ES2074586T3 - Metodo de fabricar hilos cuanticos de silicio. - Google Patents
Metodo de fabricar hilos cuanticos de silicio.Info
- Publication number
- ES2074586T3 ES2074586T3 ES90917418T ES90917418T ES2074586T3 ES 2074586 T3 ES2074586 T3 ES 2074586T3 ES 90917418 T ES90917418 T ES 90917418T ES 90917418 T ES90917418 T ES 90917418T ES 2074586 T3 ES2074586 T3 ES 2074586T3
- Authority
- ES
- Spain
- Prior art keywords
- manufacture
- cables
- coat
- level
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/826—Materials of the light-emitting regions comprising only Group IV materials
- H10H20/8264—Materials of the light-emitting regions comprising only Group IV materials comprising polycrystalline, amorphous or porous Group IV materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/96—Porous semiconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Weting (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Dc Machiner (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Light Receiving Elements (AREA)
- Bipolar Transistors (AREA)
- Electroluminescent Light Sources (AREA)
- Luminescent Compositions (AREA)
Abstract
UN METODO PARA LA FABRICACION DE CABLES CUANTICOS SEMICONDUCTORES EN QUE SU UTILIZA UN PLAQUITA SEMICONDUCTORA (14) COMO EL MATERIAL INICIAL. LA PLAQUITA (14) ES DEL TIPO P DEBILMENTE DOPADA CON UNA CAPA P DELGADA MUY DOPADA DENTRO PARA QUE LA CORRIENTE FLUYA DE MANERA UNIFORME. LA PLAQUITA (14) SE ANODIZA EN ACIDO FLUORHIDRICO ACUSOSO AL 20% PARA PRODUCIR UNA CAPA (5) GRUESA EN MICRAS CON UNA POROSIDAD DEL 70% Y BUENA CRISTALINIDAD. A CONTINUACION SE GRABA LA CAPA CON ACIDO FLUORHIDRICO CONCENTRADO, LO CUAL PROPORCIONA UNA VELOCIDAD DE ATAQUE LENTA. EL ATAQUE HACE QUE AUMENTE LA POROSIDAD A UN NIVEL DEL 80% EN LA REGION O SUPERIOR. A TAL NIVEL, LOS POROS SE SUPERPONEN Y SE ESPERA QUE SE FORMEN CABLES CUANTICOS AISLADOS CON DIAMETROS MENORES O IGUALES A 3 NM. LA CAPA GRABADA PRESENTA UNA EMISION FOTOLUMINISCENTE A ENERGIAS FOTONICAS MUY POR ENCIMA DEL HUECO DE BANDA DE SILICIO (1,1 EV) Y QUE SE EXTIENDE HASTA LA REGION ROJA (1,6 - 2,0 EV) DEL ESPECTRO VISIBLE.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB898927709A GB8927709D0 (en) | 1989-12-07 | 1989-12-07 | Silicon quantum wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2074586T3 true ES2074586T3 (es) | 1995-09-16 |
Family
ID=10667590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES90917418T Expired - Lifetime ES2074586T3 (es) | 1989-12-07 | 1990-12-06 | Metodo de fabricar hilos cuanticos de silicio. |
Country Status (10)
| Country | Link |
|---|---|
| US (4) | US5348618A (es) |
| EP (2) | EP0504170B1 (es) |
| JP (2) | JP2611072B2 (es) |
| AT (1) | ATE125066T1 (es) |
| CA (1) | CA2073030C (es) |
| DE (1) | DE69020906T2 (es) |
| DK (1) | DK0504170T3 (es) |
| ES (1) | ES2074586T3 (es) |
| GB (3) | GB8927709D0 (es) |
| WO (1) | WO1991009420A1 (es) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8927709D0 (en) * | 1989-12-07 | 1990-02-07 | Secretary Of The State For Def | Silicon quantum wires |
| US6171512B1 (en) | 1991-02-15 | 2001-01-09 | Canon Kabushiki Kaisha | Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution |
