EP2623643A1 - Solution de dépôt électrolytique d'aluminium - Google Patents

Solution de dépôt électrolytique d'aluminium Download PDF

Info

Publication number
EP2623643A1
EP2623643A1 EP11828690.5A EP11828690A EP2623643A1 EP 2623643 A1 EP2623643 A1 EP 2623643A1 EP 11828690 A EP11828690 A EP 11828690A EP 2623643 A1 EP2623643 A1 EP 2623643A1
Authority
EP
European Patent Office
Prior art keywords
aluminum
metal salt
plating
electroplating solution
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11828690.5A
Other languages
German (de)
English (en)
Other versions
EP2623643A4 (fr
Inventor
Hiroshi Nakano
Yoshinori Negishi
Haruo Akahoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP2623643A1 publication Critical patent/EP2623643A1/fr
Publication of EP2623643A4 publication Critical patent/EP2623643A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids

Definitions

  • the present invention relates to an aluminum electroplating solution using an organic solvent (non-aqueous solvent).
  • Patent Literatures 3 and 4 etc. suggest an aluminum electroplating method using, as a plating bath, a molten salt comprising 1-alkyl or 1,3-dialkylimidazolium halide, quaternary ammonium salt or alkylpyridinium halide, and aluminumhalide etc.
  • plating states of these plating baths are largely changed due to a mixing of moisture, and thus even if an electroplating is conducted under constant plating conditions, a uniform plating coating is not always obtained.
  • the purpose of the present invention is to solve the above problems and to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has a high solubility in a nonaqueous solvent.
  • the aluminum electroplating solution of the present invention is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume fraction of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.
  • a precipitation efficiency of plating is enhanced, a uniformity of a film thickness can be improved. Additionally, by applying the above plating, it comes to be possible to provide parts having a steric shape with a uniform plating applied.
  • the aluminum metal salt used as an aluminum source can include an aluminumhalide.
  • the aluminumhalide used can include an anhydrous salt such as aluminum chloride and aluminum bromide.
  • an aluminum concentration in a plating solution in relation to the organic compound forming an ion pair with the aluminum metal salt is equimolar or less, a precipitation speed of plating is remarkably lowered and thus a higher concentration results in a better precipitation uniformity of plating. It is better that the aluminum concentration in the plating solution in relation to the organic compound forming an ion pair with the aluminum metal salt is equimolar or more, preferably 1.5 times or more, more preferably 3 times or more.
  • the organic compound forming an ion pair with the aluminum metal salt used can include a halide of an organic compound cation such as dialkyl imidazolium salt, aliphatic phosphonium salt, and quaternary ammonium salt.
  • the dialkyl imidazolium salt suitably used can include 1,3-dialkylimidazoliumhalide which includes 1-ethyl-3-methylimidazolium chloride ([EMIM] ⁇ Cl), 1-ethyl-3-methylimidazolium bromide ([EMIM] ⁇ Br), 1-ethyl-3-methylimidazolium iodide ([EMIM] ⁇ I), 1-butyl-3-methylimidazolium chloride ([BMIM] ⁇ Cl), 1-butyl-3-methylimidazolium bromide ([BMIM] ⁇ Br), 1-butyl-3-methylimidazolium iodide ([BMIM] ⁇ I) etc.
  • the aliphatic phosphonium salt suitably used can include ethyltributyl phosphonium chloride ([EBP] ⁇ Cl), ethyltributyl phosphonium bromide ([EBP] ⁇ Br), ethyltributyl phosphonium iodide ([EBP] ⁇ I) etc.
  • the quaternary ammonium salt suitably used can include tetraethyl ammonium bromide ([E4N] ⁇ Br), trimethylethyl ammonium chloride ([M3EN] ⁇ Cl), tetrabutyl ammonium chloride ([Bu4N] ⁇ Cl) etc.
  • An ionic liquid having an ion pair formed is formed by mixing the above-mentioned aluminum metal salt with the organic compound forming an ion pair with the aluminum metal salt according to the following reaction.
  • a mixing of an aluminum salt with an organic compound such as a dialkylimidazolium salt forms an ion pair to obtain a melt (ionic liquid).
  • This ionic liquid can function as an electroplating solution.
  • a concentration of aluminum is high as a plating solution, when a molar ratio of the aluminum metal salt in relation to the organic compound forming an ion pair with the aluminum metal salt is e.g. 3 or more, a viscosity becomes higher to lower a fluidity due to a higher concentration of aluminum, and a uniform plating precipitation cannot come to be obtained from such an ionic liquid.
