EP3988607A4 - Hochwärmeleitende silikonzusammensetzung und gehärtetes produkt daraus - Google Patents

Hochwärmeleitende silikonzusammensetzung und gehärtetes produkt daraus Download PDF

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Publication number
EP3988607A4
EP3988607A4 EP20831872.5A EP20831872A EP3988607A4 EP 3988607 A4 EP3988607 A4 EP 3988607A4 EP 20831872 A EP20831872 A EP 20831872A EP 3988607 A4 EP3988607 A4 EP 3988607A4
Authority
EP
European Patent Office
Prior art keywords
cured product
high heat
heat conductive
silicone composition
conductive silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20831872.5A
Other languages
English (en)
French (fr)
Other versions
EP3988607A1 (de
Inventor
Mitsuhiro Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP3988607A1 publication Critical patent/EP3988607A1/de
Publication of EP3988607A4 publication Critical patent/EP3988607A4/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP20831872.5A 2019-06-24 2020-06-08 Hochwärmeleitende silikonzusammensetzung und gehärtetes produkt daraus Withdrawn EP3988607A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019116127 2019-06-24
PCT/JP2020/022510 WO2020261958A1 (ja) 2019-06-24 2020-06-08 高熱伝導性シリコーン組成物及びその硬化物

Publications (2)

Publication Number Publication Date
EP3988607A1 EP3988607A1 (de) 2022-04-27
EP3988607A4 true EP3988607A4 (de) 2023-07-26

Family

ID=74059708

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20831872.5A Withdrawn EP3988607A4 (de) 2019-06-24 2020-06-08 Hochwärmeleitende silikonzusammensetzung und gehärtetes produkt daraus

Country Status (6)

Country Link
US (1) US20220372359A1 (de)
EP (1) EP3988607A4 (de)
JP (1) JP7168084B2 (de)
KR (1) KR102896173B1 (de)
CN (1) CN113993939B (de)
WO (1) WO2020261958A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7608241B2 (ja) * 2021-03-31 2025-01-06 デンカ株式会社 被覆マグネシア粒子、放熱材用フィラー、樹脂組成物、及び被覆マグネシア粒子の製造方法
EP4112674A1 (de) * 2021-06-30 2023-01-04 Evonik Operations GmbH Verfahren zur herstellung hochreiner hydrosilylierungsprodukte
CN114213851A (zh) * 2021-07-22 2022-03-22 苏州桐力光电股份有限公司 一种有机硅网络原位插层堆叠氧化铝材料及制备方法
EP4206299A1 (de) * 2021-12-31 2023-07-05 Tianjin Laird Technologies Limited Neues polstermaterial mit niedrigem ölausblutendem thermischem spalt
CN116410603A (zh) * 2021-12-31 2023-07-11 天津莱尔德电子材料有限公司 新型低渗油热间隙垫材料
DE102023200552A1 (de) * 2023-01-25 2024-07-25 Robert Bosch Gesellschaft mit beschränkter Haftung Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse
CN120603901A (zh) 2023-02-02 2025-09-05 信越化学工业株式会社 高导热性有机硅组合物及其固化物
CN121079362A (zh) * 2023-03-22 2025-12-05 信越化学工业株式会社 导热性有机硅组合物及其固化物以及制造方法
KR20260007221A (ko) 2023-04-27 2026-01-13 다우 실리콘즈 코포레이션 경화성 열전도성 조성물
CN117210014B (zh) * 2023-08-28 2024-10-18 湖北三峡实验室 一种低热阻有机硅导热界面材料及其制备方法
WO2025062949A1 (ja) * 2023-09-20 2025-03-27 信越化学工業株式会社 熱伝導性シリコーン組成物及びシート状硬化物
CN120648240A (zh) * 2024-03-15 2025-09-16 华为技术有限公司 一种导热吸波组合物及其应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166363B2 (en) * 2003-08-25 2007-01-23 Shin-Etsu Chemical Co., Ltd. Highly heat conductive silicone rubber composition, fixing roll and fixing belt
JP2015071662A (ja) * 2013-10-02 2015-04-16 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used
WO2020153505A1 (ja) * 2019-01-25 2020-07-30 デンカ株式会社 フィラー組成物、シリコーン樹脂組成物及び放熱部品

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JPS5418298B2 (de) * 1972-06-24 1979-07-06
JPS5940325B2 (ja) * 1977-03-10 1984-09-29 株式会社東芝 パルス幅調整装置
JPS5565838A (en) 1978-11-13 1980-05-17 Matsushita Electric Ind Co Ltd Cooker
JPH05239358A (ja) 1992-03-02 1993-09-17 Toshiba Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP3127093B2 (ja) 1994-03-03 2001-01-22 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP3189590B2 (ja) * 1994-09-20 2001-07-16 東海ゴム工業株式会社 放熱シートおよびその製法
JP4610764B2 (ja) 2001-03-15 2011-01-12 電気化学工業株式会社 放熱スペーサー
WO2002092693A1 (en) 2001-05-14 2002-11-21 Dow Corning Toray Silicone Co., Ltd. Heat-conductive silicone composition
JP2003342021A (ja) 2002-05-28 2003-12-03 Polymatech Co Ltd 酸化アルミニウム粉末組成物及びそれを含有する熱伝導性成形体
JP2005162555A (ja) 2003-12-04 2005-06-23 Tokuyama Corp 球状窒化アルミニウムおよび、その製法
JP4481019B2 (ja) 2004-01-21 2010-06-16 電気化学工業株式会社 混合粉末及びその用途
JP5418298B2 (ja) 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5755977B2 (ja) 2011-09-08 2015-07-29 電気化学工業株式会社 高熱伝導性樹脂組成物
JP5940325B2 (ja) 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP6339761B2 (ja) * 2012-12-17 2018-06-06 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び熱伝導性部材
JP6724332B2 (ja) * 2014-10-31 2020-07-15 堺化学工業株式会社 酸化マグネシウム粒子、その製造方法、放熱性樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP6648837B2 (ja) * 2016-11-09 2020-02-14 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法
WO2018088417A1 (ja) * 2016-11-09 2018-05-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法
CN109095482A (zh) * 2018-08-10 2018-12-28 天津泽希矿产加工有限公司 一种球形氧化镁及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166363B2 (en) * 2003-08-25 2007-01-23 Shin-Etsu Chemical Co., Ltd. Highly heat conductive silicone rubber composition, fixing roll and fixing belt
JP2015071662A (ja) * 2013-10-02 2015-04-16 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used
WO2020153505A1 (ja) * 2019-01-25 2020-07-30 デンカ株式会社 フィラー組成物、シリコーン樹脂組成物及び放熱部品
EP3915939A1 (de) * 2019-01-25 2021-12-01 Denka Company Limited Füllstoffzusammensetzung, silikonharzzusammensetzung und wärmeableitungskomponente

Non-Patent Citations (1)

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Title
See also references of WO2020261958A1 *

Also Published As

Publication number Publication date
JPWO2020261958A1 (de) 2020-12-30
EP3988607A1 (de) 2022-04-27
CN113993939B (zh) 2024-07-16
KR20220024818A (ko) 2022-03-03
US20220372359A1 (en) 2022-11-24
JP7168084B2 (ja) 2022-11-09
KR102896173B1 (ko) 2025-12-08
WO2020261958A1 (ja) 2020-12-30
CN113993939A (zh) 2022-01-28

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