ES2022946T5 - Procedimiento para la aportacion de capas sobre sustratos. - Google Patents
Procedimiento para la aportacion de capas sobre sustratos.Info
- Publication number
- ES2022946T5 ES2022946T5 ES88106546T ES88106546T ES2022946T5 ES 2022946 T5 ES2022946 T5 ES 2022946T5 ES 88106546 T ES88106546 T ES 88106546T ES 88106546 T ES88106546 T ES 88106546T ES 2022946 T5 ES2022946 T5 ES 2022946T5
- Authority
- ES
- Spain
- Prior art keywords
- coating
- electric arc
- arc discharge
- substrates
- vaporization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 abstract 3
- 238000010891 electric arc Methods 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000008016 vaporization Effects 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 238000009834 vaporization Methods 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PARA CONSEGUIR CAPAS MAS DENSAS Y COMPACTAS QUE HASTA AHORA EN EL REVESTIMIENTO EN CAPAS DE SUSTRATOS MEDIANTE PULVERIZACION CATODICA APOYADA EN CAMPOS MAGNETICOS, SE CONDENSA DURANTE LA FORMACION DE LA CAPA UNA CIERTA PARTE DE VAPOR METALICO (OBTENIDO POR EVAPORACION DEL ANODO O CATODO DE UNA DESCARGA DE ARCO VOLTAICO) SOBRE LAS SUPERFICIES DE FUNCION DE LOS SUSTRATOS JUNTO CON EL MATERIAL PULVERIZADO, CONCRETAMENTE UN MINIMO DE 5% DE ATOMOS DEL TOTAL DE COMPONENTE METALICO DE LA CAPA. UNA INSTALACION DE RECUBRIMIENTO EN CAPAS AL VACIO APROPIADA PARA LA EJECUCION DE ESTE PROCESO PRESENTA DENTRO DE UNA CAMARA DE VACIO UN DISPOSITIVO PARA LA EVAPORACION DE UNA PARTE DEL MATERIAL QUE FORMARA LA CAPA POR MEDIO DE UNA DESCARGA DE ARCO VOLTAICO, ASI COMO OTRO DISPOSITIVO PARA LA PULVERIZACION APOYADA POR CAMPO MAGNETICO DE OTRA PARTE DEL MATERIAL QUE FORMARA LA CAPA.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH327587 | 1987-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2022946B3 ES2022946B3 (es) | 1991-12-16 |
| ES2022946T5 true ES2022946T5 (es) | 1996-04-16 |
Family
ID=4252468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES88106546T Expired - Lifetime ES2022946T5 (es) | 1987-08-26 | 1988-04-23 | Procedimiento para la aportacion de capas sobre sustratos. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4877505A (es) |
| EP (1) | EP0306612B2 (es) |
| JP (1) | JPS6483656A (es) |
| AT (1) | ATE65265T1 (es) |
| DE (1) | DE3863725D1 (es) |
| ES (1) | ES2022946T5 (es) |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5234561A (en) * | 1988-08-25 | 1993-08-10 | Hauzer Industries Bv | Physical vapor deposition dual coating process |
| EP0403552B1 (en) * | 1988-08-25 | 1994-12-14 | Hauzer Industries Bv | Physical vapor deposition dual coating apparatus and process |
| EP0361265A1 (de) * | 1988-09-29 | 1990-04-04 | Siemens Aktiengesellschaft | Herstellung von dünnen Schichten eines Hochtemperatur-Supraleiters (HTSL) durch ein plasmaaktiviertes PVD-Verfahren |
| US4992153A (en) * | 1989-04-26 | 1991-02-12 | Balzers Aktiengesellschaft | Sputter-CVD process for at least partially coating a workpiece |
| EP0404973A1 (de) * | 1989-06-27 | 1991-01-02 | Hauzer Holding B.V. | Verfahren und Vorrichtung zur Beschichtung von Substraten |