| SG93197A1 (en) * | 1991-02-15 | 2002-12-17 | Canon Kk | Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution |
| GB9108176D0 (en) * | 1991-04-17 | 1991-06-05 | Secr Defence | Electroluminescent silicon device |
| DE4126955C2 (de) * | 1991-08-14 | 1994-05-05 | Fraunhofer Ges Forschung | Verfahren zum Herstellen von elektrolumineszenten Siliziumstrukturen |
| DE69232347T2 (de) * | 1991-09-27 | 2002-07-11 | Canon K.K., Tokio/Tokyo | Verfahren zur Behandlung eines Substrats aus Silizium |
| DE69233314T2 (de) * | 1991-10-11 | 2005-03-24 | Canon K.K. | Verfahren zur Herstellung von Halbleiter-Produkten |
| US5454915A (en) * | 1992-10-06 | 1995-10-03 | Kulite Semiconductor Products, Inc. | Method of fabricating porous silicon carbide (SiC) |
| US5689603A (en) * | 1993-07-07 | 1997-11-18 | Huth; Gerald C. | Optically interactive nanostructure |
| DE69418143T2 (de) * | 1993-11-02 | 1999-08-26 | Matsushita Electric Industrial Co. | Verfahren zur Herstellung eines Aggregats von Mikro-Nadeln aus Halbleitermaterial |
| US6734451B2 (en) | 1993-11-02 | 2004-05-11 | Matsushita Electric Industrial Co., Ltd. | Aggregate of semiconductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same |
| DE69429668T2 (de) * | 1993-12-06 | 2002-09-12 | Qinetiq Ltd., London | Poröses halbleitermaterial |
| GB2299210B (en) * | 1993-12-06 | 1997-12-24 | Secr Defence | Porous semiconductor material |
| US5510633A (en) * | 1994-06-08 | 1996-04-23 | Xerox Corporation | Porous silicon light emitting diode arrays and method of fabrication |
| US5427648A (en) * | 1994-08-15 | 1995-06-27 | The United States Of America As Represented By The Secretary Of The Army | Method of forming porous silicon |
| WO1996014206A1 (en) * | 1994-11-08 | 1996-05-17 | Spectra Science Corporation | Semiconductor nanocrystal display materials and display apparatus employing same |
| GB2313479B (en) * | 1995-03-20 | 1999-10-20 | Secr Defence | Electroluminescent device comprising porous silicon |
| GB2299204A (en) * | 1995-03-20 | 1996-09-25 | Secr Defence | Electroluminescent device |
| GB9611437D0 (en) | 1995-08-03 | 1996-08-07 | Secr Defence | Biomaterial |
| US5690807A (en) * | 1995-08-03 | 1997-11-25 | Massachusetts Institute Of Technology | Method for producing semiconductor particles |
| WO1997049132A1 (en) * | 1996-06-20 | 1997-12-24 | Jeffrey Frey | Light-emitting semiconductor device |
| US6074546A (en) | 1997-08-21 | 2000-06-13 | Rodel Holdings, Inc. | Method for photoelectrochemical polishing of silicon wafers |
| JP3490903B2 (ja) * | 1997-09-11 | 2004-01-26 | Kddi株式会社 | 半導体発光素子およびその製造方法 |
| JPH11243076A (ja) * | 1998-02-26 | 1999-09-07 | Canon Inc | 陽極化成方法及び陽極化成装置並びに半導体基板の製造方法 |
| GB9808052D0 (en) | 1998-04-17 | 1998-06-17 | Secr Defence | Implants for administering substances and methods of producing implants |
| GB9815819D0 (en) * | 1998-07-22 | 1998-09-16 | Secr Defence | Transferring materials into cells and a microneedle array |
| US6197654B1 (en) * | 1998-08-21 | 2001-03-06 | Texas Instruments Incorporated | Lightly positively doped silicon wafer anodization process |
| US6417069B1 (en) * | 1999-03-25 | 2002-07-09 | Canon Kabushiki Kaisha | Substrate processing method and manufacturing method, and anodizing apparatus |
