EP3213367A1 - Sertissage de composant pour montage en surface à haute fréquence - Google Patents
Sertissage de composant pour montage en surface à haute fréquenceInfo
- Publication number
- EP3213367A1 EP3213367A1 EP15787616.0A EP15787616A EP3213367A1 EP 3213367 A1 EP3213367 A1 EP 3213367A1 EP 15787616 A EP15787616 A EP 15787616A EP 3213367 A1 EP3213367 A1 EP 3213367A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- crimp
- antenna
- electrically conductive
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 239000002985 plastic film Substances 0.000 claims description 15
- 229920006255 plastic film Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000002788 crimping Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/182—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for flat conductive elements, e.g. flat cables
Definitions
- the invention relates to an antenna system, in particular for a vehicle, comprising a printed circuit board and an antenna support having at least one electrically conductive structure for transmitting and / or receiving high-frequency signals, wherein the at least one electrically conductive structure via a crimp with crimped blades with a conductor of the circuit board electrically is contacted, according to the features of the preamble of claim 1, and generally a crimped connection.
- Such antenna systems in which electrically conductive structures form antenna structures which are arranged on an antenna carrier, for example a plastic film, and in which the at least one electrically conductive structure with an electronic device, the printed circuit board with a conductor thereon, which is a point of contact forms, are known.
- the antenna carrier with the antenna structures can, for example, be arranged plane-parallel to a vehicle window (for example in the region of the black print) visible or invisible, whereby the electrical contact with the electronic device, for example a frequency converter, a matching network, an amplifier or the like, takes place the electronic device is housed in a suitable space in the vehicle.
- the materials used for the antenna carrier and for the electronic device are different from each other, so it is necessary to separately produce the antenna carrier with the conductive structures on the one hand and the electronic device with its printed circuit board on the other hand.
- a crimp connector For electrical contacting of an antenna structure on an antenna carrier with an associated contact point of a conductor track on a printed circuit board of the electronic device, a crimp connector has already become known. Such a crimp connector used in a corresponding antenna system is shown in the prior art in FIG.
- Figure 1 shows an antenna system 1 with a printed circuit board 2 of an electronic device, not shown, wherein on the circuit board 2 a likewise not shown conductor track or a contact point of such a conductor path is present.
- an antenna support 3 is manufactured and arranged, wherein on the antenna support 3 not shown electrically conductive structures forming antenna structures are applied.
- a crimp 4 is used to the electrically conductive structure, in particular whose end region to be able to connect to the contact point of the conductor track of the printed circuit board 2 of the electronic device.
- This known crimp connector 4 has Crimperiel 5 (here four Crimperiel 5) and in the axial extent a Lötfahne 6.
- the crimp 4 is stung by means of a special press through the antenna support 3 and then mechanically deformed the Crimperiel 5 in the region of the electrically conductive structure or in the region of the contact point.
- a crimp connector 4 is shown in the undeformed state and in the right-hand part of FIG. 1 in the deformed state, wherein it can be seen that the crimp wings 4 are unbent in the direction of the electrically conductive structure, so that this region is not only mechanical set, but also contacted electrically.
- a soldering lug 6 of the crimp connector 4 is required, which considerably increases this crimping connector 4.
- the crimp connector 4 stands out clearly by means of this solder tail 6 at the edge of the printed circuit board 2 (board edge) or has a difficult repeatable distance to the printed circuit board 2 in the case of mass production of antenna systems.
- These properties in particular limit the possible applications in a good high-frequency design for such an antenna system disadvantageous, because it is particularly important here that no impedance jumps are present in the supply line, since such impedance jumps generate reflections, which leads to a loss of power and this in turn to a significantly deteriorated performance of the antenna system.
- the crimp connector 4 is soldered after deformation with the Lötfahne 6 with the contact point on the circuit board 2, so that special temperature characteristics of the antenna carrier 3 are required.
- This process is a further processing step, which costs time and money, since the antenna support 3 must either be made of high temperature resistant material and / or shielded against the soldering in an appropriate manner. It is therefore an object of the invention to improve a generic antenna system with respect to its mechanical structure, thereby simultaneously improving the performance characteristics of the antenna system. In addition, an improved crimp connection is to be provided for use in an antenna system, but also for applications beyond that.