| US5306407A (en) * | 1989-06-27 | 1994-04-26 | Hauzer Holding Bv | Method and apparatus for coating substrates |
| EP0413853B1 (de) * | 1989-08-21 | 1996-01-31 | Balzers Aktiengesellschaft | Beschichtetes Werkstück mit einer Mischkristallbeschichtung, Verfahren zu dessen Herstellung, sowie Vorrichtung zur Durchführung des Verfahrens |
| US5250779A (en) * | 1990-11-05 | 1993-10-05 | Balzers Aktiengesellschaft | Method and apparatus for heating-up a substrate by means of a low voltage arc discharge and variable magnetic field |
| DE59106090D1 (de) * | 1991-01-21 | 1995-08-31 | Balzers Hochvakuum | Beschichtetes hochverschleissfestes Werkzeug und physikalisches Beschichtungsverfahren zur Beschichtung von hochverschleissfesten Werkzeugen. |
| JPH04326725A (ja) * | 1991-04-26 | 1992-11-16 | Tokyo Electron Ltd | プラズマ装置 |
| JPH0673538A (ja) * | 1992-05-26 | 1994-03-15 | Kobe Steel Ltd | アークイオンプレーティング装置 |
| CH687111A5 (de) * | 1992-05-26 | 1996-09-13 | Balzers Hochvakuum | Verfahren zum Erzeugen einer Niederspannungsentladung, Vakuumbehandlungsanlage hierfuer sowie Anwendung des Verfahrens. |
| JPH07508617A (ja) | 1992-06-26 | 1995-09-21 | マティリアルズ リサーチ コーポレイション | ウエハ処理工程ラインのための輸送装置 |
| CH686253A5 (de) * | 1992-08-28 | 1996-02-15 | Balzers Hochvakuum | Verfahren zur Regelung des Reaktionsgrades sowie Beschichtungsanlage. |
| DE4396720C1 (de) * | 1992-12-23 | 2003-07-17 | Unaxis Balzers Ag | Verfahren und Anlage zur Schichtabscheidung und Verwendung der Anlage |
| US5690796A (en) * | 1992-12-23 | 1997-11-25 | Balzers Aktiengesellschaft | Method and apparatus for layer depositions |
| DE59403689D1 (de) * | 1993-03-16 | 1997-09-18 | Balzers Hochvakuum | Verfahren zur Standzeiterhöhung von Werkzeugen und Verschleissschutz-beschichtetes Werkzeug |
| DE19505258C2 (de) * | 1995-02-16 | 1998-08-06 | Samsung Electronics Co Ltd | Beschichtungsvorrichtung |
| CH690857A5 (de) * | 1995-07-04 | 2001-02-15 | Erich Bergmann | Anlage zur plasmaunterstützten physikalischen Hochvakuumbedampfung von Werkstücken mit verschleissfesten Schichten und Verfahren zur Durchführung in dieser Anlage |
| CH689558A5 (de) | 1995-07-11 | 1999-06-15 | Erich Bergmann | Bedampfungsanlage und Verdampfereinheit. |
| US6040613A (en) | 1996-01-19 | 2000-03-21 | Micron Technology, Inc. | Antireflective coating and wiring line stack |
| WO1997028290A1 (en) * | 1996-01-31 | 1997-08-07 | Optical Coating Laboratory, Inc. | Multi-chamber continuous sputter coating system |
| US5961798A (en) * | 1996-02-13 | 1999-10-05 | Diamond Black Technologies, Inc. | System and method for vacuum coating of articles having precise and reproducible positioning of articles |
| FR2744805B1 (fr) * | 1996-02-13 | 1998-03-20 | Pechiney Aluminium | Cibles de pulverisation cathodique selectionnees par controle ultrasons pour leur faible taux d'emissions de particules |
| DE29615190U1 (de) * | 1996-03-11 | 1996-11-28 | Balzers Verschleissschutz GmbH, 55411 Bingen | Anlage zur Beschichtung von Werkstücken |
