EP2532048A1 - Antenne à microbandes empilée - Google Patents

Antenne à microbandes empilée

Info

Publication number
EP2532048A1
EP2532048A1 EP10805580A EP10805580A EP2532048A1 EP 2532048 A1 EP2532048 A1 EP 2532048A1 EP 10805580 A EP10805580 A EP 10805580A EP 10805580 A EP10805580 A EP 10805580A EP 2532048 A1 EP2532048 A1 EP 2532048A1
Authority
EP
European Patent Office
Prior art keywords
microstrip antenna
separator
antenna
stacked
patch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10805580A
Other languages
German (de)
English (en)
Other versions
EP2532048B8 (fr
EP2532048B1 (fr
Inventor
Michael Sabielny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hensoldt Sensors GmbH
Original Assignee
EADS Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EADS Deutschland GmbH filed Critical EADS Deutschland GmbH
Publication of EP2532048A1 publication Critical patent/EP2532048A1/fr
Application granted granted Critical
Publication of EP2532048B1 publication Critical patent/EP2532048B1/fr
Publication of EP2532048B8 publication Critical patent/EP2532048B8/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array

Definitions

  • the invention relates to a stacked microstrip antenna according to the preamble of patent claim 1.
  • No. 7,050,004 B2 describes a microstrip antenna whose ground surface is formed by a movable diaphragm whose position relative to the microstrip antenna element can be changed by applying a voltage.
  • US 5,363,067 A describes a microstrip line with two adjacent conductors above a ground plane.
  • the space above the two conductors is formed by a respective cavity within a dielectric substrate.
  • the object of the invention is to provide a generic stacked microstrip antenna, which is advantageous in terms of manufacturing technology without the required weak electromagnetic coupling of the patch elements is lost.
  • a separator is arranged between the two superimposed patch elements, in which, for example by drilling or milling, air cavities are introduced.
  • the necessary adaptation is effected by the cavities introduced into the separator, which markedly reduce the effective dielectric constant between the patch elements. The result is a significant reduction of the electromagnetic coupling of the patch elements.
  • the separator according to the invention thus reduces to a type of holding frame for the structure of the antenna, while the air cavities significantly reduce the effective dielectric constant between the patch elements.
  • the separator can particularly advantageously a conventional RF printed circuit board base material (for example, RO 4003 ® C of the company Rogers Corporation, Microwave
  • Such materials usually consist of a resin with incorporated therein fiberglass inserts. The have a good stability and are manufacturing technically unproblematic. The relative relative to an HF foam material comparatively high relative dielectric constant of these materials is compensated by the introduced cavity or more cavities.
  • RF standard materials and standard PCB manufacturing processes can be used to enable low cost manufacturing processes.
  • Fig. 1 shows a first embodiment of the antenna according to the invention
  • Fig. 2 shows a second embodiment of the antenna according to the invention.
  • 1 and 2 each show an embodiment of the stacked microstrip antenna according to the invention with two superimposed microstrip antenna elements 1 and 10 and the ground plane 100.
  • the said conductive parts 1, 10,100 are each by dielectric layers 5,6,7 separated from each other. The latter consist of conventional HF printed circuit board base material and naturally have a high dielectric constant ⁇ ⁇ .
  • the lower patch element 1 is the fed patch element of the antenna, while the upper patch element 10 is the parasitic patch element.
  • the parasitic patch 10 oscillates with the signal emitted by the powered patch 1, thus improving the overall device impedance bandwidth.
  • a separator 5 is present between the two stacked patch elements 1, 10, which simultaneously serves as a carrier for the upper patch element 10.
  • the material of the separator 5 is an air-filled, cuboid or cylinder derförmiger cavity 20 into it, which is located in the embodiment shown immediately below the parasitic patch element 10. With this air cavity 20, the effective dielectric constant between the two patch elements 1, 10 is substantially reduced, resulting in the desired increased impedance bandwidth of the antenna.
  • the dielectric layer 6 between the lower patch element 1 and the ground surface 100 is formed continuously in this embodiment (solid material), that is to say in particular has no cavities.
  • solid material that is to say in particular has no cavities.
  • FIG. 2 shows a variant of the embodiment shown in FIG. 1. Instead of just one cavity, there are two separate cavities 21 in the separator 5 below the parasitic patch element 10. The two cavities 21 were produced here by drilling in the material of the separator 5.

Landscapes

  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne une antenne à microbandes empilée avec deux éléments d'antennes à microbandes disposés l'un sur l'autre (1, 10) ainsi qu'un, séparateur diélectrique (5) entre les deux éléments d'antennes à microbandes (1, 10), le séparateur diélectrique (5) comportant une ou plusieurs cavités (20).
EP10805580.7A 2010-02-04 2010-11-26 Antenne à microbandes empilée Active EP2532048B8 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010006809A DE102010006809A1 (de) 2010-02-04 2010-02-04 Gestapelte Mikrostreifen-Antenne
PCT/DE2010/001377 WO2011095144A1 (fr) 2010-02-04 2010-11-26 Antenne à microbandes empilée

Publications (3)

Publication Number Publication Date
EP2532048A1 true EP2532048A1 (fr) 2012-12-12
EP2532048B1 EP2532048B1 (fr) 2016-07-13
EP2532048B8 EP2532048B8 (fr) 2016-08-24

Family

ID=43797553

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10805580.7A Active EP2532048B8 (fr) 2010-02-04 2010-11-26 Antenne à microbandes empilée

