EP2243013A1 - Matériau composite pour la mesure de température, capteur de température comportant ce matériau composite, et procédés de fabrication du matériau composite et du capteur de température - Google Patents

Matériau composite pour la mesure de température, capteur de température comportant ce matériau composite, et procédés de fabrication du matériau composite et du capteur de température

Info

Publication number
EP2243013A1
EP2243013A1 EP09713214A EP09713214A EP2243013A1 EP 2243013 A1 EP2243013 A1 EP 2243013A1 EP 09713214 A EP09713214 A EP 09713214A EP 09713214 A EP09713214 A EP 09713214A EP 2243013 A1 EP2243013 A1 EP 2243013A1
Authority
EP
European Patent Office
Prior art keywords
composite material
temperature sensor
matrix
filler
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09713214A
Other languages
German (de)
English (en)
Other versions
EP2243013B1 (fr
Inventor
Gerald Kloiber
Heinz Strallhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2243013A1 publication Critical patent/EP2243013A1/fr
Application granted granted Critical
Publication of EP2243013B1 publication Critical patent/EP2243013B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/223—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor characterised by the shape of the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
    • H01C7/043—Oxides or oxidic compounds
    • H01C7/045—Perovskites, e.g. titanates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • Composite material for temperature measurement comprising the composite material and method for producing the composite material and the temperature sensor
  • the invention relates to a composite material for temperature measurement and a method for producing the composite material. Furthermore, the invention relates to a temperature sensor, which is formed from the composite material and a method for producing the temperature sensor.
  • the object of the invention is to provide a composite material for temperature measurement and a temperature sensor, which is formed from the composite material.
  • the object is achieved by a composite material according to claim 1 and by a temperature sensor according to claim 12.
  • Another object of the invention is to provide simple and inexpensive methods for producing the composite material and for producing the temperature sensor.
  • a temperature measurement comprising a ceramic filler and a filler-embedding, mouldable matrix.
  • the ceramic filler has a positive or negative temperature coefficient of electrical resistance.
  • the composite further has a resistance-temperature characteristic determined by the ceramic filler.
  • NTC negative temperature coefficient
  • PTC positive temperature coefficient
  • the composite material can be shaped as desired and thus also be processed into surface-mountable elements, for example films. Because the composite material has a temperature-dependent resistance characteristic, the composite material can be formed as a temperature sensor.
  • the composite material can furthermore have good thermal conductivity.
  • the composite may further comprise a material of the matrix selected from a group comprising glassy materials, thermoplastics, thermosets, elastomers or mixtures thereof.
  • a material of the matrix selected from a group comprising glassy materials, thermoplastics, thermosets, elastomers or mixtures thereof.
  • polymeric materials for example, polyphenylene sulfide (PPS) or polyamide (PA) can be used. These materials are readily mouldable and cause the composite to be well processable.
  • the filler in the composite may be present as a plurality of particles in the matrix.
  • a powdery ceramic filler material having NTC or PTC properties can be mixed in a matrix.
  • the particles of the ceramic filler in the matrix may have a degree of filling of 50% to 95%.
  • the particles can form continuous current paths in the matrix. By filling the particles from 50% to 95% in the matrix, continuously formed current paths of the ceramic particles for the current flow can be ensured. An interruption of the current paths and thus the current flow through the matrix material is thus prevented.
  • the electrical behavior of the composite is largely determined by the ceramic filler.
  • the composite material changes its electrical resistance as a function of the temperature, ie has an NTC or PTC characteristic, and can thus be used as a temperature sensor.
  • the degree of filling of the ceramic particles in the matrix is still low enough to allow the deformability of the composite material.
  • the filler in the composite may comprise a material comprising an electrically conductive spinel of the formula A 11 B 113 O 4 or a perovskite of the formula ABO 3 , where A is a bivalent metal and B is a trivalent metal.
  • A may comprise nickel, B, for example, manganese.
  • it is a ceramic material that has a negative temperature coefficient. Ceramics which have positive temperature coefficients or which have a different composition and a negative temperature coefficient can likewise be used.
  • Ceramic material may further comprise dopants selected, for example, from metal oxides.
  • a process for producing a composite material having the above-mentioned properties is also disclosed.
  • the method comprises the method steps
  • ceramic granulate can be sintered, pressed and ground to powder in process step A). This provides a ceramic material that can be easily mixed in powder form with the matrix material.
  • a matrix can be selected from a group comprising vitreous materials, thermoplastics, thermosets, elastomers or mixtures thereof.
  • the filler and the matrix can be mixed continuously.
  • the mixing can be done for example on a twin-screw extruder with two concurrent, parallel augers.
  • the matrix material and the filler are continuously brought together and mixed.
  • the filler and the matrix can also be mixed discontinuously. For this, the filler material or the matrix material is placed in a container, then the matrix material or the filler material is added and the materials are mixed in the container.
  • a temperature sensor which is formed from a composite material according to the properties described above and having contacts.
