EP3633066A1 - Mehrstufiges harzoberflächenätzverfahren und plattierungsverfahren auf harz damit - Google Patents

Mehrstufiges harzoberflächenätzverfahren und plattierungsverfahren auf harz damit Download PDF

Info

Publication number: EP3633066A1
Authority: EP; European Patent Office
Prior art keywords: resin; acid; resin surface; plating; oxidizing agent
Prior art date: 2017-06-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP18810479.8A

Other languages

English (en)

French (fr)

Other versions

EP3633066B1 (de

EP3633066A4 (de

Inventor

Yasuyuki Kuramochi

Hiroshi Ishizuka

Miyoko IZUMITANI

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JCU Corp

Original Assignee

JCU Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-06-01

Filing date

2018-03-15

Publication date

2020-04-08

2018-03-15 Application filed by JCU Corp filed Critical JCU Corp

2020-04-08 Publication of EP3633066A1 publication Critical patent/EP3633066A1/de

2021-02-17 Publication of EP3633066A4 publication Critical patent/EP3633066A4/de

2023-09-13 Application granted granted Critical

2023-09-13 Publication of EP3633066B1 publication Critical patent/EP3633066B1/de

Status Active legal-status Critical Current

2038-03-15 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

the present invention relates to a multi-stage resin surface etching method, and a plating method on a resin using the same.
An object of the present invention is to provide a novel technique that is a resin etching technique without using chromic acid and can be operated at an industrial level.
the resin surface etching method of the present invention can suppress decomposition of an oxidizing agent used for etching. Further, in the resin surface etching method of the present invention, the etching step is repeatedly performed, however, etching can be more efficiently performed in a shorter time than when the etching step is performed in one stage for a long time. In addition, by the resin surface etching method of the present invention, the resin surface can be sufficiently etched, and therefore, it is not necessary to perform a resin swelling step that was conventionally required.

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Electrochemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)

EP18810479.8A 2017-06-01 2018-03-15 Mehrstufiges harzoberflächenätzverfahren und plattierungsverfahren auf harz damit Active EP3633066B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2017020426		2017-06-01
PCT/JP2018/010095 WO2018220946A1 (ja)	2017-06-01	2018-03-15	樹脂表面の多段エッチング方法およびこれを利用した樹脂へのめっき方法

Publications (3)

Publication Number	Publication Date
EP3633066A1 true EP3633066A1 (de)	2020-04-08
EP3633066A4 EP3633066A4 (de)	2021-02-17
EP3633066B1 EP3633066B1 (de)	2023-09-13

Family

ID=64455472

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP18810479.8A Active EP3633066B1 (de)	2017-06-01	2018-03-15	Mehrstufiges harzoberflächenätzverfahren und plattierungsverfahren auf harz damit

Country Status (6)

Country	Link
US (1)	US20200087791A1 (de)
EP (1)	EP3633066B1 (de)
JP (1)	JP7036817B2 (de)
KR (1)	KR102591173B1 (de)
CN (1)	CN110709535A (de)
WO (1)	WO2018220946A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US12435273B2 (en) *	2021-02-26	2025-10-07	Atotech Deutschland GmbH & Co. KG	Method for etching at least one surface of a plastic substrate

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5420516Y2 (de)	1974-12-16	1979-07-24
DE3928832C2 (de) *	1989-08-31	1995-04-20	Blasberg Oberflaechentech	Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
US5160600A (en) *	1990-03-05	1992-11-03	Patel Gordhanbai N	Chromic acid free etching of polymers for electroless plating
JP3100866B2 (ja) *	1995-05-25	2000-10-23	松下電工株式会社	樹脂成形体表面のメタライズ方法
JP3420860B2 (ja) *	1995-06-08	2003-06-30	イビデン株式会社	無電解めっき用接着剤の粗化方法およびプリント配線板の製造方法
JP3173452B2 (ja) *	1997-02-28	2001-06-04	株式会社豊田中央研究所	耐摩耗性被覆部材及びその製造方法
JP3300653B2 (ja) *	1997-12-05	2002-07-08	イビデン株式会社	無電解めっき用接着剤および多層プリント配線板
JP3710408B2 (ja)	2001-10-19	2005-10-26	株式会社太洋工作所	メッキ成形品の製造方法
JP3885165B2 (ja) *	2001-08-13	2007-02-21	中央化成品株式会社	ポリエチレンテレフタレート成形体表面の改質方法、表面の改質されたポリエチレンテレフタレート成形体及びプリント配線基板
US20050199587A1 (en)	2004-03-12	2005-09-15	Jon Bengston	Non-chrome plating on plastic
JP2007100174A (ja) *	2005-10-05	2007-04-19	Okuno Chem Ind Co Ltd	スチレン系樹脂成形体へのめっき用前処理方法
US8394289B2 (en)	2006-04-18	2013-03-12	Okuno Chemicals Industries Co., Ltd.	Composition for etching treatment of resin molded article
KR20100014699A (ko) *	2007-04-18	2010-02-10	에바라 유지라이토 가부시키가이샤	에칭액 및 이를 이용한 플라스틱 표면의 금속화 방법
JP5585980B2 (ja)	2007-05-22	2014-09-10	奥野製薬工業株式会社	樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤
JP2009228083A (ja) *	2008-03-25	2009-10-08	Ebara-Udylite Co Ltd	プラスチック表面への金属めっき方法
WO2010035451A1 (ja)	2008-09-24	2010-04-01	積水化学工業株式会社	半硬化体、硬化体、積層体、半硬化体の製造方法及び硬化体の製造方法
EP2657367B1 (de) *	2012-04-24	2015-11-25	Enthone Inc.	Vorätzzusammensetzung und Ätzverfahren für Kunststoffsubstrate
LT5997B (lt) *	2012-06-05	2014-02-25	Atotech Deutschland Gmbh	Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
ES2708341T3 (es) *	2016-11-22	2019-04-09	Macdermid Enthone Gmbh	Grabado exento de cromo para un galvanizado sobre plástico
CN109423683B (zh) *	2017-08-30	2021-03-23	广东新会中集特种运输设备有限公司	集装箱的涂装系统及集装箱的涂装方法

2018
- 2018-03-15 WO PCT/JP2018/010095 patent/WO2018220946A1/ja not_active Ceased
- 2018-03-15 KR KR1020197035247A patent/KR102591173B1/ko active Active
- 2018-03-15 JP JP2019521966A patent/JP7036817B2/ja active Active
- 2018-03-15 EP EP18810479.8A patent/EP3633066B1/de active Active
- 2018-03-15 US US16/617,226 patent/US20200087791A1/en not_active Abandoned
- 2018-03-15 CN CN201880035472.7A patent/CN110709535A/zh active Pending

Also Published As

Publication number	Publication date
JPWO2018220946A1 (ja)	2020-04-02
WO2018220946A1 (ja)	2018-12-06
CN110709535A (zh)	2020-01-17
KR20200014763A (ko)	2020-02-11
KR102591173B1 (ko)	2023-10-18
EP3633066B1 (de)	2023-09-13
JP7036817B2 (ja)	2022-03-15
US20200087791A1 (en)	2020-03-19
EP3633066A4 (de)	2021-02-17

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