EP3552462A1 - Module électronique - Google Patents

Module électronique

Info

Publication number
EP3552462A1
EP3552462A1 EP17792043.6A EP17792043A EP3552462A1 EP 3552462 A1 EP3552462 A1 EP 3552462A1 EP 17792043 A EP17792043 A EP 17792043A EP 3552462 A1 EP3552462 A1 EP 3552462A1
Authority
EP
European Patent Office
Prior art keywords
electronic
contact surface
encapsulation
contact pin
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17792043.6A
Other languages
German (de)
English (en)
Inventor
Bernd Strütt
Christian Strittmatter
Simon Gerwig
Thorsten SIEDLER
Ralf Leisinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP3552462A1 publication Critical patent/EP3552462A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Definitions

  • the invention relates to an electronic module and a method for electrical contacting of this electronic module.
  • field devices are often used which serve for detecting and / or influencing process variables.
  • sensors are used which, for example, in
  • Conductivity meters etc. are used. They record the corresponding process variables, such as level, flow, pressure,
  • actuators such as valves or pumps, are used to control the flow of a liquid in a tank
  • Pipe section or the level can be changed in a container.
  • all those devices are called field devices, which are used close to the process and which provide or process process-relevant information. Therefore, in the context of the invention, field devices additionally also mean remote I / Os, radio adapters or generally electronic components, which are arranged on the field level. A large number of these field devices are manufactured and sold by Endress + Hauser.
  • the electronic assemblies in field devices must be encapsulated due to their particular operating conditions. On the one hand, this serves to protect the electronic assemblies from process-specific
  • Data transmission eg via an explosion-proof digital interface up to more than 10 minutes.
  • the invention is therefore based on the object to provide a secure electronic assembly for a field device.
  • the invention solves this problem by a corresponding electronics module. This comprises according to the invention:
  • At least one electronic component is
  • An encapsulation (for example, designed as pressure encapsulation according to the standard EN 60079-1), which encapsulates at least the at least one electrical contact surface.
  • the encapsulation according to the invention is embodied, at least in a subarea, such that the at least one electrical contact surface is connected by means of at least one electrical contact pin, for example one
  • Spring contact pin is contactable. Furthermore, the encapsulation is filled with a soft encapsulation at least between the at least one contact surface and the subregion.
  • the self-healing property of soft potting is used.
  • the puncture site of a contact pin closes in soft potting after removal of the contact pin again independently.
  • This can be created by means of one or more electrical contact surface (s) at least one physical interface to the electronics tree group, which is not subject to the restrictions on explosion-related Maximai transmission speed, but still
  • Explosion protection can offer because it is just reclosed by the soft grout.
  • an elastomer in particular SilGel® can be used as soft casting.
  • the at least one contact surface is arranged on a printed circuit board.
  • the electronic component is also arranged on the same circuit board.
  • the at least one contact surface may be, for example, as
  • contactability by the contact pin it is also appropriate in this case, designed as a conductor track contact surface by applying a
  • the configuration of the at least one subregion of the encapsulation is possible in various ways in the context of the invention:
  • the subregion can not be designed only as a recess or hole, so that the contact surface by means of the contact pin
  • At least one subarea is contactable.
  • In the at least one subarea can also be a
  • Membrane be arranged, which is puncturable by applying a predefined force (F) on the at least one contact pin.
  • the electronic module for this JTAG compliant comprises at least three contact surfaces.
  • the contact surfaces are to be contacted accordingly with the electronic component (which may be a microcontroller or an FPGA).
  • the electronic component which may be a microcontroller or an FPGA.
  • the object of the invention is based, in addition to the electronic assembly according to the invention also by a
  • the method comprises at least the following method step: pressing the at least one electrical contact pin onto the
  • Pressing force is chosen such that the contact pin by the
  • Soft casting is pressed through to the contact surface. This makes it possible to contact or program the electronic component via the at least one contact pin, wherein the
  • Contact pin can be removed from the enclosure after the end of programming over the sub-area.
  • the soft potting closes again according to self-healing.
  • Fig. 1 A contactable by means of a contact pin electronics module.
  • Fig. 1 is a possible embodiment of an inventive
  • Electronic assembly 1 shown It is based in the core on an electronic component 1 1, that is arranged on a printed circuit board 15. In this case, it may be, for example, a microcontroller in the electronic component 1 1.
  • the electronics module 1 is encapsulated by a (pressure) encapsulation 1 3, whereby the electronics module 1 can be used in a potentially explosive area with appropriate design of this encapsulation 13.
  • a (pressure) encapsulation 1 3 whereby the electronics module 1 can be used in a potentially explosive area with appropriate design of this encapsulation 13.
  • the electronic module 1 Due to the encapsulation 13, the electronic module 1 is thus z. B. predestined for use in a field device.
  • the electronics module 1 comprises an explosion-proof interface 16, via which at least the electronic Component 1 1 is electrically contacted.
  • the explosion-proof interface 16 is disposed on that side of the circuit board 15, which faces away from the electronic component 1 1. Since the explosion-proof interface 16 leads out of the area of the electronics assembly 1, which is encapsulated by the encapsulation 13, the
  • explosion-proof interface 16 in its maximum transferable power, and thus be limited in their maximum data transfer rate.
  • a programming (or "flashing") of the electronic component 1 for example. In order to use the electronic module 1 later in a field device, would thus be on this explosion-proof interface 16
  • the electronic module 1 therefore additionally comprises at least one electrical contact surface 12, which is arranged inside the encapsulation 13 on the printed circuit board 15 and is connected to the electronic component 11 (for reasons of clarity, only a single contact surface 12 is shown in FIG In practice, however, the number of contact surfaces 12 is to be made particularly dependent on the type of interface used).
  • the electrical contact surface 12 can be realized on the printed circuit board 15 as an optionally reinforced in its thickness conductor track structure.
  • the encapsulation 13 is designed in a subregion 131 above the electrical contact surface 12 so that the