| US6399177B1 (en) | 1999-06-03 | 2002-06-04 | The Penn State Research Foundation | Deposited thin film void-column network materials |
| GB9929521D0 (en) | 1999-12-15 | 2000-02-09 | Secr Defence | Bonded products and methods of fabrication therefor |
| GB0008494D0 (en) | 2000-04-07 | 2000-05-24 | Secr Defence | Microprojectile delivery system |
| US7005669B1 (en) | 2001-08-02 | 2006-02-28 | Ultradots, Inc. | Quantum dots, nanocomposite materials with quantum dots, devices with quantum dots, and related fabrication methods |
| US20030066998A1 (en) * | 2001-08-02 | 2003-04-10 | Lee Howard Wing Hoon | Quantum dots of Group IV semiconductor materials |
| US6819845B2 (en) | 2001-08-02 | 2004-11-16 | Ultradots, Inc. | Optical devices with engineered nonlinear nanocomposite materials |
| US6710366B1 (en) | 2001-08-02 | 2004-03-23 | Ultradots, Inc. | Nanocomposite materials with engineered properties |
| US6794265B2 (en) * | 2001-08-02 | 2004-09-21 | Ultradots, Inc. | Methods of forming quantum dots of Group IV semiconductor materials |
| GB0120202D0 (en) | 2001-08-18 | 2001-10-10 | Psimedica | Body fluid collection and analysis |
| JP2003124574A (ja) * | 2001-10-09 | 2003-04-25 | Fujitsu Ltd | 光半導体装置及びその製造方法 |
| GB0130608D0 (en) | 2001-12-21 | 2002-02-06 | Psimedica Ltd | Medical fibres and fabrics |
| AU2003206031A1 (en) * | 2002-03-08 | 2003-09-22 | Koninklijke Philips Electronics N.V. | Method of manufacturing nanowires and an electronic device |
| US6955745B1 (en) * | 2002-08-01 | 2005-10-18 | University Of Florida Research Foundation, Inc. | Method of spark-processing silicon and resulting materials |
| US6864190B2 (en) * | 2002-10-17 | 2005-03-08 | National Research Council Of Canada | Laser chemical fabrication of nanostructures |
| US7357877B2 (en) * | 2002-11-18 | 2008-04-15 | Koninklijke Philips Electronics N.V. | Dispersion of nanowires of semiconductor material |
| JP2004335662A (ja) * | 2003-05-06 | 2004-11-25 | Canon Inc | 部材及び部材の製造方法 |
| US9508886B2 (en) | 2007-10-06 | 2016-11-29 | Solexel, Inc. | Method for making a crystalline silicon solar cell substrate utilizing flat top laser beam |
| US8420435B2 (en) * | 2009-05-05 | 2013-04-16 | Solexel, Inc. | Ion implantation fabrication process for thin-film crystalline silicon solar cells |
| US8399331B2 (en) | 2007-10-06 | 2013-03-19 | Solexel | Laser processing for high-efficiency thin crystalline silicon solar cell fabrication |
| WO2008045301A1 (en) * | 2006-10-05 | 2008-04-17 | Hitachi Chemical Co., Ltd. | Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same |
| US7999174B2 (en) * | 2006-10-09 | 2011-08-16 | Solexel, Inc. | Solar module structures and assembly methods for three-dimensional thin-film solar cells |
| US8293558B2 (en) * | 2006-10-09 | 2012-10-23 | Solexel, Inc. | Method for releasing a thin-film substrate |
| US8035027B2 (en) | 2006-10-09 | 2011-10-11 | Solexel, Inc. | Solar module structures and assembly methods for pyramidal three-dimensional thin-film solar cells |
| US20080264477A1 (en) * | 2006-10-09 | 2008-10-30 | Soltaix, Inc. | Methods for manufacturing three-dimensional thin-film solar cells |
| US8512581B2 (en) * | 2006-10-09 | 2013-08-20 | Solexel, Inc. | Methods for liquid transfer coating of three-dimensional substrates |
