TWI395824B - Cu-Ni-Si alloy for electronic materials - Google Patents

Cu-Ni-Si alloy for electronic materials Download PDF

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Publication number
TWI395824B
TWI395824B TW097111276A TW97111276A TWI395824B TW I395824 B TWI395824 B TW I395824B TW 097111276 A TW097111276 A TW 097111276A TW 97111276 A TW97111276 A TW 97111276A TW I395824 B TWI395824 B TW I395824B
Authority
TW
Taiwan
Prior art keywords
mass
alloy
compound
copper alloy
strength
Prior art date
Application number
TW097111276A
Other languages
English (en)
Chinese (zh)
Other versions
TW200902732A (en
Inventor
江良尚彥
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW200902732A publication Critical patent/TW200902732A/zh
Application granted granted Critical
Publication of TWI395824B publication Critical patent/TWI395824B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
TW097111276A 2007-03-30 2008-03-28 Cu-Ni-Si alloy for electronic materials TWI395824B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007094441 2007-03-30

Publications (2)

Publication Number Publication Date
TW200902732A TW200902732A (en) 2009-01-16
TWI395824B true TWI395824B (zh) 2013-05-11

Family

ID=39830918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097111276A TWI395824B (zh) 2007-03-30 2008-03-28 Cu-Ni-Si alloy for electronic materials

Country Status (7)

Country Link
US (1) US20100086435A1 (de)
EP (1) EP2154257B1 (de)
JP (1) JP4418028B2 (de)
KR (1) KR101211984B1 (de)
CN (1) CN101646792B (de)
TW (1) TWI395824B (de)
WO (1) WO2008123433A1 (de)

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KR101114147B1 (ko) * 2008-03-31 2012-03-13 후루카와 덴키 고교 가부시키가이샤 전기전자기기용 동합금 재료 및 전기전자부품
WO2009123159A1 (ja) * 2008-03-31 2009-10-08 古河電気工業株式会社 電気電子機器用銅合金材料および電気電子部品
EP2508634B1 (de) * 2009-12-02 2017-08-23 Furukawa Electric Co., Ltd. Verfahren zur herstellung einer kupferlegierungs-folienmaterial mit geringem young-modulus
KR20120130342A (ko) * 2010-04-02 2012-11-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ 계 합금
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5714863B2 (ja) 2010-10-14 2015-05-07 矢崎総業株式会社 雌端子および雌端子の製造方法
JP5712585B2 (ja) * 2010-12-03 2015-05-07 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5684022B2 (ja) * 2011-03-28 2015-03-11 三菱伸銅株式会社 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板およびその製造方法
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
KR101709560B1 (ko) * 2013-09-27 2017-02-23 주식회사 엘지화학 낮은 저항의 전극 탭을 포함하는 이차전지
JP6452472B2 (ja) * 2014-01-27 2019-01-16 古河電気工業株式会社 銅合金材およびその製造方法
CN105385890A (zh) * 2015-11-27 2016-03-09 宁波博威合金材料股份有限公司 一种含镍、硅的青铜合金及其应用
CN105821238B (zh) * 2016-05-31 2018-01-02 黄河科技学院 一种铜合金材料及其制备方法
CN106191725B (zh) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 高强度高导电铜合金纳米相析出工艺方法
CN108193080B (zh) * 2016-12-08 2019-12-17 北京有色金属研究总院 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法
CN109609801A (zh) * 2018-12-06 2019-04-12 宁波博威合金材料股份有限公司 高性能铜合金及其制备方法
CN115386766A (zh) * 2022-08-11 2022-11-25 中国科学院金属研究所 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法
JP7563652B2 (ja) * 2022-10-24 2024-10-08 三菱マテリアル株式会社 金属ａｍ用銅合金粉末および積層造形物の製造方法
TW202435992A (zh) * 2022-10-24 2024-09-16 日商三菱綜合材料股份有限公司 金屬ａｍ銅合金粉末及層合造形物之製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093140A1 (ja) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. 銅合金

Family Cites Families (8)

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JPS61115249A (ja) 1984-11-09 1986-06-02 Sanyo Electric Co Ltd 電気機械変換器の支持装置
JP2862942B2 (ja) 1990-03-20 1999-03-03 古河電気工業株式会社 コルソン合金の熱処理方法
JP3049137B2 (ja) * 1991-12-27 2000-06-05 株式会社神戸製鋼所 曲げ加工性が優れた高力銅合金及びその製造方法
JPH0718356A (ja) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金、その製造方法およびｉｃリードフレーム
JP2001207229A (ja) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP4177221B2 (ja) 2003-10-06 2008-11-05 古河電気工業株式会社 電子機器用銅合金
JP3864965B2 (ja) * 2004-06-08 2007-01-10 日立電線株式会社 端子・コネクタ用銅合金の製造方法
CN1776997B (zh) * 2005-12-13 2010-05-05 江苏科技大学 大容量汽轮发电机转子铜合金槽楔及其制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093140A1 (ja) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. 銅合金

Also Published As

Publication number Publication date
EP2154257B1 (de) 2016-10-05
TW200902732A (en) 2009-01-16
KR101211984B1 (ko) 2012-12-13
KR20090123017A (ko) 2009-12-01
CN101646792A (zh) 2010-02-10
WO2008123433A1 (ja) 2008-10-16
CN101646792B (zh) 2012-02-22
JPWO2008123433A1 (ja) 2010-07-15
US20100086435A1 (en) 2010-04-08
EP2154257A4 (de) 2012-01-11
EP2154257A1 (de) 2010-02-17
JP4418028B2 (ja) 2010-02-17

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