- the crimp connector is soldered onto the conductor track of the printed circuit board (without having the known solder tail) and that the electrically conductive structure in the contact region with the crimp connector is arranged approximately plane-parallel to the printed circuit board.
- a Crimperieln crimp is provided, which is mounted on the circuit board and soldered to the electrically conductive structure of the circuit board.
- the crimp connector can be soldered in a simple manner to the printed conductor (or to a contact point of the printed conductor specially designed for this purpose). This can be done either individually by hand or in a particularly advantageous manner in a solder bath.
- the crimp connector is designed as an SMD crimp connector, so that the SMD technology (surface-mounted device technique) can be used. This offers itself from all things in the series production of such antenna systems or in general for the realization of crimp connections. This soldering is done in an advantageous manner completely independent of the antenna carrier, so that it does not have to have high temperature properties.
- the region of the electrically conductive structure to be contacted with the crimping connector is arranged approximately plane-parallel to the printed circuit board and by deformation the Crimperiel mechanically fixed and contacted at the same time.
- This crimp connection is a highly durable and long-lasting reliable contact that has been tried, so that thereby the electrically conductive structure is reliably and permanently connected to the associated contact point of the circuit board of the electronic device.
- a further advantage of this solution is the fact that the impedance in the contact region is favorably and purposefully influenced by the degrees of freedom, such as the different thicknesses of the antenna carrier and / or printed circuit board and the materials used for the electrically conductive structures and the conductor track, as well as the materials and geometries of the crimp connector can be.
- This design has the decisive advantage that, if at all, only a few transition losses occur and the impedance jumps that are disadvantageous in the prior art are either completely or largely avoided, thereby significantly increasing the performance of the antenna system.
- a plurality of crimp connectors are arranged side by side on the printed circuit board.
- a plurality of electrically conductive structures are arranged on the antenna carrier in a corresponding manner. This can be done in a simple manner by bringing the antenna carrier with the on the circuit board arranged Crimpsteckverbindern fast, easy and efficient contact can be achieved.
- the antenna carrier overlaps with one of its longitudinal sides at least partially, in particular completely, the printed circuit board. Due to this layer construction, contacting of several crimp connectors with a plurality of antenna structures results in a good contact with good impedance matching at the same time, so that even with more than one antenna structure no or only little transition loss occurs on the antenna support.
- a contact point of the electrically conductive structure is arranged on a tab projecting from a longitudinal side of the antenna carrier and contacted electrically by the crimp connector.
- a contacting of a crimp connector with a contact point on a tab takes place one after the other, whereas when the contact points or end regions of the antenna structures are guided to the side area of the antenna carrier, contacting of all contact points of the antenna structures with the crimp connectors occurs simultaneously the printed circuit board of the electronic device takes place when this side area of the antenna carrier overlaps placed on the side region of the circuit board and moved plane-parallel to each other.
- the antenna carrier recesses for the implementation of the Crimpulatel of the crimp in the not yet deformed state. This means that recesses are punched in the antenna support, for example, through which the crimps projecting upwards from the printed circuit board are carried out when a side region of the antenna support is moved in an overlapping plane parallel to the surface of the printed circuit board. This facilitates the process of bringing together and, moreover, the crimps have sufficient space and are not disturbed by material of the antenna carrier during deformation.
- the antenna carrier is suitable and designed for piercing the crimping prong of the crimp connector in the not yet deformed state.
- geometry and material properties of both the Crimperiel and the antenna carrier must be coordinated so that when the tips of Crimperiel the antenna carrier to pierce (possibly with the aid of a press or a punch) still no deformation or only a very minor Deformation of the Crimperiel takes place, so that they are then purposefully deformed for the purpose of mechanical fixation and electrical contacting.
- the antenna carrier is a plastic film.
- plastic film has the advantage that it can be easily and simply provided with the electrically conductive structures (for example by an imprinting process), at the same time can be adapted to the geometry in the installation space (or the installation surface) and also puncture the crimping prongs or ., the punching for the recesses for the implementation of Crimperiel realized easily.