| US5760474A (en) * | 1996-07-09 | 1998-06-02 | Micron Technology, Inc. | Capacitor, integrated circuitry, diffusion barriers, and method for forming an electrically conductive diffusion barrier |
| US5865699A (en) * | 1996-10-03 | 1999-02-02 | Sandvik Ab | Coated chain saw nose sprocket |
| US6027619A (en) * | 1996-12-19 | 2000-02-22 | Micron Technology, Inc. | Fabrication of field emission array with filtered vacuum cathodic arc deposition |
| DE19725930C2 (de) * | 1997-06-16 | 2002-07-18 | Eberhard Moll Gmbh Dr | Verfahren und Anlage zum Behandeln von Substraten mittels Ionen aus einer Niedervoltbogenentladung |
| CN1187469C (zh) * | 1997-09-12 | 2005-02-02 | 巴尔策斯有限公司 | 带有保护层系的刀具及其制造方法 |
| US6090457A (en) * | 1997-10-21 | 2000-07-18 | Sanyo Vaccum Industries Co. Ltd. | Process of making a thin film |
| JPH11241158A (ja) * | 1998-02-27 | 1999-09-07 | Applied Materials Inc | 電子線を用いた真空蒸着装置 |
| TW406851U (en) * | 1998-04-01 | 2000-09-21 | Li Jin Ju | Radial reciprocal disk cleaning device |
| US6365016B1 (en) * | 1999-03-17 | 2002-04-02 | General Electric Company | Method and apparatus for arc plasma deposition with evaporation of reagents |
| US6485616B1 (en) * | 1999-12-29 | 2002-11-26 | Deposition Sciences, Inc. | System and method for coating substrates with improved capacity and uniformity |
| DE10005612A1 (de) * | 2000-02-09 | 2001-08-16 | Hauzer Techno Coating Europ B | Verfahren zur Herstellung eines Gegenstandes und Gegenstand |
| CA2305938C (en) * | 2000-04-10 | 2007-07-03 | Vladimir I. Gorokhovsky | Filtered cathodic arc deposition method and apparatus |
| US7300559B2 (en) * | 2000-04-10 | 2007-11-27 | G & H Technologies Llc | Filtered cathodic arc deposition method and apparatus |
| DE10018143C5 (de) † | 2000-04-12 | 2012-09-06 | Oerlikon Trading Ag, Trübbach | DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems |
| DE50115410D1 (de) * | 2000-09-05 | 2010-05-12 | Oerlikon Trading Ag | Vakuumanlage mit koppelbarem Werkstückträger |
| US20020110700A1 (en) * | 2001-02-12 | 2002-08-15 | Hein Gerald F. | Process for forming decorative films and resulting products |
| GB0127251D0 (en) * | 2001-11-13 | 2002-01-02 | Nordiko Ltd | Apparatus |
| DE10159907B4 (de) * | 2001-12-06 | 2008-04-24 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co. | Beschichtungsverfahren |
| CN100560787C (zh) * | 2002-02-27 | 2009-11-18 | 亨利J·拉莫斯 | 在磁化的片等离子体源中在金属衬底上形成氮化钛薄膜 |
| JP2005025275A (ja) * | 2003-06-30 | 2005-01-27 | Ntt Power & Building Facilities Inc | 土地建物資産評価システム |
| KR100770938B1 (ko) * | 2003-06-30 | 2007-10-26 | 가부시키가이샤 후지코시 | 다원계 피막의 제조 장치와 방법 및 다원계 피막의 피복공구 |
| EP1524329A1 (de) * | 2003-10-17 | 2005-04-20 | Platit AG | Modulare Vorrichtung zur Beschichtung von Oberflächen |
| US7364772B2 (en) * | 2004-03-22 | 2008-04-29 | Eastman Kodak Company | Method for coating an organic layer onto a substrate in a vacuum chamber |
| EP1774562B1 (en) * | 2004-06-08 | 2012-02-22 | Dichroic cell s.r.l. | System for low-energy plasma-enhanced chemical vapor deposition |
| EP1614655B2 (en) | 2004-06-18 | 2018-08-08 | Hitachi Tool Engineering Ltd. | Hard coating and its production method |
