as a starting board, such as that illustrated in FIG. Figure 3A, in place of an SOI substrate ( Figure 7).
• It may be a silicon substrate 70, oxidized to obtain a desired thickness of dielectric layer 72 to provide the isolation function of the electrowetting device.
• the metal electrodes 74 are then formed on the surface of this oxide 72 without it being necessary to passivate the front face 79.
• the fluidic part or the fluidic structuring can then be carried out, as in the other embodiments, by the face back of the substrate, using silicon oxide 72 as a barrier layer.
• a deposit of hydrophobic material 80 may be made on the rear face, in order to promote the effect of electrowetting.
• FIG. 7 shows in section a simplified technology of a chip with fluid displacement by electrowetting, with structuring fluidic back.
• the method of etching the fluidic part of the component can be simplified because it does not participate in the definition of the reaction volume: the latter is defined by the number of electrowetting electrodes activated.
• the fluidic part may comprise several reservoirs: there are three, referenced 71, 73, 75 in Figure 7. Some tanks may be assigned specific functions: for example, the reservoir 75 may be a reaction zone and displacement of drops, these drops can be brought adjacent tanks 71, 73.
• a layer 77 of passivation and stiffening oxide may be formed on the front face of the substrate.
• FIG. 4A again a semiconductor-on-insulator structure with its three levels 32, 34, 36, as in FIGS. 4A and 4B, and electrowiring electrodes 74 made on the front face of an insulating layer 34 covered with a hydrophobic layer 80 on the back.
• Electronic components 60 for example of the CMOS type, are produced in the semiconductor layer 36.
• the other references designate elements that are identical or similar to those of FIG. 7.
• SOI semiconductor on insulator
• any type of detector and / or actuator for example MEMS technology derived from CMOS technology, can be incorporated.
• the fluidic part is carried out after the detection part, since it is preferable to carry out the part with a higher topology at the end. But it is also possible to proceed in reverse order.
• the invention notably makes it possible to produce a fluidic component comprising detection and / or activation means and means - said fluidic means - forming a fluidic part for receiving a fluid, characterized in that:
• the detection and / or activation means are made in or on a surface layer of semiconductor material or in or on the insulating layer of a semiconductor-on-insulator type substrate,
• the fluidic part is disposed in the support part of said semiconductor-on-insulator substrate.

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