EP2444528A3 - Procédé et dispositif destinés au revêtement galvanisé de substrats et cellules solaires - Google Patents

Procédé et dispositif destinés au revêtement galvanisé de substrats et cellules solaires Download PDF

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Publication number
EP2444528A3
EP2444528A3 EP11184987.3A EP11184987A EP2444528A3 EP 2444528 A3 EP2444528 A3 EP 2444528A3 EP 11184987 A EP11184987 A EP 11184987A EP 2444528 A3 EP2444528 A3 EP 2444528A3
Authority
EP
European Patent Office
Prior art keywords
solar cells
substrates
galvanising
transport device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11184987.3A
Other languages
German (de)
English (en)
Other versions
EP2444528A2 (fr
Inventor
Lothar Lippert
Marcus Caseday
Sascha Reime
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung eV
Original Assignee
Schott Solar AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Solar AG filed Critical Schott Solar AG
Publication of EP2444528A2 publication Critical patent/EP2444528A2/fr
Publication of EP2444528A3 publication Critical patent/EP2444528A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/011—Electroplating using electromagnetic wave irradiation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Hybrid Cells (AREA)
EP11184987.3A 2010-10-19 2011-10-13 Procédé et dispositif destinés au revêtement galvanisé de substrats et cellules solaires Withdrawn EP2444528A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010042642A DE102010042642B4 (de) 2010-10-19 2010-10-19 Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen

Publications (2)

Publication Number Publication Date
EP2444528A2 EP2444528A2 (fr) 2012-04-25
EP2444528A3 true EP2444528A3 (fr) 2013-05-22

Family

ID=44785610

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11184987.3A Withdrawn EP2444528A3 (fr) 2010-10-19 2011-10-13 Procédé et dispositif destinés au revêtement galvanisé de substrats et cellules solaires

Country Status (3)

Country Link
EP (1) EP2444528A3 (fr)
CN (1) CN102453940A (fr)
DE (1) DE102010042642B4 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105369307A (zh) * 2015-12-08 2016-03-02 厦门冠通电子科技有限公司 一种引线框架的点镀机构

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103382566B (zh) * 2012-05-04 2016-05-11 库特勒自动化系统(苏州)有限公司 太阳能电池电镀装置及其供电模组
US9362440B2 (en) * 2012-10-04 2016-06-07 International Business Machines Corporation 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels
KR101575068B1 (ko) * 2014-09-16 2015-12-07 주식회사 호진플라텍 광유도 도금 및 순방향 바이어스 도금을 병행하는 태양전지 기판용 도금장치
JP6697456B2 (ja) * 2015-06-17 2020-05-20 株式会社カネカ 結晶シリコン太陽電池モジュールおよびその製造方法
CN108336183A (zh) * 2017-04-13 2018-07-27 苏州中芯原微电子有限公司 太阳能电池板镀铝膜复合装置
CN110117805A (zh) * 2019-05-16 2019-08-13 浙江宝利特新能源股份有限公司 一种用于分段焊带的单面屏蔽电镀装置及其生产方法
CN111254482A (zh) * 2020-02-26 2020-06-09 泰州隆基乐叶光伏科技有限公司 一种单面电镀设备及方法
CN114959848B (zh) * 2022-06-08 2024-03-26 苏州晶洲装备科技有限公司 一种光伏电池的水平电镀装置、水平电镀方法及用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US936472A (en) * 1909-06-18 1909-10-12 Wilhelm Pfanhauser Mechanical arrangement for electroplating objects.
US4270986A (en) * 1979-07-12 1981-06-02 Sifco Industries, Inc. Method for soldering aluminum
WO1987002076A1 (fr) * 1985-09-30 1987-04-09 Robbins & Craig Welding And Manufacturing Co. Appareil et procede de placage par contact en continu
DE10344424A1 (de) * 2003-09-25 2005-05-12 Daimler Chrysler Ag Vorrichtung zur elektrochemischen Abscheidung eines Beschichtungsmaterials auf einem Substrat sowie Verfahren zur elektrochemischen Abscheidung
EP2216823A1 (fr) * 2007-11-30 2010-08-11 Wuxi Suntech Power Co., Ltd. Procédé de dépôt électrochimique d'électrode métallique d'une photopile

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2540602A (en) * 1946-07-03 1951-02-06 Lockheed Aircraft Corp Method and apparatus for the surface treatment of metals
WO1979000608A1 (fr) * 1978-02-09 1979-08-23 Kemwell Ltd Electro-traitement d'une surface metallique
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102007005161B4 (de) * 2007-01-29 2009-04-09 Nb Technologies Gmbh Verfahren zur Metallisierung von Substraten
EP2201160B1 (fr) * 2008-06-19 2012-10-31 RENA GmbH Dispositif et procédé pour le traitement unilatéral par voie chimique humide et/ou électrolytique d'une matière

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US936472A (en) * 1909-06-18 1909-10-12 Wilhelm Pfanhauser Mechanical arrangement for electroplating objects.
US4270986A (en) * 1979-07-12 1981-06-02 Sifco Industries, Inc. Method for soldering aluminum
WO1987002076A1 (fr) * 1985-09-30 1987-04-09 Robbins & Craig Welding And Manufacturing Co. Appareil et procede de placage par contact en continu
DE10344424A1 (de) * 2003-09-25 2005-05-12 Daimler Chrysler Ag Vorrichtung zur elektrochemischen Abscheidung eines Beschichtungsmaterials auf einem Substrat sowie Verfahren zur elektrochemischen Abscheidung
EP2216823A1 (fr) * 2007-11-30 2010-08-11 Wuxi Suntech Power Co., Ltd. Procédé de dépôt électrochimique d'électrode métallique d'une photopile

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105369307A (zh) * 2015-12-08 2016-03-02 厦门冠通电子科技有限公司 一种引线框架的点镀机构
CN105369307B (zh) * 2015-12-08 2017-12-05 厦门冠通电子科技有限公司 一种引线框架的点镀机构

Also Published As

Publication number Publication date
EP2444528A2 (fr) 2012-04-25
DE102010042642B4 (de) 2013-12-12
CN102453940A (zh) 2012-05-16
DE102010042642A1 (de) 2012-04-19

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