ES2069622T3 - Material de soldadura de bajo punto de fusion dopado con cobre para ensamblaje y retoque de componentes. - Google Patents

Material de soldadura de bajo punto de fusion dopado con cobre para ensamblaje y retoque de componentes.

Info

Publication number
ES2069622T3
ES2069622T3 ES90108688T ES90108688T ES2069622T3 ES 2069622 T3 ES2069622 T3 ES 2069622T3 ES 90108688 T ES90108688 T ES 90108688T ES 90108688 T ES90108688 T ES 90108688T ES 2069622 T3 ES2069622 T3 ES 2069622T3
Authority
ES
Spain
Prior art keywords
copper
touch
assembly
components
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90108688T
Other languages
English (en)
Inventor
Daniel Scott Niedrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of ES2069622T3 publication Critical patent/ES2069622T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

SE DIFUNDEN SOLDADURAS CON CONTENIDO DE COBRE DE TEMPERATURA DE FUSION BAJA PARA SOLDADURA Y REGENERACION SOBRE SUPERFICIES DE COBRE. LA CANTIDAD DE COBRE NECESARIA EN LA SOLDADURA CON OBJETO DE IMPEDIR LA DISOLUCION DE LA SUPERFICIE DEL COBRE SE HA DESCUBIERTO QUE ES DE NIVEL SUAVIZADO, POR DEBAJO DEL PUNTO DEUTECTICO DEL ESTAÑO-COBRE BINARIO.
ES90108688T 1989-05-31 1990-05-09 Material de soldadura de bajo punto de fusion dopado con cobre para ensamblaje y retoque de componentes. Expired - Lifetime ES2069622T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/359,315 US5011658A (en) 1989-05-31 1989-05-31 Copper doped low melt solder for component assembly and rework

Publications (1)

Publication Number Publication Date
ES2069622T3 true ES2069622T3 (es) 1995-05-16

Family

ID=23413297

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90108688T Expired - Lifetime ES2069622T3 (es) 1989-05-31 1990-05-09 Material de soldadura de bajo punto de fusion dopado con cobre para ensamblaje y retoque de componentes.

Country Status (12)