- the plastic film may be plastically or thermally deformed in order to adapt it to the contact area on the printed circuit board and / or the installation space of the conductor structure arranged on the antenna carrier preferably before or during or even after installation.
- a printed circuit board which has a soldering surface, for example a conductor track or a contact point at the end of the conductor track, on which the crimp connector is soldered.
- This is a connecting part formed of printed circuit board and crimp available.
- the crimp connector has protruding Crimperiel, which form a contact area. In this contact region, an electrically conductive structure is inserted, then bent the Crimperiel to produce in this way the crimped connection and thus the electrical contact between the conductor track of the printed circuit board and the electrically conductive structure.
- the electrically conductive structure may be, for example, an electrical conductor of a cable, in particular the Inner conductor of a coaxial cable, act.
- electrically conductive structures are conceivable.
- it may be a metal foil, which is either inserted into the intermediate region between the crimped blades and then the crimp blades are bent over.
- the metal foil it is likewise conceivable for the crimped blades to pierce this metal foil or for the metal foil to have recesses through which the crimped blades can be made. After this has been done (passage or piercing) the crimp blades are bent over.
- the crimp connector which is soldered onto the printed circuit board, advantageously forms the crimped connection.
- a plastic film to the crimp connection, wherein the plastic film is laid flat on the printed circuit board, so that in this case an electrically conductive structure which is applied to the plastic film, in the contact region of the crimp, in particular between the Crimerieln Crimp connector, is arranged.
- the plastic film is pierced by placing the plastic film on the circuit board or it has recesses through which the Crimperiel are performed.
- the one unit is the electrically conductive structure (for example, an electrical conductor, metal foil or plastic film having an electrically conductive structure thereon) which is to be connected to a crimp connector to make a crimped connection.
- the second unit is formed by a printed circuit board to which the crimp connector is soldered.
- This crimp connector formed in this way can be produced simply, quickly and simply by forming the crimp connector as an SMD component, placing it on the printed circuit board at the desired location and then soldering it. This is done in a particularly preferred manner in a Lötbadmycin. After these two units have been produced separately from each other, they are combined for the purpose of spatial arrangement to one another and production of an electrical contact. introduced.
- the contact region of the electrically conductive structure for example end region of the cable, correspondingly shaped end region of the metal foil (for example elongated contact region) or, for example, strip-shaped region of the plastic film has an electrically conductive structure (in particular in oblong shape) arranged there the crimp connector is associated.
- This is done by placing the contact region of the electrically conductive structure from above toward the surface of the printed circuit board on which the crimp connector is located, and then bending over the crimp prong of the crimp connector so as to mechanically fix the contact region of the electrically conductive structure and at the same time make electrical contact.
- FIGS. 2 and 3 The manufacturing process and the design of such an antenna system are shown by way of example in FIGS. 2 and 3 and described below.
- crimp 4 formed in particular as an SMD component and designed differently from the known crimp connector is arranged. This arrangement is carried out by soldering the crimp connector 4 on the conductor track and can be supported by a mechanical fixing.
- the crimp connector 4 is arranged approximately in the side region of the printed circuit board 2 and in such a case, for example, in an end region of the conductor or with a specially provided there contact point in which the conductor opens, soldered.
- the crimp 4 can also be arranged in other areas (up in about the middle of the circuit board 2) on the circuit board 2 at a suitable location. This applies also for more than one crimp connector 4, wherein, for example, a plurality of crimp connectors 4 can be present in a row next to one another, in groups, or completely scattered over the printed circuit board 2.
- SMD technology an accurate positioning of the respective crimp connector 4 is possible, so that a plurality of crimp connectors 4 can be contacted with a pressing operation with the respective contact points of the antenna carrier 3.
- This accurate positioning (precision) of the crimp connector in particular in the series production of antenna systems, a repeatable geometry and thus a repeatable impedance can be produced in an advantageous manner.