| US8193076B2 (en) | 2006-10-09 | 2012-06-05 | Solexel, Inc. | Method for releasing a thin semiconductor substrate from a reusable template |
| US20100304521A1 (en) * | 2006-10-09 | 2010-12-02 | Solexel, Inc. | Shadow Mask Methods For Manufacturing Three-Dimensional Thin-Film Solar Cells |
| US8035028B2 (en) * | 2006-10-09 | 2011-10-11 | Solexel, Inc. | Pyramidal three-dimensional thin-film solar cells |
| US20100144080A1 (en) * | 2008-06-02 | 2010-06-10 | Solexel, Inc. | Method and apparatus to transfer coat uneven surface |
| US8294026B2 (en) | 2008-11-13 | 2012-10-23 | Solexel, Inc. | High-efficiency thin-film solar cells |
| US8288195B2 (en) * | 2008-11-13 | 2012-10-16 | Solexel, Inc. | Method for fabricating a three-dimensional thin-film semiconductor substrate from a template |
| MY160251A (en) * | 2008-11-26 | 2017-02-28 | Solexel Inc | Truncated pyramid -structures for see-through solar cells |
| US9076642B2 (en) | 2009-01-15 | 2015-07-07 | Solexel, Inc. | High-Throughput batch porous silicon manufacturing equipment design and processing methods |
| US9890465B2 (en) * | 2009-01-15 | 2018-02-13 | Trutag Technologies, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
| US8906218B2 (en) * | 2010-05-05 | 2014-12-09 | Solexel, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
| US8926803B2 (en) * | 2009-01-15 | 2015-01-06 | Solexel, Inc. | Porous silicon electro-etching system and method |
| MY162405A (en) * | 2009-02-06 | 2017-06-15 | Solexel Inc | Trench Formation Method For Releasing A Thin-Film Substrate From A Reusable Semiconductor Template |
| US8828517B2 (en) | 2009-03-23 | 2014-09-09 | Solexel, Inc. | Structure and method for improving solar cell efficiency and mechanical strength |
| CN102427971B (zh) * | 2009-04-14 | 2015-01-07 | 速力斯公司 | 高效外延化学气相沉积(cvd)反应器 |
| US9099584B2 (en) * | 2009-04-24 | 2015-08-04 | Solexel, Inc. | Integrated three-dimensional and planar metallization structure for thin film solar cells |
| EP2427914A4 (en) | 2009-05-05 | 2013-06-05 | Solexel Inc | HIGH PRODUCTION PLANT FOR THE PRODUCTION OF POROUS SEMICONDUCTORS |
| US9318644B2 (en) | 2009-05-05 | 2016-04-19 | Solexel, Inc. | Ion implantation and annealing for thin film crystalline solar cells |
| US8445314B2 (en) * | 2009-05-22 | 2013-05-21 | Solexel, Inc. | Method of creating reusable template for detachable thin film substrate |
| US8551866B2 (en) * | 2009-05-29 | 2013-10-08 | Solexel, Inc. | Three-dimensional thin-film semiconductor substrate with through-holes and methods of manufacturing |
| MY166305A (en) | 2009-12-09 | 2018-06-25 | Solexel Inc | High-efficiency photovoltaic back-contact solar cell structures and manufacturing methods using thin planar semiconductor absorbers |
| WO2011100647A2 (en) | 2010-02-12 | 2011-08-18 | Solexel, Inc. | Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing |
| US9870937B2 (en) | 2010-06-09 | 2018-01-16 | Ob Realty, Llc | High productivity deposition reactor comprising a gas flow chamber having a tapered gas flow space |
| EP2601687A4 (en) | 2010-08-05 | 2018-03-07 | Solexel, Inc. | Backplane reinforcement and interconnects for solar cells |
