EP4379092A4 - Solution d'argenture - Google Patents

Solution d'argenture

Info

Publication number
EP4379092A4
EP4379092A4 EP22896161.1A EP22896161A EP4379092A4 EP 4379092 A4 EP4379092 A4 EP 4379092A4 EP 22896161 A EP22896161 A EP 22896161A EP 4379092 A4 EP4379092 A4 EP 4379092A4
Authority
EP
European Patent Office
Prior art keywords
plating solution
silver plating
silver
solution
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22896161.1A
Other languages
German (de)
English (en)
Other versions
EP4379092A1 (fr
Inventor
Hyun Nam Cho
Hyun Ju Kim
Haesun Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PESOLVE CO Ltd
Original Assignee
PESOLVE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PESOLVE CO Ltd filed Critical PESOLVE CO Ltd
Publication of EP4379092A1 publication Critical patent/EP4379092A1/fr
Publication of EP4379092A4 publication Critical patent/EP4379092A4/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Inorganic Chemistry (AREA)
EP22896161.1A 2021-11-19 2022-11-21 Solution d'argenture Pending EP4379092A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210160238A KR102476608B1 (ko) 2021-11-19 2021-11-19 은도금액
PCT/KR2022/018390 WO2023090964A1 (fr) 2021-11-19 2022-11-21 Solution d'argenture

Publications (2)

Publication Number Publication Date
EP4379092A1 EP4379092A1 (fr) 2024-06-05
EP4379092A4 true EP4379092A4 (fr) 2025-10-22

Family

ID=84439261

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22896161.1A Pending EP4379092A4 (fr) 2021-11-19 2022-11-21 Solution d'argenture

Country Status (6)

Country Link
US (1) US20250043429A1 (fr)
EP (1) EP4379092A4 (fr)
JP (1) JP7769429B2 (fr)
KR (1) KR102476608B1 (fr)
CN (1) CN118159687A (fr)
WO (1) WO2023090964A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117802484B (zh) * 2023-10-26 2024-07-05 深圳创智芯联科技股份有限公司 一种无氰化学还原加厚金的工艺配方及化学镀方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160168408A1 (en) * 2014-08-05 2016-06-16 Pesolve Co., Ltd. Silver ink
WO2017057188A1 (fr) * 2015-09-29 2017-04-06 トッパン・フォームズ株式会社 Composition d'encre argentée, son procédé de production, et produit feuilleté

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5322553A (en) 1993-02-22 1994-06-21 Applied Electroless Concepts Electroless silver plating composition
DE19928047A1 (de) 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen
JP4171604B2 (ja) 2002-03-18 2008-10-22 株式会社大和化成研究所 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物
KR100701576B1 (ko) * 2005-02-22 2007-03-29 주식회사 에이엔씨아이 무전해 은/요오드 도금처리에 의한 활성탄소의 제조방법
SG179380A1 (en) 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Cyanide-free silver electroplating solutions
JP5732224B2 (ja) 2010-10-06 2015-06-10 上村工業株式会社 還元型無電解銀めっき液
KR101531891B1 (ko) * 2011-04-20 2015-06-29 주식회사 잉크테크 은 잉크 조성물
JP5932054B2 (ja) * 2011-12-15 2016-06-08 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 黒鉛への銀の無電解めっき
KR102059805B1 (ko) * 2012-09-28 2019-12-27 돗빤호무즈가부시기가이샤 은 잉크 조성물, 도전체 및 통신 기기
US9982349B2 (en) 2015-05-11 2018-05-29 Eastman Kodak Company Method for making electrically-conductive articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160168408A1 (en) * 2014-08-05 2016-06-16 Pesolve Co., Ltd. Silver ink
WO2017057188A1 (fr) * 2015-09-29 2017-04-06 トッパン・フォームズ株式会社 Composition d'encre argentée, son procédé de production, et produit feuilleté

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2023090964A1 *

Also Published As

Publication number Publication date
WO2023090964A1 (fr) 2023-05-25
US20250043429A1 (en) 2025-02-06
CN118159687A (zh) 2024-06-07
JP2024538434A (ja) 2024-10-18
KR102476608B1 (ko) 2022-12-13
JP7769429B2 (ja) 2025-11-13
EP4379092A1 (fr) 2024-06-05

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Ipc: C23C 18/44 20060101AFI20250915BHEP

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