ES2033894T3 - Cajetin que asegura la estabilizacion termica de los equipos tales como componentes electronicos que el mismo contiene. - Google Patents
Cajetin que asegura la estabilizacion termica de los equipos tales como componentes electronicos que el mismo contiene.Info
- Publication number
- ES2033894T3 ES2033894T3 ES198787400903T ES87400903T ES2033894T3 ES 2033894 T3 ES2033894 T3 ES 2033894T3 ES 198787400903 T ES198787400903 T ES 198787400903T ES 87400903 T ES87400903 T ES 87400903T ES 2033894 T3 ES2033894 T3 ES 2033894T3
- Authority
- ES
- Spain
- Prior art keywords
- electronic components
- ensures
- box
- equipment
- thermal stabilization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000006641 stabilisation Effects 0.000 title abstract 2
- 238000011105 stabilization Methods 0.000 title abstract 2
- 239000007943 implant Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
UNAS FUENTES DE CALOR, COMO COMPONENTES ELECTRONICOS (18A,18B) SE HALLAN REPARTIDOS SEGUN UNA CARTOGRAFIA DADA EN EL INTERIOR DE UN CAJETIN (10) CONSTITUIDO EN ESENCIA POR UNA ESTRUCTURA RIGIDA (22) DE MATERIAL TERMICAMENTE AISLANTE. PARA ASEGURAR LA ESTABILIZACION TERMICA DE DICHAS FUENTES, ESTAS SON PUESTAS EN CONTACTO BIEN CON UNOS IMPLANTES (24) MONTADOS EN LA SUPERFICIE INTERIOR DEL CAJETIN, O BIEN, A ALGUNAS DE ELLAS, CON UNAS INSERCIONES (26) LAS CUALES EN CONTACTO TERMICO CON RADIADORES EXTERNOS (28). LOS IMPLANTES (24), LAS INSERCIONES (26) Y LOS RADIADORES ESTAN REALIZADOS EN MATERIALES TERMICAMENTE CONDUCTORES.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8605713A FR2597695B1 (fr) | 1986-04-21 | 1986-04-21 | Boitier assurant la stabilisation thermique des equipements tels que des composants electroniques qu'il contient. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2033894T3 true ES2033894T3 (es) | 1993-04-01 |
Family
ID=9334437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES198787400903T Expired - Lifetime ES2033894T3 (es) | 1986-04-21 | 1987-04-17 | Cajetin que asegura la estabilizacion termica de los equipos tales como componentes electronicos que el mismo contiene. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4766518A (es) |
| EP (1) | EP0244302B1 (es) |
| JP (1) | JPS62254499A (es) |
| CA (1) | CA1297572C (es) |
| DE (1) | DE3780352T2 (es) |
| ES (1) | ES2033894T3 (es) |
| FR (1) | FR2597695B1 (es) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2051001A (en) * | 1999-12-01 | 2001-06-12 | Chip Coolers, Inc | Structural frame of thermally conductive material |
| DE10233836A1 (de) * | 2002-07-25 | 2004-02-05 | Robert Bosch Gmbh | Elektronikgehäuse |
| US8492762B2 (en) * | 2006-06-27 | 2013-07-23 | General Electric Company | Electrical interface for a sensor array |
| DE102009005067A1 (de) * | 2009-01-19 | 2010-07-22 | Trw Automotive Gmbh | Hybrid-Platte |
| FR3026981B1 (fr) * | 2014-10-14 | 2017-10-13 | Airbus Group Sas | Insert structure permettant d'ameliorer l'isotropie thermique et electrique a coeur et aux interfaces de pieces composites |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2863994A (en) * | 1953-03-03 | 1958-12-09 | Wilbur M Kohring | Sealed electronic unit as for projectile detonation means, etc. |
| US2961478A (en) * | 1957-10-10 | 1960-11-22 | Mcmillan Ind Corp | Insulating and shielding enclosure |
| US3013186A (en) * | 1959-01-26 | 1961-12-12 | Collins Radio Co | Resilient lightweight electronic chassis and heat exchanger |
| US3187226A (en) * | 1961-08-07 | 1965-06-01 | Curtiss Wright Corp | Miniaturized electrical apparatus with combined heat dissipating and insulating structure |
| DE1187284B (de) * | 1962-03-10 | 1965-02-18 | Telefunken Patent | Anordnung zur Regelung der Temperatur im Innern eines Funkgeraetes |
| US3280907A (en) * | 1964-09-01 | 1966-10-25 | Hoffman Sidney | Energy transfer device |
| US3388739A (en) * | 1965-09-07 | 1968-06-18 | Donald M. Olson | Heat dissipator |
| US4060847A (en) * | 1976-03-11 | 1977-11-29 | Power Management Corporation | Cooling arrangement for electrical power contactor |
| US4190879A (en) * | 1978-08-21 | 1980-02-26 | Tissot Pierre L | Plastic chassis with magnetic holding means for electronic components |
| US4330812A (en) * | 1980-08-04 | 1982-05-18 | The United States Of America As Represented By The Secretary Of The Navy | Circuit board electronic component cooling structure with composite spacer |
| DE8130300U1 (de) * | 1981-10-16 | 1982-01-14 | Hewlett-Packard GmbH, 7030 Böblingen | Kühlvorrichtung für ein elektronisches Bauelement |
| US4599680A (en) * | 1983-09-26 | 1986-07-08 | Southwest Research Institute | Packaging arrangement for spacecraft computer |
| US4646203A (en) * | 1985-02-06 | 1987-02-24 | Lutron Electronics Co., Inc. | Mounting structure for semiconductor devices |
| DE3723801A1 (de) * | 1987-07-18 | 1989-01-26 | Bayer Ag | Verfahren zur herstellung von aminoaryl-sulfonsaeuren |
-
1986
- 1986-04-21 FR FR8605713A patent/FR2597695B1/fr not_active Expired - Fee Related
-
1987
- 1987-04-14 CA CA000534638A patent/CA1297572C/en not_active Expired - Fee Related
- 1987-04-16 JP JP62094287A patent/JPS62254499A/ja active Pending
- 1987-04-17 DE DE8787400903T patent/DE3780352T2/de not_active Expired - Fee Related
- 1987-04-17 ES ES198787400903T patent/ES2033894T3/es not_active Expired - Lifetime
- 1987-04-17 EP EP87400903A patent/EP0244302B1/fr not_active Expired - Lifetime
- 1987-04-20 US US07/040,311 patent/US4766518A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0244302B1 (fr) | 1992-07-15 |
| DE3780352T2 (de) | 1993-01-14 |
| CA1297572C (en) | 1992-03-17 |
| DE3780352D1 (de) | 1992-08-20 |
| US4766518A (en) | 1988-08-23 |
| FR2597695B1 (fr) | 1991-07-05 |
| JPS62254499A (ja) | 1987-11-06 |
| FR2597695A1 (fr) | 1987-10-23 |
| EP0244302A1 (fr) | 1987-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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