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un module électronique antidéflagrant (1) munie d'une interface rapide et un procédé de mise en contact électronique de ce module électronique (1) par le biais de cette interface. Ledit module possède en outre, en plus d'un composant électronique (11), au moins une surface de contact électrique (12) destinée à la mise en contact électrique de ce composant (11) et une encapsulation (13) qui encapsule au moins l'au moins une surface de contact électrique (12). Selon l'invention, l'encapsulation (13) est formée au moins dans une sous-région (131) de telle sorte que l'au moins surface de contact (12) peut être contactée au moyen d'au moins une broche de contact électrique (2). L'encapsulation (13) est remplie d'une matière d'enrobage molle (14) au moins entre l'au moins une surface de contact (12) et la sous-région (131). Ainsi, une interface physique destinée au module électronique (1) est réalisée selon l'invention par au moins une surface de contact électrique (12), laquelle interface n'est pas soumise aux limitations relatives à la vitesse de transmission maximale liée à la protection antidéflagrante mais peut offrir néanmoins une protection antidéflagrante parce qu'elle est refermée par la matière d'enrobage molle (14), qui se referme automatiquement, après le retrait de la broche de contact (2).
EP17792043.6A 2016-12-09 2017-10-30 Module électronique Pending EP3552462A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016123917.8A DE102016123917A1 (de) 2016-12-09 2016-12-09 Elektronik-Baugruppe
PCT/EP2017/077749 WO2018103950A1 (fr) 2016-12-09 2017-10-30 Module électronique

Publications (1)

Publication Number Publication Date
EP3552462A1 true EP3552462A1 (fr) 2019-10-16

Family

ID=60201566

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17792043.6A Pending EP3552462A1 (fr) 2016-12-09 2017-10-30 Module électronique

Country Status (5)

Country Link
US (1) US10861762B2 (fr)
EP (1) EP3552462A1 (fr)
CN (1) CN110313220A (fr)
DE (1) DE102016123917A1 (fr)
WO (1) WO2018103950A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123530A1 (de) * 2017-10-10 2019-04-11 Endress+Hauser SE+Co. KG Verfahren zur mechanischen Kontaktierung eines Vergussrahmens auf einer Leiterplatte
DE102018217349A1 (de) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102019207971A1 (de) * 2019-05-29 2020-12-03 Robert Bosch Gmbh Elektronikeinheit für eine Handwerkzeugmaschine
DE102021125881A1 (de) * 2021-10-06 2023-04-06 Endress+Hauser SE+Co. KG Leiterplatte für ein Feldgerät der Automatisierungstechnik
DE102024203579A1 (de) * 2024-04-18 2025-10-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Auslesen eines Datenträgers eines Kraftfahrzeugs

Citations (3)

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WO2004014116A1 (fr) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Boitier electronique comportant un dissipateur thermique integre
EP2673595B1 (fr) * 2011-02-09 2017-08-02 KROHNE Messtechnik GmbH Appareil antidéflagrant
EP2991459B1 (fr) * 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Dispositif doté d'une carte de circuit imprimé sur un seul côté

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Publication number Priority date Publication date Assignee Title
WO2004014116A1 (fr) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Boitier electronique comportant un dissipateur thermique integre
EP2673595B1 (fr) * 2011-02-09 2017-08-02 KROHNE Messtechnik GmbH Appareil antidéflagrant
EP2991459B1 (fr) * 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Dispositif doté d'une carte de circuit imprimé sur un seul côté

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Title
See also references of WO2018103950A1 *

Also Published As

Publication number Publication date
US20200066610A1 (en) 2020-02-27
CN110313220A (zh) 2019-10-08
DE102016123917A1 (de) 2018-06-14
US10861762B2 (en) 2020-12-08
WO2018103950A1 (fr) 2018-06-14

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