  • an ionic liquid having a high viscosity by dissolving an ionic liquid having a high viscosity into an organic solvent, even the molar ratio of 3 or more can lower a viscosity to be able to be suitably used as a plating solution.
  • a higher volume fraction of the organic solvent results in a relatively lower ion concentration of aluminum, an apparent diffusion coefficient becomes large due to a lowering of a viscosity, and thus a large electric current can come to be uniformly applied to a surface to be plated.
  • a uniform plating can be obtained on a substrate face.
  • a nonpolar solvent having a dielectric constant of 8 or less is used as the organic solvent.
  • a polar organic solvent having a high dielectric constant the aluminum and the organic compound having an ion pair formed are dissociated and a precipitation efficiency of a plating becomes lowered.
  • Reasons therefor are because the Coulomb force between positive and negative ions in the ionic liquid is in inverse proportion to a dielectric constant of a medium, a higher dielectric constant of a solvent becomes a lower Coulomb force, a dissociation of a metal salt becomes easy, and a dissociation of an ion pair of the aluminum metal salt and the organic compound becomes easy.
  • a dielectric constant of the organic solvent is preferably 8 or less, more preferably 5 or less.
  • Such an organic solvent can include hexane (dielectric constant of 2.0), toluene (dielectric constant of 2.4), diethyl ether (dielectric constant of 4.3), ethylacetate (dielectric constant of 6.0), cyclohexane (dielectric constant of 2.0), xylene (dielectric constant of 2.5), benzene (dielectric constant of 2.3), naphthalene (dielectric constant of 2.5), heptane (dielectric constant of 1.9), cyclopentyl methyl ether (dielectric constant of 4.8), and dioxane (dielectric constant of 2.1), and any one or plural kinds thereof can be used.
  • a boiling point of the organic solvent is preferably 40°C or more, and a too low boiling point is not preferred because countermeasures against an exhalation and flammability etc. of the organic solvent such as a sealing and cooling etc. become excessive.
  • a volume fraction of the organic solvent in relation to a total volume of the ionic liquid and the organic solvent is preferably 30 vol% or more, further preferably 50 vol% or more, desirably 75 vol% or more.
  • a too high volume fraction of the organic solvent results in a too low ion concentration of aluminum, and more than 90 vol% causes a lowering of a current efficiency of plating.
  • the volume fraction of the organic solvent is preferably 90 vol%.
  • a transition metal salt of Ni, Co, or Cu etc. or a refractory metal salt of Ti, W or Mo is added as a base metal salt in addition to an aluminum salt, these elements are contained in the resulting plating film and a thermal stability can be enhanced.
  • nickel, nickel chloride or nickel sulfate etc. can be added so as to be a concentration of from 0.01 to 20 mol% while an amount of the aluminum salt added can be controlled so that a total metal salt concentration of the nickel salt and the aluminum salt is constant.
  • a metal salt etc. with a chloride can be added.
  • a plating treatment temperature is preferably from 10 to 60°C, further desirably 40°C or less.
  • a viscosity becomes high and a whole plating film has a tendency to become black.
  • an aluminum electroplating is conducted at an electric current density of from 0.01 to 10 A/dm 2 by a DC or a pulse electric current as plating conditions, a current efficiency becomes good and a uniform plating can be made. It is not preferred that an electric current density is too high, because an organic compound is decomposed, a plating layer is non-uniformized and further a current efficiency becomes lowered. It is desired that a plating is conducted in a dry inert gat atmosphere because the plating solution is unstable to oxygen or moisture.
  • the organic solvent used for washing, after the plating includes saturated aliphatic hydrocarbons such as hexane and dodecane, and aromatic hydrocarbons such as benzene, toluene, hexylbenzene and dodecylbenzene. They do not adversely affect even if being mixed into a plating solution. Of them, aromatic hydrocarbons having an alkyl substituent, particularly alkylbenzene having an alkyl substituent of 8 or less carbon atom, is especially preferred because they do not adversely affect a plating even if being mixed into a plating solution.
  • a boiling point of the organic solvent is preferably 40°C or more, and a too low boiling point is not preferred because countermeasures against an exhalation and flammability etc. of the organic solvent such as a sealing and cooling etc. become excessive.
