EP2599896A3 - Procédé de séparation galvanique d'au moins un métal ou un semi-conducteur - Google Patents
Procédé de séparation galvanique d'au moins un métal ou un semi-conducteur Download PDFInfo
- Publication number
- EP2599896A3 EP2599896A3 EP12191555.7A EP12191555A EP2599896A3 EP 2599896 A3 EP2599896 A3 EP 2599896A3 EP 12191555 A EP12191555 A EP 12191555A EP 2599896 A3 EP2599896 A3 EP 2599896A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- semiconductor
- electrolyte
- substrate
- galvanic deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/11—Use of protective surface layers on electrolytic baths
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011055911A DE102011055911B3 (de) | 2011-12-01 | 2011-12-01 | Verfahren zur galvanischen Abscheidung wenigstens eines Metalls oder Halbleiters |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2599896A2 EP2599896A2 (fr) | 2013-06-05 |
| EP2599896A3 true EP2599896A3 (fr) | 2014-01-22 |
| EP2599896B1 EP2599896B1 (fr) | 2021-05-26 |
Family
ID=47140634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12191555.7A Active EP2599896B1 (fr) | 2011-12-01 | 2012-11-07 | Procédé de dépôt galvanique d'au moins un métal ou un semi-conducteur et dispositif à cet effet |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2599896B1 (fr) |
| DE (1) | DE102011055911B3 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5808866B2 (ja) * | 2012-08-31 | 2015-11-10 | 株式会社日立製作所 | 非水系電気めっき方法および非水系電気めっき装置 |
| JP6050888B2 (ja) * | 2013-03-07 | 2016-12-21 | 株式会社日立製作所 | 基材上へのアルミナイド皮膜の形成方法 |
| EP2971267B1 (fr) * | 2013-03-15 | 2020-10-14 | United Technologies Corporation | Traitement de revêtement de zinc bimétallique pour une adhérence améliorée d'aluminium sur des alliages en aluminium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2849349A (en) * | 1955-06-13 | 1958-08-26 | Ziegler | Process for the electrolytic deposition of aluminium |
| US3972784A (en) * | 1972-12-08 | 1976-08-03 | Siemens Aktiengesellschaft | Method for pretreating surfaces of electrically conductive materials prior to electroplating |
| US4265726A (en) * | 1979-01-17 | 1981-05-05 | Montblanc-Simplo Gmbh | Aluminum plating cell |
| WO2010106072A2 (fr) * | 2009-03-18 | 2010-09-23 | Basf Se | Électrolyte et additifs tensio-actifs pour le dépôt galvanique de couches d'aluminium lisses et compactes à partir de liquides ioniques |
| WO2011064556A2 (fr) * | 2009-11-25 | 2011-06-03 | University Of Leicester | Liquides ioniques inédits |
| DE102011007559A1 (de) * | 2010-04-19 | 2011-10-20 | Basf Se | Verfahren zur Herstellung von Elektrolyten für die Aluminiumabscheidung |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2662635B2 (ja) * | 1988-04-26 | 1997-10-15 | 日新製鋼株式会社 | 電気アルミニウムめっき浴およびその浴によるめっき方法 |
-
2011
- 2011-12-01 DE DE102011055911A patent/DE102011055911B3/de active Active
-
2012
- 2012-11-07 EP EP12191555.7A patent/EP2599896B1/fr active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2849349A (en) * | 1955-06-13 | 1958-08-26 | Ziegler | Process for the electrolytic deposition of aluminium |
| US3972784A (en) * | 1972-12-08 | 1976-08-03 | Siemens Aktiengesellschaft | Method for pretreating surfaces of electrically conductive materials prior to electroplating |
| US4265726A (en) * | 1979-01-17 | 1981-05-05 | Montblanc-Simplo Gmbh | Aluminum plating cell |
| WO2010106072A2 (fr) * | 2009-03-18 | 2010-09-23 | Basf Se | Électrolyte et additifs tensio-actifs pour le dépôt galvanique de couches d'aluminium lisses et compactes à partir de liquides ioniques |
| WO2011064556A2 (fr) * | 2009-11-25 | 2011-06-03 | University Of Leicester | Liquides ioniques inédits |
| DE102011007559A1 (de) * | 2010-04-19 | 2011-10-20 | Basf Se | Verfahren zur Herstellung von Elektrolyten für die Aluminiumabscheidung |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2599896B1 (fr) | 2021-05-26 |
| EP2599896A2 (fr) | 2013-06-05 |
| DE102011055911B3 (de) | 2012-11-29 |
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