| RU2448741C1 (ru) | 2011-03-24 | 2012-04-27 | Закрытое акционерное общество "Институт прикладной нанотехнологии" | Способ формирования наноструктурированного биосовместимого покрытия на имплантатах |
| EP2710639A4 (en) | 2011-05-20 | 2015-11-25 | Solexel Inc | SELF-ACTIVATED FRONT PANEL PRE-VOLTAGE FOR A SOLAR CELL |
| CA2829605C (en) | 2013-10-07 | 2016-06-14 | Springpower International Incorporated | A method for mass production of silicon nanowires and/or nanobelts, and lithium batteries and anodes using the silicon nanowires and/or nanobelts |
| GB202012302D0 (en) | 2020-08-07 | 2020-09-23 | Kings College | Lithiated silicon |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027179B2 (ja) * | 1975-11-05 | 1985-06-27 | 日本電気株式会社 | 多孔質シリコンの形成方法 |
| US4155781A (en) * | 1976-09-03 | 1979-05-22 | Siemens Aktiengesellschaft | Method of manufacturing solar cells, utilizing single-crystal whisker growth |
| US4392011A (en) * | 1980-04-30 | 1983-07-05 | Rca Corporation | Solar cell structure incorporating a novel single crystal silicon material |
| JPS571265A (en) * | 1980-06-02 | 1982-01-06 | Fuji Electric Co Ltd | Solar cell |
| US4954182A (en) * | 1980-11-13 | 1990-09-04 | Energy Conversion Devices, Inc. | Multiple cell photoresponsive amorphous photo voltaic devices including graded band gaps |
| JPS57153478A (en) * | 1981-03-19 | 1982-09-22 | Agency Of Ind Science & Technol | Photoelectric conversion device |
| US4532700A (en) * | 1984-04-27 | 1985-08-06 | International Business Machines Corporation | Method of manufacturing semiconductor structures having an oxidized porous silicon isolation layer |
| DE3420887A1 (de) * | 1984-06-05 | 1985-12-05 | Telefunken electronic GmbH, 7100 Heilbronn | Solarzelle |
| US4581103A (en) * | 1984-09-04 | 1986-04-08 | Texas Instruments Incorporated | Method of etching semiconductor material |
| US4751194A (en) * | 1986-06-27 | 1988-06-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Structures including quantum well wires and boxes |
| US4775425A (en) * | 1987-07-27 | 1988-10-04 | Energy Conversion Devices, Inc. | P and n-type microcrystalline semiconductor alloy material including band gap widening elements, devices utilizing same |
| DE3727823A1 (de) * | 1987-08-20 | 1989-03-02 | Siemens Ag | Tandem-solarmodul |
| US4801380A (en) | 1987-12-23 | 1989-01-31 | The Texas A&M University System | Method of producing a silicon film with micropores |
| US4910165A (en) * | 1988-11-04 | 1990-03-20 | Ncr Corporation | Method for forming epitaxial silicon on insulator structures using oxidized porous silicon |
| US4910115A (en) * | 1988-11-21 | 1990-03-20 | The Mead Corporation | Light-sensitive polymerizable compositions containing silver compounds |
| US5023200A (en) * | 1988-11-22 | 1991-06-11 | The United States Of America As Represented By The United States Department Of Energy | Formation of multiple levels of porous silicon for buried insulators and conductors in silicon device technologies |
| US4987094A (en) * | 1989-06-02 | 1991-01-22 | Bell Communications Research, Inc. | Method of making a macroscopic stepped structure on a vicinally cut crystal |
| US5156896A (en) * | 1989-08-03 | 1992-10-20 | Alps Electric Co., Ltd. | Silicon substrate having porous oxidized silicon layers and its production method |