- Figure 3 shows the contact made, it can be seen that the antenna support 3 (in particular a plastic film) with a protruding tab 7, which is arranged plane-parallel on the circuit board 2, the electrically conductive structure on the antenna support 3 with the crimp 4 on the Circuit board mechanically fixed and was electrically contacted, in which the Crimperiel 5 of the crimp 4 have been bent.
- the antenna carrier 3 the plastic film
- the antenna carrier 3 the plastic film
- the plastic film with one of its longitudinal sides overlaps at least partially, in particular completely, one of the longitudinal sides of the printed circuit board 2, so that in FIG illustrated embodiment with the tab 7 is only a particular embodiment.
Landscapes
- Engineering & Computer Science (AREA)
- Remote Sensing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
L'invention concerne un système d'antenne (1), en particulier pour un véhicule automobile, comportant une plaque conductrice (2) et un support d'antenne (3) avec au moins une structure électriquement conductrice pour envoyer et / ou recevoir des signaux à haute fréquence, au moins une structure électriquement conductrice étant en contact électrique avec une piste conductrice de la plaque conductrice (2) par l'intermédiaire d'un raccord à sertir (4) avec des ailes de sertissage (5) comprenant une piste conductrice de la plaque (2), caractérisé en ce que le raccord à sertir (4) est brasé sur la piste conductrice de la plaque (2) et en ce que la structure électriquement conductrice est disposée dans la zone de contact avec le raccord à sertir (4) dans un plan sensiblement parallèle à la plaque conductrice (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014115922 | 2014-10-31 | ||
| PCT/EP2015/075339 WO2016066839A1 (fr) | 2014-10-31 | 2015-10-30 | Sertissage de composant pour montage en surface à haute fréquence |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3213367A1 true EP3213367A1 (fr) | 2017-09-06 |
Family
ID=54364365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15787616.0A Withdrawn EP3213367A1 (fr) | 2014-10-31 | 2015-10-30 | Sertissage de composant pour montage en surface à haute fréquence |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3213367A1 (fr) |
| DE (1) | DE102015221344A1 (fr) |
| WO (1) | WO2016066839A1 (fr) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3752011T2 (de) * | 1986-04-03 | 1997-08-07 | Berg Electronics Mfg | Kontaktleiste |
| JPH10162885A (ja) * | 1996-12-02 | 1998-06-19 | Japan Aviation Electron Ind Ltd | 電気接続部材およびその製造方法 |
| US20080113553A1 (en) * | 2006-11-10 | 2008-05-15 | Janos Legrady | Surface mount crimp terminal and method of crimping an insulated conductor therein |
| US20140060929A1 (en) * | 2012-08-28 | 2014-03-06 | Zierick Manufacturing Corporation | Surface mount connector for electrically isolating two insulated conductors |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005009443A1 (de) * | 2005-03-02 | 2006-09-07 | Hirschmann Electronics Gmbh | Folienantenne für ein Fahrzeug |
| WO2009046752A1 (fr) * | 2007-10-02 | 2009-04-16 | Osram Gesellschaft mit beschränkter Haftung | Organe enfichable, connecteur enfichable et procédé de fabrication dudit organe enfichable |
-
2015
- 2015-10-30 DE DE102015221344.7A patent/DE102015221344A1/de active Pending
- 2015-10-30 EP EP15787616.0A patent/EP3213367A1/fr not_active Withdrawn
- 2015-10-30 WO PCT/EP2015/075339 patent/WO2016066839A1/fr not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3752011T2 (de) * | 1986-04-03 | 1997-08-07 | Berg Electronics Mfg | Kontaktleiste |
| JPH10162885A (ja) * | 1996-12-02 | 1998-06-19 | Japan Aviation Electron Ind Ltd | 電気接続部材およびその製造方法 |
| US20080113553A1 (en) * | 2006-11-10 | 2008-05-15 | Janos Legrady | Surface mount crimp terminal and method of crimping an insulated conductor therein |
| US20140060929A1 (en) * | 2012-08-28 | 2014-03-06 | Zierick Manufacturing Corporation | Surface mount connector for electrically isolating two insulated conductors |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2016066839A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016066839A1 (fr) | 2016-05-06 |
| DE102015221344A1 (de) | 2016-05-04 |
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