  • the temperature sensor is characterized by the fact that it can be produced free of envelopes or carriers and his Outside surfaces of composite material may be formed.
  • the temperature sensor can detect the temperatures of adjacent bodies and / or thermal radiation.
  • the temperature sensor formed of the composite material may be formed to be surface mountable. A surface-mountable temperature sensor has a good thermal and mechanical coupling of its surface to the measurement object.
  • the temperature sensor may have contacts which are applied to the surface of the temperature sensor and / or integrated into the temperature sensor. When the contacts are integrated into the temperature sensor, some of the contacts are in the composite, while the other part is from the
  • the contact surfaces between the contacts and the composite material can have an influence on the resistance of the temperature sensor, and thus on the NTC or PTC characteristic of the temperature sensor. The larger the area of the
  • the electrical behavior of the temperature sensor can be adjusted as needed.
  • the electrical behavior of the temperature sensor is further determined by the geometric shape of the composite and by the shape and position of the contacts. This is due to the fact that the BuIk effect determines the conductivity of the temperature sensor through the entire volume of the material.
  • the temperature sensor may have a three-dimensional geometric shape.
  • it can be shaped as a film that can be flexible.
  • the temperature sensor can be cuboid and / or have rounded corners.
  • Other geometric shapes, such as cylinders or individually adapted to the environment irregular shapes are also produced.
  • a temperature sensor can thus be produced simply and cost-effectively, which is formed as required and can be used without additional elements, such as, for example, casings or carriers.
  • an optional, thermally coupled encapsulation can be realized, for example by means of an additional injection molding process.
  • the method comprises the method steps
  • a composite material according to the above method is produced.
  • the composite material can be formed into a three-dimensional symmetrical shape.
  • the composite can be formed into ribbons or foils or any other three-dimensional shape.
  • a method can be used which comprises injection molding.
  • the shaping of the composite material can be carried out directly after the production of the composite material in the twin-screw extruder.
  • a slot die can be used as a tool.
  • the extruded strip can be pulled off via a smoothing calender and, for example, formed into thin strips or foils.
  • a perforated plate can be used as a tool on the extruder.
  • the extruded strands are then processed with a suitable cutting device into a granulate, which in turn can be brought into any desired processing on any processing machines, such as injection molding machines.
  • the contacts can be applied to the surface of the molded composite material.
  • a method can be selected, which is selected from screen printing, sputtering and electroplating.
  • the process steps E) and F) can continue to be carried out simultaneously and the contacts are integrated into the composite material.
  • an integrated contact can be made in an injection molded part that has ends that protrude from the composite and ends that are trapped in the composite.
  • the temperature sensor can be applied to bodies whose temperature is to be measured. This allows the temperature sensor to measure the temperature across the contact surface to the adjacent body.
  • the temperature sensor can also be used for radiation measurement.
  • a body for example a foil, may be formed, the matrix material of which has good radiation absorption.
  • the matrix material may, for example, comprise black particles.
  • FIG. 1 shows a schematic view of an embodiment of the temperature sensor
  • FIG. 2 shows a further schematic view of an embodiment of the temperature sensor.
  • Figure 1 shows a temperature sensor 10 with contacts 2, which are applied to the composite material 1.
  • the temperature sensor 10 is formed as a film and the contacts 2 on the surface of the
  • the film can be flexible and thus be applied to any surface whose temperature is to be measured.
  • the composite may include a matrix material selected from glassy materials, thermoplastics, thermosets, elastomers or combinations thereof.
  • PPS or PA can be used.
  • the matrix contains a ceramic filler having a positive or negative temperature coefficient of electrical resistance.
  • the filler is present in the matrix in particle form, wherein the degree of filling in the matrix is so high that continuous current paths of the particles can be formed in the matrix.
  • the ceramic filler may comprise a material comprising metal oxides, such as MnNiO, and present in the matrix at a fill level of 50% to 95%.
  • the contacts 2 may alternatively be integrated into the film and have different sizes.
  • FIG. 2 shows an alternative embodiment of a temperature sensor 10.
  • the composite material 1 is formed as a cuboid and the contacts 2 are integrated into the cuboid.
  • the contacts 2 have ends that protrude from the cuboid, so that they can be contacted from the outside, and they have ends that are enclosed in the cuboid (indicated by dashed lines).
  • Such a temperature sensor 10 can be produced for example by injection molding, wherein the
  • the contacts 2 are integrated into the composite material 1 during the injection molding process.
  • the contacts 2 could alternatively also be applied to the surface of the composite material 1 (not shown here) and have different sizes.
  • the electrical behavior of the temperature sensor can be determined by the geometric shape of the composite 1 and by the size, shape and position of the contacts 2.
  • the temperature sensor can be designed individually for the respective use with regard to its shape and its electrical behavior.
  • FIGS. 1 and 2 can be varied as desired. It should be further considered that the invention is not limited to the