| SE0402865L (sv) * | 2004-11-04 | 2006-05-05 | Sandvik Intellectual Property | Belagd produkt och framställningsmetod för denna |
| US9997338B2 (en) * | 2005-03-24 | 2018-06-12 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for operating a pulsed arc source |
| US20070148457A1 (en) * | 2005-09-14 | 2007-06-28 | Naturalnano, Inc. | Radiation absorptive composites and methods for production |
| US20070138003A1 (en) * | 2005-12-21 | 2007-06-21 | Annaqin Llc | Lamination and conversion process and apparatus |
| US20080305267A1 (en) * | 2007-06-05 | 2008-12-11 | Gray H Robert | Method and apparatus for low cost high rate deposition tooling |
| CN101368260A (zh) * | 2007-09-14 | 2009-02-18 | 山特维克知识产权股份有限公司 | 用于在基底上沉积涂层的方法和设备 |
| WO2009079358A1 (en) * | 2007-12-14 | 2009-06-25 | The Regents Of The University Of California | Very low pressure high power impulse triggered magnetron sputtering |
| DE102008019202A1 (de) * | 2008-04-17 | 2009-10-22 | Kennametal Inc. | Beschichtungsverfahren , Werkstück oder Werkzeug und dessen Verwendung |
| US8021768B2 (en) * | 2009-04-07 | 2011-09-20 | National Material, L.P. | Plain copper foodware and metal articles with durable and tarnish free multiplayer ceramic coating and method of making |
| CN101994090B (zh) * | 2009-08-14 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | 溅镀载具及包括该溅镀载具的溅镀装置 |
| CN102031493B (zh) * | 2009-09-30 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 镀膜装置 |
| CN102127740B (zh) * | 2010-01-19 | 2013-12-11 | 鸿富锦精密工业(深圳)有限公司 | 溅镀装置 |
| TW201134972A (en) * | 2010-04-14 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Coating device |
| DE102010028558A1 (de) * | 2010-05-04 | 2011-11-10 | Walter Ag | PVD-Hybridverfahren zum Abscheiden von Mischkristallschichten |
| TWI468538B (zh) * | 2011-10-14 | 2015-01-11 | 晟銘電子科技股份有限公司 | 屏蔽層製造方法 |
| US8968529B2 (en) * | 2012-03-29 | 2015-03-03 | Ever Brite Technology Products Inc. | Production method for forming an antibacterial film on the surface of an object |
| US10056237B2 (en) | 2012-09-14 | 2018-08-21 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
| US9793098B2 (en) | 2012-09-14 | 2017-10-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
| US9412569B2 (en) | 2012-09-14 | 2016-08-09 | Vapor Technologies, Inc. | Remote arc discharge plasma assisted processes |
| BR102014006170A2 (pt) * | 2013-03-15 | 2017-11-28 | Vapor Technologies Inc. | Vapor deposition of low pressure arc plasma immersion coating and treatment of ions. |
| DE102013110100A1 (de) * | 2013-06-05 | 2014-12-11 | Von Ardenne Gmbh | Beschichtungsanordnung und Beschichtungsverfahren |
| CA2867451C (en) * | 2013-10-28 | 2021-06-29 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
| EP3117907B1 (de) * | 2015-07-13 | 2017-10-25 | HEC High End Coating GmbH | Verfahren zur herstellung beschichteter substrate |
| CN105154819A (zh) * | 2015-09-11 | 2015-12-16 | 兰州空间技术物理研究所 | 超轻反射镜表面制备反射膜的方法 |
| CN105132863A (zh) * | 2015-09-11 | 2015-12-09 | 兰州空间技术物理研究所 | 一种缓解复合材料表面金属涂层微裂纹扩展的方法 |
| EP3225717A1 (de) | 2016-03-30 | 2017-10-04 | HEC High End Coating GmbH | Verfahren zur herstellung beschichteter substrate, beschichtete substrate und deren verwendung |