Country Link
US (1) US5011658A (es)
EP (1) EP0400363B1 (es)
JP (1) JP2825001B2 (es)
KR (1) KR930001686B1 (es)
CN (1) CN1022813C (es)
AU (1) AU617615B2 (es)
BR (1) BR9002559A (es)
CA (1) CA2000301C (es)
DE (1) DE69017516T2 (es)
ES (1) ES2069622T3 (es)
HK (1) HK203696A (es)
PH (1) PH27381A (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891432B2 (ja) * 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
US5316788A (en) * 1991-07-26 1994-05-31 International Business Machines Corporation Applying solder to high density substrates
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
CA2214130C (en) * 1996-09-19 2003-12-02 Northern Telecom Limited Assemblies of substrates and electronic components
US6280584B1 (en) 1998-07-29 2001-08-28 Applied Materials, Inc. Compliant bond structure for joining ceramic to metal
US6221514B1 (en) * 1999-08-30 2001-04-24 Delphi Technologies, Inc. High-current circuit trace and composition and method therefor
US6216938B1 (en) * 1999-09-30 2001-04-17 International Business Machines Corporation Machine and process for reworking circuit boards
US6490144B1 (en) 1999-11-29 2002-12-03 Applied Materials, Inc. Support for supporting a substrate in a process chamber
US6892925B2 (en) * 2002-09-18 2005-05-17 International Business Machines Corporation Solder hierarchy for lead free solder joint
US6854636B2 (en) * 2002-12-06 2005-02-15 International Business Machines Corporation Structure and method for lead free solder electronic package interconnections
US7309647B1 (en) * 2003-03-05 2007-12-18 Altera Corporation Method of mounting an electroless nickel immersion gold flip chip package
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US6917113B2 (en) * 2003-04-24 2005-07-12 International Business Machines Corporatiion Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
US7005745B2 (en) 2004-01-22 2006-02-28 Texas Instruments Incorporated Method and structure to reduce risk of gold embrittlement in solder joints
US20060113683A1 (en) * 2004-09-07 2006-06-01 Nancy Dean Doped alloys for electrical interconnects, methods of production and uses thereof
US20060226199A1 (en) * 2005-03-30 2006-10-12 Visteon Global Technologies, Inc. Selective soldering of flat flexible cable with lead-free solder to a substrate
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
CN103697317A (zh) * 2013-12-17 2014-04-02 中山名创力电子有限公司 一种由焊接不良材料制成的电子焊接件
CN107845698A (zh) * 2016-09-19 2018-03-27 无锡市斯威克科技有限公司 高效预涂锡反光焊带
CN108161272A (zh) * 2018-01-30 2018-06-15 无锡市斯威克科技有限公司 一种专用于超薄光伏电池片焊接的低熔点焊带及制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2471899A (en) * 1940-07-08 1949-05-31 Spolek Method of separating constituents of alloys by fractional crystallization
US2243278A (en) * 1940-11-09 1941-05-27 Johnson John Alloy for soldering aluminum
US2303193A (en) * 1941-10-04 1942-11-24 Bell Telephone Labor Inc Alloy
GB601029A (en) * 1945-06-20 1948-04-26 William Martin An improved aluminium solder
US2501859A (en) * 1947-10-22 1950-03-28 Western Electric Co Spacer or mold surface for the vulcanization of rubber
US2671844A (en) * 1951-07-26 1954-03-09 Guenther W Laubmeyer Tin solder
DE1204500B (de) * 1960-08-02 1965-11-04 Dr G Laubmeyer Verwendung von Zinn-Blei-Legierungen als Weichlot zum automatischen Tauchloeten
JPS4218219B1 (es) * 1965-05-12 1967-09-20
US3650735A (en) * 1969-04-04 1972-03-21 Luigi Monaco Tin base alloy containing aluminum, zinc and copper
US3607252A (en) * 1969-06-02 1971-09-21 Sperry Rand Corp Solder alloy composition
GB1294801A (en) * 1970-09-17 1972-11-01 Ibm Tin, lead and indium alloys
US4106930A (en) * 1972-02-19 1978-08-15 Asahi Glass Company, Ltd. Solder alloys for soldering difficultly solderable material
FR2282319A1 (fr) * 1974-08-19 1976-03-19 Multicore Solders Ltd Composition de soudage a flux et procede de soudure
JPS5154056A (ja) * 1974-11-08 1976-05-12 Hitachi Ltd Handagokin
GB1461371A (en) * 1975-02-19 1977-01-13 Glacier Metal Co Ltd Bearing alloys
US4357162A (en) * 1979-10-04 1982-11-02 Motorola, Inc. Solder composition
US4396677A (en) * 1980-10-24 1983-08-02 Josef Intrater Metal, carbon, carbide and other composites thereof
JPS58151037A (ja) * 1982-03-02 1983-09-08 Mitsubishi Metal Corp 半導体装置用ｐｂ合金ろう材
JPS60166191A (ja) * 1984-02-06 1985-08-29 Nippon Handa Kogyo Kk 耐疲労特性にすぐれたはんだ合金
GB2158459A (en) * 1984-05-05 1985-11-13 Imi Yorkshire Imperial Limited Solder
US4588657A (en) * 1984-11-01 1986-05-13 Rca Corporation Solder composition
US4622205A (en) * 1985-04-12 1986-11-11 Ibm Corporation Electromigration lifetime increase of lead base alloys
JPS6272496A (ja) * 1985-09-26 1987-04-03 Matsuo Handa Kk はんだ合金
US4654275A (en) * 1985-11-27 1987-03-31 Allied Corporation Storage life of Pb-In-Ag solder foil by Sn addition
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
JP2529257B2 (ja) * 1987-04-22 1996-08-28 住友電気工業株式会社 ヒユ−ズ用導体
JPS63270437A (ja) * 1987-04-24 1988-11-08 Sumitomo Electric Ind Ltd ヒユ−ズ用導体