  • 1-ethyl-3-methylimidazolium chloride (commercially available from KANTO CHEMICAL CO., INC.; [EMIM]Cl) and anhydrous aluminum chloride (Wako Pure Chemical Industries, Ltd., AlCl 3 ) were used.
  • the above mentioned melt was dissolved in 300 ml toluene (Wako Pure Chemical Industries, Ltd.), and a plating solution was prepared so as to be 400 ml in a total volume.
  • the resulting electrolyte 400 ml was charged into a polypropylene-made electrolytic bath having longitudinal x transversal x height of 100 mm x 50 mm x 100 mm.
  • a lead wire for connection with the electrodes are passed through at a state that a lid of the electrolytic bath is airtight, and were connected with a power supply.
  • An aluminum electroplating was conducted at an electric current density - 10mA/cm 2 for 20 minutes or an electric current density -20 mA/cm 2 for 10 minutes by using a constant electric current source, to form an aluminum plating film on a surface of a copper foil. It was conducted at a voltage of 3V or less in the plating. Then, an evaluation of a current efficiency and an observation of a surface state of the plating film were conducted. The current efficiency was determined by determining a precipitation amount of aluminum by actual measurement, comparing this to a precipitation amount precalculated based on an electric current value of a coulomb meter, and determining a ratio to the latter precipitation amount calculated as a percentage.
  • Aluminum chloride salts AlCl 3 were dissolved by using organic compounds and organic solvents shown at Table 1 so as to become one of several salt concentrations A (mol/l), to prepare plating solutions of Examples 2 to 12 as well as in Example 1.
  • An aluminum electroplating was conducted at an electric current density - 10mA/cm 2 for 20 minutes or an electric current density -20 mA/cm 2 for 10 minutes by using a constant electric current source. Then, an evaluation of a current efficiency and an observation of a surface state of the plating film were conducted. It was conducted at a voltage of 3V or less in the plating. The current efficiency was determined by determining a precipitation amount of aluminum by actual measurement, comparing this to a precipitation amount precalculated based on an electric current value of a coulomb meter, and determining a ratio to the latter precipitation amount calculated as a percentage. The results are shown at Table 1.
  • a plating was conducted onto a material to be plated which is a copper foil having a center folded at 90 degree in the L-shape.
  • a plating film thickness of 4 ⁇ m and a distribution within 8% were obtained.
  • the current efficiency was as good as 97%.
  • a plating was conducted by using, as a plating solution, an ionic liquid comprising 1-ethyl-3-methylimidazolium chloride (20 mol %) and aluminum trichloride (80 mol %) as well as in Example 1.
  • an ionic liquid comprising 1-ethyl-3-methylimidazolium chloride (20 mol %) and aluminum trichloride (80 mol %) as well as in Example 1.
  • a good plating was not able to be obtained to form a plating film having a black burned surface of an aluminum plating.
  • a viscosity of the plating solution was high, and thus a distribution of a film thickness became large.
  • a plating was conducted by using, as a plating solution, an ionic liquid comprising 1-ethyl-3-methylimidazolium chloride (20 mol %) and aluminum trichloride (80 mol %), as well as in Example 1, dissolved in a polar solvent propylene carbonate (dielectric constant of 65).
  • a polar solvent propylene carbonate (dielectric constant of 65).
  • a good plating was not able to be obtained and almost aluminum was not precipitated. It is understood that, when the ionic liquid is dissolved in such a polar solvent, the aluminum salt and the organic compound having an ion pair formed are dissociated to inhibit a plating reaction.
  • a plating was conducted by using, as a plating solution, an ionic liquid comprising 1-ethyl-3-methylimidazolium chloride (20 mol %) and aluminum trichloride (80 mol %), as well as in Example 1, dissolved in a polar solvent acetonitrile (dielectric constant of 38).
  • a plating solution an ionic liquid comprising 1-ethyl-3-methylimidazolium chloride (20 mol %) and aluminum trichloride (80 mol %), as well as in Example 1, dissolved in a polar solvent acetonitrile (dielectric constant of 38).
  • a good plating was not able to be obtained and almost aluminum was not precipitated.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP20110828690 2010-09-30 2011-09-01 Solution de dépôt électrolytique d'aluminium Withdrawn EP2623643A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010220239 2010-09-30
PCT/JP2011/069895 WO2012043129A1 (fr) 2010-09-30 2011-09-01 Solution de dépôt électrolytique d'aluminium