Country Status (8)

Country Link
US (1) US9196965B2 (fr)
EP (1) EP2532048B8 (fr)
JP (1) JP2013519275A (fr)
KR (1) KR101701946B1 (fr)
AU (1) AU2010345007B2 (fr)
DE (1) DE102010006809A1 (fr)
IL (1) IL221150A (fr)
WO (1) WO2011095144A1 (fr)

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US9401912B2 (en) * 2014-10-13 2016-07-26 Netiq Corporation Late binding authentication
US10454174B2 (en) 2016-05-10 2019-10-22 Novatel Inc. Stacked patch antennas using dielectric substrates with patterned cavities
JP7005357B2 (ja) * 2017-02-21 2022-01-21 京セラ株式会社 アンテナ基板
EP3601052A1 (fr) * 2017-03-31 2020-02-05 SABIC Global Technologies B.V. Bras polymère pour table à plateaux et procédés de fabrication de celui-ci
EP3621153B1 (fr) * 2017-05-02 2022-11-09 Amotech Co., Ltd. Module d'antenne
JP6950084B2 (ja) * 2017-05-15 2021-10-13 ソニーグループ株式会社 ミリ波通信用のパッチアンテナ
KR102423296B1 (ko) * 2017-09-14 2022-07-21 삼성전자주식회사 Pcb를 포함하는 전자 장치
WO2019087733A1 (fr) 2017-11-06 2019-05-09 株式会社村田製作所 Substrat d'antenne et module d'antenne
TW201937810A (zh) * 2018-02-15 2019-09-16 美商太空探索科技公司 自多工天線
US11336015B2 (en) * 2018-03-28 2022-05-17 Intel Corporation Antenna boards and communication devices
US11380979B2 (en) 2018-03-29 2022-07-05 Intel Corporation Antenna modules and communication devices
KR102767861B1 (ko) 2018-04-03 2025-02-18 코닝 인코포레이티드 구조화된 유리 물품을 포함하는 전자 패키지 및 그 제조방법
US10854978B2 (en) * 2018-04-23 2020-12-01 Samsung Electro-Mechanics Co., Ltd. Antenna apparatus and antenna module
US11011827B2 (en) 2018-05-11 2021-05-18 Intel IP Corporation Antenna boards and communication devices
US11509037B2 (en) 2018-05-29 2022-11-22 Intel Corporation Integrated circuit packages, antenna modules, and communication devices
US10797394B2 (en) 2018-06-05 2020-10-06 Intel Corporation Antenna modules and communication devices
JP2020127079A (ja) 2019-02-01 2020-08-20 ソニーセミコンダクタソリューションズ株式会社 アンテナ装置及び無線通信装置
US11177571B2 (en) * 2019-08-07 2021-11-16 Raytheon Company Phased array antenna with edge-effect mitigation
JP7449137B2 (ja) * 2020-03-25 2024-03-13 京セラ株式会社 アンテナ素子及びアレイアンテナ
KR102762869B1 (ko) 2020-04-14 2025-02-07 삼성전기주식회사 안테나

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US4011246A (en) * 1976-04-14 1977-03-08 General Electric Company 2-[4-(3,4-Dicarboxyphenoxy)phenyl]-2-(4-hydroxyphenyl)propane and the anhydrides thereof
US4477813A (en) * 1982-08-11 1984-10-16 Ball Corporation Microstrip antenna system having nonconductively coupled feedline
JP2693565B2 (ja) 1989-03-27 1997-12-24 日立化成工業株式会社 平面アンテナ
US5363067A (en) * 1993-05-19 1994-11-08 Motorola, Inc. Microstrip assembly
JPH0998016A (ja) * 1995-10-02 1997-04-08 Mitsubishi Electric Corp マイクロストリップアンテナ
US6333719B1 (en) 1999-06-17 2001-12-25 The Penn State Research Foundation Tunable electromagnetic coupled antenna
DE60326758D1 (de) * 2002-03-28 2009-04-30 Univ Manitoba Mehrfrequenz-antenne
US6995711B2 (en) 2003-03-31 2006-02-07 Harris Corporation High efficiency crossed slot microstrip antenna
GB2412246B (en) 2004-03-16 2007-05-23 Antenova Ltd Dielectric antenna with metallised walls
US7636063B2 (en) 2005-12-02 2009-12-22 Eswarappa Channabasappa Compact broadband patch antenna
US7450072B2 (en) * 2006-03-28 2008-11-11 Qualcomm Incorporated Modified inverted-F antenna for wireless communication
WO2007149046A1 (fr) * 2006-06-22 2007-12-27 Meds Technologies Pte Ltd Circuits quasi plans avec des cavités d'air

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Title
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Also Published As

Publication number Publication date
WO2011095144A1 (fr) 2011-08-11
EP2532048B8 (fr) 2016-08-24
AU2010345007A9 (en) 2013-01-24
IL221150A (en) 2015-10-29
AU2010345007A1 (en) 2012-09-06
JP2013519275A (ja) 2013-05-23
KR101701946B1 (ko) 2017-02-02
US9196965B2 (en) 2015-11-24
US20130002491A1 (en) 2013-01-03
DE102010006809A1 (de) 2011-08-04
EP2532048B1 (fr) 2016-07-13
KR20130008007A (ko) 2013-01-21
AU2010345007B2 (en) 2015-12-24

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