| GB8927709D0 (en) * | 1989-12-07 | 1990-02-07 | Secretary Of The State For Def | Silicon quantum wires |
| US5272355A (en) * | 1992-05-20 | 1993-12-21 | Spire Corporation | Optoelectronic switching and display device with porous silicon |
| US5256339A (en) * | 1992-10-30 | 1993-10-26 | The United States Of America As Represented By The Secretary Of The Army | Fabrication technique for silicon microclusters using pulsed electrical power |
| US5324965A (en) * | 1993-03-26 | 1994-06-28 | The United States Of America As Represented By The Secretary Of The Army | Light emitting diode with electro-chemically etched porous silicon |
| US5420049A (en) * | 1993-09-09 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Navy | Method of controlling photoemission from porous silicon using ion implantation |
-
1989
- 1989-12-07 GB GB898927709A patent/GB8927709D0/en active Pending
-
1990
- 1990-12-06 CA CA002073030A patent/CA2073030C/en not_active Expired - Fee Related
- 1990-12-06 EP EP90917418A patent/EP0504170B1/en not_active Expired - Lifetime
- 1990-12-06 DE DE69020906T patent/DE69020906T2/de not_active Expired - Fee Related
- 1990-12-06 US US07/852,208 patent/US5348618A/en not_active Expired - Lifetime
- 1990-12-06 DK DK90917418.7T patent/DK0504170T3/da active
- 1990-12-06 WO PCT/GB1990/001901 patent/WO1991009420A1/en not_active Ceased
- 1990-12-06 JP JP3500255A patent/JP2611072B2/ja not_active Expired - Lifetime
- 1990-12-06 EP EP94201681A patent/EP0616378A3/en not_active Withdrawn
- 1990-12-06 ES ES90917418T patent/ES2074586T3/es not_active Expired - Lifetime
- 1990-12-06 AT AT90917418T patent/ATE125066T1/de not_active IP Right Cessation
-
1992
- 1992-05-01 GB GB9209555A patent/GB2254188C/en not_active Expired - Fee Related
- 1992-10-14 US US07/960,694 patent/US6147359A/en not_active Expired - Lifetime
-
1993
- 1993-03-10 GB GB9304855A patent/GB2266994B/en not_active Expired - Fee Related
- 1993-07-26 US US08/096,410 patent/US5358600A/en not_active Expired - Lifetime
-
1994
- 1994-04-26 US US08/233,338 patent/US6369405B1/en not_active Expired - Lifetime
- 1994-05-16 JP JP10119794A patent/JP2963617B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO1991009420A1 (en) | 1991-06-27 |
| US5358600A (en) | 1994-10-25 |
| JPH05502978A (ja) | 1993-05-20 |
| GB9304855D0 (en) | 1993-04-28 |
| EP0504170B1 (en) | 1995-07-12 |
| US6369405B1 (en) | 2002-04-09 |
| EP0504170A1 (en) | 1992-09-23 |
| EP0616378A2 (en) | 1994-09-21 |
| US6147359A (en) | 2000-11-14 |
| DE69020906T2 (de) | 1995-12-14 |
| GB8927709D0 (en) | 1990-02-07 |
| GB2254188B (en) | 1994-07-20 |
| DE69020906D1 (de) | 1995-08-17 |
| US5348618A (en) | 1994-09-20 |
| DK0504170T3 (da) | 1995-09-04 |
| GB2254188C (en) | 1994-12-23 |
| GB2254188A (en) | 1992-09-30 |
| JPH0774392A (ja) | 1995-03-17 |
| ATE125066T1 (de) | 1995-07-15 |
| EP0616378A3 (en) | 1998-05-06 |
| GB2266994B (en) | 1994-08-03 |
| CA2073030C (en) | 1999-02-23 |
| GB9209555D0 (en) | 1992-07-01 |
| CA2073030A1 (en) | 1991-06-08 |
| JP2611072B2 (ja) | 1997-05-21 |
| GB2266994A (en) | 1993-11-17 |
| JP2963617B2 (ja) | 1999-10-18 |
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