Publications (2)

Publication Number Publication Date
EP2623643A1 true EP2623643A1 (fr) 2013-08-07
EP2623643A4 EP2623643A4 (fr) 2015-03-04

Family

ID=45892602

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20110828690 Withdrawn EP2623643A4 (fr) 2010-09-30 2011-09-01 Solution de dépôt électrolytique d'aluminium

Country Status (4)

Country Link
US (1) US20130168258A1 (fr)
EP (1) EP2623643A4 (fr)
JP (1) JPWO2012043129A1 (fr)
WO (1) WO2012043129A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5704456B2 (ja) * 2011-05-31 2015-04-22 日立金属株式会社 電解アルミニウム箔製造装置
US9771661B2 (en) 2012-02-06 2017-09-26 Honeywell International Inc. Methods for producing a high temperature oxidation resistant MCrAlX coating on superalloy substrates
JP2014086139A (ja) * 2012-10-19 2014-05-12 Sumitomo Electric Ind Ltd タブリード及びタブリードの製造方法並びに電気化学デバイス
CN103290443B (zh) * 2013-05-15 2017-02-08 北京化工大学 一种超重力技术合成高择优取向铝镀层的方法
US20150101935A1 (en) 2013-10-14 2015-04-16 United Technologies Corporation Apparatus and method for ionic liquid electroplating
US9903034B2 (en) 2013-11-22 2018-02-27 Sikorsky Aircraft Corporation Methods and materials for electroplating aluminum in ionic liquids
US9758888B2 (en) * 2014-05-06 2017-09-12 Apple Inc. Preparation of metal substrate surfaces for electroplating in ionic liquids
US10087540B2 (en) * 2015-02-17 2018-10-02 Honeywell International Inc. Surface modifiers for ionic liquid aluminum electroplating solutions, processes for electroplating aluminum therefrom, and methods for producing an aluminum coating using the same
WO2017023743A1 (fr) * 2015-07-31 2017-02-09 University Of South Florida Électrodéposition d'alliages al-ni et structures multicouches d'al/ni
JP6471674B2 (ja) * 2015-10-14 2019-02-20 住友電気工業株式会社 アルミニウム膜及びその製造方法
CN108779568B (zh) 2016-03-11 2021-06-01 应用材料公司 在半导体处理设备上以电化学方式形成氧化钇的方法
CN108885979B (zh) * 2016-03-11 2024-04-09 应用材料公司 作为铝半导体处理设备的阻挡层的铝电镀和氧化物形成
US10407789B2 (en) 2016-12-08 2019-09-10 Applied Materials, Inc. Uniform crack-free aluminum deposition by two step aluminum electroplating process
CN106782980B (zh) * 2017-02-08 2018-11-13 包头天和磁材技术有限责任公司 永磁材料的制造方法
US11261533B2 (en) 2017-02-10 2022-03-01 Applied Materials, Inc. Aluminum plating at low temperature with high efficiency
US11142841B2 (en) 2019-09-17 2021-10-12 Consolidated Nuclear Security, LLC Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates
US11661665B2 (en) 2020-04-30 2023-05-30 The Boeing Company Aluminum and aluminum alloy electroplated coatings

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446349A (en) * 1944-02-29 1948-08-03 William Marsh Rice Inst For Th Electrodeposition of aluminum
JPH0613758B2 (ja) 1985-09-20 1994-02-23 日新製鋼株式会社 電気アルミニウムめっき方法
JP2657991B2 (ja) 1988-04-26 1997-09-30 日新製鋼株式会社 電気アルミニウムめっき浴およびその浴によるめっき方法
JP2678984B2 (ja) * 1988-04-26 1997-11-19 日新製鋼株式会社 電気アルミニウムめっき浴およびその浴によるめっき方法
JP2662635B2 (ja) * 1988-04-26 1997-10-15 日新製鋼株式会社 電気アルミニウムめっき浴およびその浴によるめっき方法
US5336378A (en) * 1989-02-15 1994-08-09 Japan Energy Corporation Method and apparatus for producing a high-purity titanium
US5041194A (en) * 1989-05-18 1991-08-20 Mitsubishi Petrochemical Co., Ltd. Aluminum electroplating method
JPH0361392A (ja) * 1989-07-28 1991-03-18 Mitsubishi Petrochem Co Ltd 低融点組成物およびその浴を用いる電気アルミニウムめっき方法
JPH03134193A (ja) * 1989-10-18 1991-06-07 Mitsubishi Petrochem Co Ltd 低融点組成物および電気アルミニウムめっき方法
JPH0421794A (ja) * 1990-05-16 1992-01-24 Mitsubishi Petrochem Co Ltd 低融点組成物および電気アルミニウムめっき方法
JP3324101B2 (ja) * 1992-08-14 2002-09-17 ソニー株式会社 アルミニウム非水電解液並びにそれを用いた電池及びアルミニウム電析方法
JP3202072B2 (ja) * 1992-09-21 2001-08-27 三菱化学株式会社 電気アルミニウムめっき方法
JP4693010B2 (ja) * 1995-06-30 2011-06-01 コバレント アソシェーツ，インコーポレイテッド 疎水性イオン液体
JP2004076031A (ja) 2002-08-09 2004-03-11 Ishikawajima Harima Heavy Ind Co Ltd 電解めっき用めっき浴及び複合めっき用めっき浴並びにこれらの製造方法
JP4756462B2 (ja) 2004-11-09 2011-08-24 日立金属株式会社 電解アルミニウムめっき液
JP5080097B2 (ja) * 2007-02-09 2012-11-21 ディップソール株式会社 溶融塩電気アルミニウムめっき浴及びそれを用いためっき方法
JP5270846B2 (ja) * 2007-02-09 2013-08-21 ディップソール株式会社 常温溶融塩浴を用いた電気Ａｌ−Ｚｒ合金めっき浴とそれを用いるめっき方法
EP1983079A1 (fr) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Couche barrière et son procédé de fabrication
EP1983592A1 (fr) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Procédé de fabrication d'une électrode
JP5299814B2 (ja) * 2008-01-22 2013-09-25 ディップソール株式会社 常温溶融塩浴を用いた電気Ａｌ−Ｚｒ−Ｍｎ合金めっき浴、そのめっき浴を用いためっき方法及びＡｌ−Ｚｒ−Ｍｎ合金めっき皮膜
JP5581523B2 (ja) * 2009-10-19 2014-09-03 ディップソール株式会社 アルミニウムまたはアルミニウム合金バレル電気めっき方法

