EP2154257A4 - Legierung auf cu-ni-si-basis für elektronisches material - Google Patents

Legierung auf cu-ni-si-basis für elektronisches material

Info

Publication number
EP2154257A4
EP2154257A4 EP08739256A EP08739256A EP2154257A4 EP 2154257 A4 EP2154257 A4 EP 2154257A4 EP 08739256 A EP08739256 A EP 08739256A EP 08739256 A EP08739256 A EP 08739256A EP 2154257 A4 EP2154257 A4 EP 2154257A4
Authority
EP
European Patent Office
Prior art keywords
electronic material
alloy based
alloy
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08739256A
Other languages
English (en)
French (fr)
Other versions
EP2154257B1 (de
EP2154257A1 (de
Inventor
Naohiko Era
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2154257A1 publication Critical patent/EP2154257A1/de
Publication of EP2154257A4 publication Critical patent/EP2154257A4/de
Application granted granted Critical
Publication of EP2154257B1 publication Critical patent/EP2154257B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
EP08739256.9A 2007-03-30 2008-03-28 Legierung auf cu-ni-si-basis für elektronisches material Active EP2154257B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094441 2007-03-30
PCT/JP2008/056138 WO2008123433A1 (ja) 2007-03-30 2008-03-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金

Publications (3)

Publication Number Publication Date
EP2154257A1 EP2154257A1 (de) 2010-02-17
EP2154257A4 true EP2154257A4 (de) 2012-01-11
EP2154257B1 EP2154257B1 (de) 2016-10-05

Family

ID=39830918

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08739256.9A Active EP2154257B1 (de) 2007-03-30 2008-03-28 Legierung auf cu-ni-si-basis für elektronisches material

Country Status (7)

Country Link
US (1) US20100086435A1 (de)
EP (1) EP2154257B1 (de)
JP (1) JP4418028B2 (de)
KR (1) KR101211984B1 (de)
CN (1) CN101646792B (de)
TW (1) TWI395824B (de)
WO (1) WO2008123433A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101114147B1 (ko) * 2008-03-31 2012-03-13 후루카와 덴키 고교 가부시키가이샤 전기전자기기용 동합금 재료 및 전기전자부품
WO2009123159A1 (ja) * 2008-03-31 2009-10-08 古河電気工業株式会社 電気電子機器用銅合金材料および電気電子部品
EP2508634B1 (de) * 2009-12-02 2017-08-23 Furukawa Electric Co., Ltd. Verfahren zur herstellung einer kupferlegierungs-folienmaterial mit geringem young-modulus
KR20120130342A (ko) * 2010-04-02 2012-11-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ 계 합금
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5714863B2 (ja) 2010-10-14 2015-05-07 矢崎総業株式会社 雌端子および雌端子の製造方法
JP5712585B2 (ja) * 2010-12-03 2015-05-07 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5684022B2 (ja) * 2011-03-28 2015-03-11 三菱伸銅株式会社 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板およびその製造方法
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
KR101709560B1 (ko) * 2013-09-27 2017-02-23 주식회사 엘지화학 낮은 저항의 전극 탭을 포함하는 이차전지
JP6452472B2 (ja) * 2014-01-27 2019-01-16 古河電気工業株式会社 銅合金材およびその製造方法
CN105385890A (zh) * 2015-11-27 2016-03-09 宁波博威合金材料股份有限公司 一种含镍、硅的青铜合金及其应用
CN105821238B (zh) * 2016-05-31 2018-01-02 黄河科技学院 一种铜合金材料及其制备方法
CN106191725B (zh) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 高强度高导电铜合金纳米相析出工艺方法
CN108193080B (zh) * 2016-12-08 2019-12-17 北京有色金属研究总院 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法
CN109609801A (zh) * 2018-12-06 2019-04-12 宁波博威合金材料股份有限公司 高性能铜合金及其制备方法
CN115386766A (zh) * 2022-08-11 2022-11-25 中国科学院金属研究所 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法
JP7563652B2 (ja) * 2022-10-24 2024-10-08 三菱マテリアル株式会社 金属ａｍ用銅合金粉末および積層造形物の製造方法
TW202435992A (zh) * 2022-10-24 2024-09-16 日商三菱綜合材料股份有限公司 金屬ａｍ銅合金粉末及層合造形物之製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (ja) * 1991-12-27 1993-07-20 Kobe Steel Ltd 曲げ加工性が優れた高力銅合金及びその製造方法
JP2001207229A (ja) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP2005350696A (ja) * 2004-06-08 2005-12-22 Hitachi Cable Ltd 端子・コネクタ用銅合金の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61115249A (ja) 1984-11-09 1986-06-02 Sanyo Electric Co Ltd 電気機械変換器の支持装置
JP2862942B2 (ja) 1990-03-20 1999-03-03 古河電気工業株式会社 コルソン合金の熱処理方法
JPH0718356A (ja) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金、その製造方法およびｉｃリードフレーム
JP4177221B2 (ja) 2003-10-06 2008-11-05 古河電気工業株式会社 電子機器用銅合金
EP1873266B1 (de) * 2005-02-28 2012-04-25 The Furukawa Electric Co., Ltd. Kupferlegierung
CN1776997B (zh) * 2005-12-13 2010-05-05 江苏科技大学 大容量汽轮发电机转子铜合金槽楔及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (ja) * 1991-12-27 1993-07-20 Kobe Steel Ltd 曲げ加工性が優れた高力銅合金及びその製造方法
JP2001207229A (ja) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP2005350696A (ja) * 2004-06-08 2005-12-22 Hitachi Cable Ltd 端子・コネクタ用銅合金の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008123433A1 *

Also Published As

Publication number Publication date
EP2154257B1 (de) 2016-10-05
TW200902732A (en) 2009-01-16
KR101211984B1 (ko) 2012-12-13
KR20090123017A (ko) 2009-12-01
CN101646792A (zh) 2010-02-10
WO2008123433A1 (ja) 2008-10-16
TWI395824B (zh) 2013-05-11
CN101646792B (zh) 2012-02-22
JPWO2008123433A1 (ja) 2010-07-15
US20100086435A1 (en) 2010-04-08
EP2154257A1 (de) 2010-02-17
JP4418028B2 (ja) 2010-02-17

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