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)

Abstract

L'invention concerne un matériau composite (1) pour la mesure de température, ainsi qu'un capteur de température (10) qui est formé dudit matériau composite (1). L'invention concerne en outre des procédés de fabrication du matériau composite (1) et de fabrication du capteur de température (10). Le matériau composite (1) contient une charge céramique et une matrice façonnable dans laquelle la charge est incorporée, la charge céramique présentant un coefficient de température positif ou négatif de la résistance électrique.
EP09713214.6A 2008-02-19 2009-02-09 Matériau composite pour la mesure de température, capteur de température comportant ce matériau composite, et procédés de fabrication du matériau composite et du capteur de température Not-in-force EP2243013B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008009817A DE102008009817A1 (de) 2008-02-19 2008-02-19 Verbundwerkstoff zur Temperaturmessung, Temperatursensor aufweisend den Verbundwerkstoff und Verfahren zur Herstellung des Verbundwerkstoffs und des Temperatursensors
PCT/DE2009/000174 WO2009103261A1 (fr) 2008-02-19 2009-02-09 Matériau composite pour la mesure de température, capteur de température comportant ce matériau composite, et procédés de fabrication du matériau composite et du capteur de température

Publications (2)

Publication Number Publication Date
EP2243013A1 true EP2243013A1 (fr) 2010-10-27
EP2243013B1 EP2243013B1 (fr) 2017-07-05

Family

ID=40673947

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09713214.6A Not-in-force EP2243013B1 (fr) 2008-02-19 2009-02-09 Matériau composite pour la mesure de température, capteur de température comportant ce matériau composite, et procédés de fabrication du matériau composite et du capteur de température

Country Status (7)

Country Link
US (1) US9341521B2 (fr)
EP (1) EP2243013B1 (fr)
JP (1) JP2011516821A (fr)
KR (1) KR101572290B1 (fr)
CN (2) CN101952701B (fr)
DE (1) DE102008009817A1 (fr)
WO (1) WO2009103261A1 (fr)

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US9869594B2 (en) * 2012-11-05 2018-01-16 Steamist, Inc. Controller for steam bath having multiple temperature sensors
DE102012110845A1 (de) * 2012-11-12 2014-05-15 Epcos Ag Temperaturfühler und Verfahren zur Herstellung eines Temperaturfühlers
DE102013224024A1 (de) * 2013-11-25 2015-05-28 Contitech Ag Elastomerer Hohlkörper, insbesondere elastomerer Schlauch, mit Sensorelement zur Erfassung einer Temperatur sowie Verfahren hierzu
EP3373310A1 (fr) * 2017-03-06 2018-09-12 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Sonde de température imprimée
US10446355B2 (en) * 2017-04-27 2019-10-15 Littelfuse, Inc. Hybrid device structures including negative temperature coefficient/positive temperature coefficient device
DE102017116533A1 (de) * 2017-07-21 2019-01-24 Tdk Electronics Ag Anlegetemperaturmessfühler

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Also Published As

Publication number Publication date
JP2011516821A (ja) 2011-05-26
US20110051778A1 (en) 2011-03-03
KR101572290B1 (ko) 2015-11-26
KR20100124302A (ko) 2010-11-26
DE102008009817A1 (de) 2009-08-27
US9341521B2 (en) 2016-05-17
CN101952701B (zh) 2016-12-07
CN104535218A (zh) 2015-04-22
WO2009103261A1 (fr) 2009-08-27
EP2243013B1 (fr) 2017-07-05
CN101952701A (zh) 2011-01-19

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