Also Published As

Publication number Publication date
JPWO2012043129A1 (ja) 2014-02-06
WO2012043129A1 (fr) 2012-04-05
US20130168258A1 (en) 2013-07-04
EP2623643A4 (fr) 2015-03-04

Similar Documents

Publication Publication Date Title
EP2623643A1 (fr) Solution de dépôt électrolytique d'aluminium
Xia et al. Ionic liquid electrolytes for aluminium secondary battery: influence of organic solvents
AU2013257586B2 (en) Additives for zinc-bromine membraneless flow cells
JP5979117B2 (ja) アルミニウム箔の製造方法およびアルミニウム箔
Tachikawa et al. Electrochemistry of Sn (II)/Sn in a hydrophobic room-temperature ionic liquid
Jafarian et al. Electrodeposition of aluminum from molten AlCl3–NaCl–KCl mixture
Tang et al. Simultaneous manipulation of electric double layer and Zn (100) deposition enabled by anions for highly stable Zn anodes
KR101374754B1 (ko) 비수계 전해액에서 전해법을 이용한 금속 리튬의 제련 방법
Vega et al. Electrochemical comparison and deposition of lithium and potassium from phosphonium-and ammonium-TFSI ionic liquids
Elterman et al. Electrodeposition of aluminium from the chloroaluminate ionic liquid 1-ethyl-3-methylimidazolium chloride
US8518298B2 (en) Eutectic mixtures based upon multivalent metal ions
Yang et al. Electrodeposition of Cu–Li alloy from room temperature ionic liquid 1-butyl-3-methylimidazolium tetrafluoroborate
Li et al. Electrodeposition behavior of aluminum from urea-acetamide-lithium halide low-temperature molten salts
Vaughan et al. Electrodeposition of aluminum from aluminum chloride–trihexyl (tetradecyl) phosphonium chloride
US9382634B2 (en) Method for preparing low-melting-point plating solution for aluminum electroplating, plating solution for aluminum electroplating, method for producing aluminum foil, and method for lowering melting point of plating solution for aluminum electroplating
Traore et al. New insight into indium electrochemistry in a Tf2N-based room-temperature ionic liquid
Lei et al. Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions
JP2014156614A (ja) 電気アルミニウムめっき液
KR101552770B1 (ko) 비수계 전해법에 의한 마그네슘의 전해정련방법
JP5808866B2 (ja) 非水系電気めっき方法および非水系電気めっき装置
Wang et al. Electrochemical deposition of magnesium from analogous ionic liquid based on dimethylformamide
Hassanpouryouzband et al. Kinetics and mechanism of tin electrodeposition from fluoroborate bath onto pencil graphite electrode
JP7589529B2 (ja) 電気アルミニウムめっき液、及び、それを用いたアルミニウム被膜の製造方法、並びにアルミニウム箔の製造方法
Yang et al. Electrochemical Study of Indium in a Water‐Stable 1‐Ethyl‐3‐Methylimidazolium Chloride/Tetrafluoroborate Room Temperature Ionic Liquid
JPS641174B2 (fr)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130502

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20150203

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/44 20060101AFI20150128BHEP

Ipc: C25D 3/66 20060101ALI20150128BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20160720