EP3736842A4 - Folienkondensator und aussengehäuse für einen folienkondensator - Google Patents

Folienkondensator und aussengehäuse für einen folienkondensator Download PDF

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Publication number
EP3736842A4
EP3736842A4 EP19744167.8A EP19744167A EP3736842A4 EP 3736842 A4 EP3736842 A4 EP 3736842A4 EP 19744167 A EP19744167 A EP 19744167A EP 3736842 A4 EP3736842 A4 EP 3736842A4
Authority
EP
European Patent Office
Prior art keywords
film capacitor
external box
capacitor
film
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19744167.8A
Other languages
English (en)
French (fr)
Other versions
EP3736842A1 (de
Inventor
Satoru JOGAN
Shinichi Kobayashi
Tomomichi Ichikawa
Satoshi Kamei
Kimiaki KIKUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Original Assignee
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd, Shizuki Electric Co Inc filed Critical Murata Manufacturing Co Ltd
Publication of EP3736842A1 publication Critical patent/EP3736842A1/de
Publication of EP3736842A4 publication Critical patent/EP3736842A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04Ingredients characterised by their shape and organic or inorganic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • H01G2/106Fixing the capacitor in a housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2429/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
    • C08J2429/14Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • H01G2/103Sealings, e.g. for lead-in wires; Covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
EP19744167.8A 2018-01-25 2019-01-25 Folienkondensator und aussengehäuse für einen folienkondensator Withdrawn EP3736842A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018010869 2018-01-25
PCT/JP2019/002456 WO2019146755A1 (ja) 2018-01-25 2019-01-25 フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース

Publications (2)

Publication Number Publication Date
EP3736842A1 EP3736842A1 (de) 2020-11-11
EP3736842A4 true EP3736842A4 (de) 2021-10-27

Family

ID=67395988

Family Applications (2)

Application Number Title Priority Date Filing Date
EP19744167.8A Withdrawn EP3736842A4 (de) 2018-01-25 2019-01-25 Folienkondensator und aussengehäuse für einen folienkondensator
EP19743377.4A Active EP3736841B1 (de) 2018-01-25 2019-01-25 Folienkondensator und aussengehäuse für einen folienkondensator

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP19743377.4A Active EP3736841B1 (de) 2018-01-25 2019-01-25 Folienkondensator und aussengehäuse für einen folienkondensator

Country Status (5)

Country Link
US (2) US11791099B2 (de)
EP (2) EP3736842A4 (de)
JP (2) JP6886669B2 (de)
CN (2) CN111557037A (de)
WO (2) WO2019146755A1 (de)

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* Cited by examiner, † Cited by third party
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TWI874360B (zh) * 2019-03-05 2025-03-01 美商陶氏全球科技有限責任公司 雙組分基於溶劑之黏合劑組合物
JP7222494B2 (ja) * 2019-08-08 2023-02-15 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース
WO2021044630A1 (ja) * 2019-09-06 2021-03-11 日立エーアイシー株式会社 ケース型フィルムコンデンサの製造方法及び製造システム
KR102842071B1 (ko) * 2019-09-18 2025-08-04 삼성전기주식회사 전자 부품 및 그 실장 기판
JP7136369B2 (ja) * 2019-12-27 2022-09-13 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
CN115605971B (zh) * 2020-07-07 2025-08-29 松下知识产权经营株式会社 电容器
JP7804943B2 (ja) * 2020-09-14 2026-01-23 パナソニックIpマネジメント株式会社 コンデンサ
JP7756368B2 (ja) * 2020-09-30 2025-10-20 パナソニックIpマネジメント株式会社 フィルムコンデンサ、フィルムコンデンサの製造方法
WO2022075362A1 (ja) * 2020-10-09 2022-04-14 株式会社村田製作所 フィルムコンデンサ、フィルム、及び、金属化フィルム
WO2022138105A1 (ja) * 2020-12-21 2022-06-30 パナソニックIpマネジメント株式会社 積層体、電子部品及びコンデンサ
CN112768240A (zh) * 2020-12-22 2021-05-07 马鞍山蒹葭电子科技有限公司 电磁兼容的金属化薄膜电容器
KR102542470B1 (ko) * 2021-10-13 2023-06-12 이동우 슈퍼커패시터 및 그 제조 방법
JP7843464B2 (ja) * 2021-11-02 2026-04-10 パナソニックIpマネジメント株式会社 ケースレスコンデンサ
WO2024014111A1 (ja) * 2022-07-15 2024-01-18 株式会社村田製作所 コンデンサ
JPWO2024079967A1 (de) * 2022-10-12 2024-04-18

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EP2557122A1 (de) * 2010-12-28 2013-02-13 Toray Industries, Inc. Flüssigkristallpolyesterharz-zusammensetzung, herstellungsverfahren dafür und formkörper daraus

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US20060104006A1 (en) * 2004-11-17 2006-05-18 Matsushita Electric Industrial Co., Ltd. Film capacitor and method of manufacturing the same
EP1868217A1 (de) * 2005-04-08 2007-12-19 Matsushita Electric Industrial Co., Ltd. Metallfilmkondensator, gehäusemodulkondensator damit, wechselrichterkreis und steuerkreis für einen fahrzeugantriebsmotor
US20100091425A1 (en) * 2006-12-22 2010-04-15 Panasonic Corporation Electronic component and method for producing the same
JP2009010265A (ja) * 2007-06-29 2009-01-15 Nichicon Corp 金属化フィルムコンデンサ
US20100202095A1 (en) * 2007-10-12 2010-08-12 Takuya Kyouda Case mold type capacitor and method for manufacturing the same
EP2557122A1 (de) * 2010-12-28 2013-02-13 Toray Industries, Inc. Flüssigkristallpolyesterharz-zusammensetzung, herstellungsverfahren dafür und formkörper daraus

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Title
See also references of WO2019146755A1 *

Also Published As

Publication number Publication date
EP3736841A4 (de) 2021-11-24
US11437190B2 (en) 2022-09-06
CN111557037A (zh) 2020-08-18
CN111566768B (zh) 2022-01-21
US20200294717A1 (en) 2020-09-17
JPWO2019146751A1 (ja) 2020-10-22
JPWO2019146755A1 (ja) 2020-10-22
US20200294718A1 (en) 2020-09-17
EP3736841A1 (de) 2020-11-11
US11791099B2 (en) 2023-10-17
CN111566768A (zh) 2020-08-21
WO2019146755A1 (ja) 2019-08-01
EP3736842A1 (de) 2020-11-11
EP3736841B1 (de) 2025-12-17
WO2019146751A1 (ja) 2019-08-01
JP6886669B2 (ja) 2021-06-16
JP7057923B2 (ja) 2022-04-21

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