Also Published As

Publication number Publication date
JPH0318497A (ja) 1991-01-28
HK203696A (en) 1996-11-15
PH27381A (en) 1993-06-21
DE69017516D1 (de) 1995-04-13
AU617615B2 (en) 1991-11-28
AU5505290A (en) 1990-12-06
KR930001686B1 (ko) 1993-03-11
JP2825001B2 (ja) 1998-11-18
US5011658A (en) 1991-04-30
CA2000301C (en) 1996-02-06
KR900017721A (ko) 1990-12-19
EP0400363B1 (en) 1995-03-08
EP0400363A1 (en) 1990-12-05
BR9002559A (pt) 1991-08-13
CA2000301A1 (en) 1990-11-30
CN1047639A (zh) 1990-12-12
CN1022813C (zh) 1993-11-24
DE69017516T2 (de) 1995-10-05

Similar Documents

Publication Publication Date Title
ES2069622T3 (es) Material de soldadura de bajo punto de fusion dopado con cobre para ensamblaje y retoque de componentes.
ES2072339T3 (es) Composicion de vidrio plano con propiedades mejoradas de fusion y templado.
MX151460A (es) Mejoras en una boquilla autorregulable para una linea de suministro de liquido
ES519365A0 (es) Procedimiento para inhibir la corrosion de metales a base de hierro en contacto con sistemas acuosos.
DK255283D0 (da) Middel til bekaempelse af skadelige organismer, dets fremstilling og anvendelse samt substituerede aminoketaler til anvendelse i midlet
ES519364A0 (es) Procedimiento para inhibir la formacion de cascarilla sobre superficies metalicas en contacto con sistemas acuosos.
BR8303394A (pt) Composicao para proteger superficies de metal contral corrosao
ES508058A0 (es) Procedimiento termoindicador para el pegado de dos superficies con un adhesivo fusible.
ES519264A0 (es) Un aparato para mezclar un material que contiene fluoruro de aluminio fundido constituido por particulas con aluminio fundido.
MX170928B (es) Composicion limpiadora para superficies duras
IT1181765B (it) Commutatore attivato termicamente di messa in cortocircuito avente cammino di giunzione non alterabile nel funzionamento
ES504756A0 (es) Perfeccionamiento en dispositivos de suministro para hilos en movimientos.
DK522786A (da) Flydende, staerkt skummende detergentsammensaetning
MX9305992A (es) Modificacion con laser de superficies de objectos a traves de ablacion.
MX150121A (es) Procedimiento mejorado para hacer un elemento conductor con hoja movil y una cara de doble contacto
ES290681U (es) Pieza de bote rasgable
NO160399C (no) Holder for aa tilkoble elektriske kontakttunger til kontaktflater paa en elektronisk komponent.
MX153730A (es) Mejoras en aditamento para boquilla de soplete con rocio de flama
ES462912A1 (es) Un procedimiento para la preparacion de nuevos derivados delacido acetil-salicilico.
ES239887Y (es) Tapon perfeccionado para deposito de expansion principalmen-mente para circuito de refrigeracion de vehiculo automovil.
DK124482A (da) Fungicidt middel paa basis af iprodion
ES508780A0 (es) Perfeccionamientos en los faros de cruce para vehiculos au- tomoviles.
DE3485590D1 (de) Hochdruckentladungslampe mit thermischem schalter.
ES267965Y (es) Elemento de contacto portafusible especialmente para circuitos impresos y placas de interconexion.
ES503463A0 (es) Un procedimiento para limpiar una superficie de estano con el fin de eliminar desde ella lubricantes u otros contaminan-tes.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 400363

Country of ref document: ES