| EP3938556A1 (en) * | 2019-03-15 | 2022-01-19 | Nanofilm Technologies International Limited | Improved coating processes |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2198000B1 (es) * | 1972-08-31 | 1975-01-03 | Cit Alcatel | |
| JPS49111880A (es) * | 1973-02-26 | 1974-10-24 | ||
| US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
| JPS5214690A (en) * | 1975-07-25 | 1977-02-03 | Dai Ichi Kogyo Seiyaku Co Ltd | Method to dissolve the polyurethane resin |
| CH631743A5 (de) * | 1977-06-01 | 1982-08-31 | Balzers Hochvakuum | Verfahren zum aufdampfen von material in einer vakuumaufdampfanlage. |
| CH640886A5 (de) * | 1979-08-02 | 1984-01-31 | Balzers Hochvakuum | Verfahren zum aufbringen harter verschleissfester ueberzuege auf unterlagen. |
| US4294678A (en) * | 1979-11-28 | 1981-10-13 | Coulter Systems Corporation | Apparatus and method for preventing contamination of sputtering targets |
| JPS58153776A (ja) * | 1982-03-05 | 1983-09-12 | Citizen Watch Co Ltd | 装飾部品の製造方法およびそれに用いるイオンプレ−テイング装置 |
| JPS5940226A (ja) * | 1982-08-31 | 1984-03-05 | Matsushita Electric Ind Co Ltd | 圧力センサ |
| AT376460B (de) * | 1982-09-17 | 1984-11-26 | Kljuchko Gennady V | Plasmalichtbogeneinrichtung zum auftragen von ueberzuegen |
| US4655893A (en) * | 1983-02-07 | 1987-04-07 | Battelle Development Corporation | Cubic boron nitride preparation utilizing a boron and nitrogen bearing gas |
| CH662188A5 (de) * | 1983-03-16 | 1987-09-15 | Satis Vacuum Ag | Verfahren und einrichtung zur beschichtung optischer substrate mit reversiblen photochromischen eigenschaften. |
| US4448799A (en) * | 1983-04-21 | 1984-05-15 | Multi-Arc Vacuum Systems Inc. | Arc-initiating trigger apparatus and method for electric arc vapor deposition coating systems |
| JPS6011103A (ja) * | 1983-06-30 | 1985-01-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 遠隔計測装置 |
| CH664163A5 (de) * | 1985-03-01 | 1988-02-15 | Balzers Hochvakuum | Verfahren zum reaktiven aufdampfen von schichten aus oxiden, nitriden, oxynitriden und karbiden. |
| DE3641718A1 (de) * | 1986-12-06 | 1988-06-16 | Leybold Ag | Verfahren zum herstellen von wickeln aus im vakuum leitfaehig beschichteten isolierstoff-folien |
-
1988
- 1988-04-23 AT AT88106546T patent/ATE65265T1/de not_active IP Right Cessation
- 1988-04-23 EP EP88106546A patent/EP0306612B2/de not_active Expired - Lifetime
- 1988-04-23 ES ES88106546T patent/ES2022946T5/es not_active Expired - Lifetime
- 1988-04-23 DE DE8888106546T patent/DE3863725D1/de not_active Expired - Lifetime
- 1988-06-22 US US07/209,866 patent/US4877505A/en not_active Expired - Lifetime
- 1988-08-18 JP JP63203972A patent/JPS6483656A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ATE65265T1 (de) | 1991-08-15 |
| EP0306612A1 (de) | 1989-03-15 |
| DE3863725D1 (de) | 1991-08-22 |
| JPS6483656A (en) | 1989-03-29 |
| ES2022946B3 (es) | 1991-12-16 |
| EP0306612B2 (de) | 1996-02-28 |
| US4877505A (en) | 1989-10-31 |
| EP0306612B1 (de) | 1991-07-17 |
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