ATE125066T1 - Herstellungsverfahren für einen quantumleiter. - Google Patents

Herstellungsverfahren für einen quantumleiter.

Info

Publication number
ATE125066T1
ATE125066T1 AT90917418T AT90917418T ATE125066T1 AT E125066 T1 ATE125066 T1 AT E125066T1 AT 90917418 T AT90917418 T AT 90917418T AT 90917418 T AT90917418 T AT 90917418T AT E125066 T1 ATE125066 T1 AT E125066T1
Authority
AT
Austria
Prior art keywords
layer
wafer
hydrofluoric acid
level
porosity
Prior art date
Application number
AT90917418T
Other languages
English (en)
Inventor
Leigh-Trevor Canham
John Michael Keen
Weng Yee Leong
Original Assignee
Secr Defence Brit
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10667590&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE125066(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Secr Defence Brit filed Critical Secr Defence Brit
Application granted granted Critical
Publication of ATE125066T1 publication Critical patent/ATE125066T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/826—Materials of the light-emitting regions comprising only Group IV materials
    • H10H20/8264—Materials of the light-emitting regions comprising only Group IV materials comprising polycrystalline, amorphous or porous Group IV materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/96—Porous semiconductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/962—Quantum dots and lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Weting (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Dc Machiner (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Bipolar Transistors (AREA)
  • Light Receiving Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Luminescent Compositions (AREA)
AT90917418T 1989-12-07 1990-12-06 Herstellungsverfahren für einen quantumleiter. ATE125066T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898927709A GB8927709D0 (en) 1989-12-07 1989-12-07 Silicon quantum wires

Publications (1)

Publication Number Publication Date
ATE125066T1 true ATE125066T1 (de) 1995-07-15

Family

ID=10667590

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90917418T ATE125066T1 (de) 1989-12-07 1990-12-06 Herstellungsverfahren für einen quantumleiter.

Country Status (10)

Country Link
US (4) US5348618A (de)
EP (2) EP0504170B1 (de)
JP (2) JP2611072B2 (de)
AT (1) ATE125066T1 (de)
CA (1) CA2073030C (de)
DE (1) DE69020906T2 (de)
DK (1) DK0504170T3 (de)
ES (1) ES2074586T3 (de)
GB (3) GB8927709D0 (de)
WO (1) WO1991009420A1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8927709D0 (en) * 1989-12-07 1990-02-07 Secretary Of The State For Def Silicon quantum wires
CA2061264C (en) * 1991-02-15 1999-11-16 Kiyofumi Sakaguchi Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
US6171512B1 (en) 1991-02-15 2001-01-09 Canon Kabushiki Kaisha Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
GB9108176D0 (en) * 1991-04-17 1991-06-05 Secr Defence Electroluminescent silicon device
DE4126955C2 (de) * 1991-08-14 1994-05-05 Fraunhofer Ges Forschung Verfahren zum Herstellen von elektrolumineszenten Siliziumstrukturen
DE69232347T2 (de) * 1991-09-27 2002-07-11 Canon K.K., Tokio/Tokyo Verfahren zur Behandlung eines Substrats aus Silizium
DE69233314T2 (de) * 1991-10-11 2005-03-24 Canon K.K. Verfahren zur Herstellung von Halbleiter-Produkten
US5454915A (en) * 1992-10-06 1995-10-03 Kulite Semiconductor Products, Inc. Method of fabricating porous silicon carbide (SiC)
US5689603A (en) * 1993-07-07 1997-11-18 Huth; Gerald C. Optically interactive nanostructure
US6734451B2 (en) 1993-11-02 2004-05-11 Matsushita Electric Industrial Co., Ltd. Aggregate of semiconductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same
EP0887866B1 (de) * 1993-11-02 2004-04-07 Matsushita Electric Industrial Co., Ltd Halbleiterbauelement mit einem Aggregat von Mikro-Nadeln aus Halbleitermaterial
JP3801624B2 (ja) * 1993-12-06 2006-07-26 キネテイツク・リミテツド 多孔質半導体材料、多孔質半導体材料を含む発光デバイス、及び多孔質半導体材料製造方法
GB2299210B (en) * 1993-12-06 1997-12-24 Secr Defence Porous semiconductor material
US5510633A (en) * 1994-06-08 1996-04-23 Xerox Corporation Porous silicon light emitting diode arrays and method of fabrication
US5427648A (en) * 1994-08-15 1995-06-27 The United States Of America As Represented By The Secretary Of The Army Method of forming porous silicon
WO1996014206A1 (en) * 1994-11-08 1996-05-17 Spectra Science Corporation Semiconductor nanocrystal display materials and display apparatus employing same
GB2299204A (en) * 1995-03-20 1996-09-25 Secr Defence Electroluminescent device
GB2313479B (en) * 1995-03-20 1999-10-20 Secr Defence Electroluminescent device comprising porous silicon
US5690807A (en) * 1995-08-03 1997-11-25 Massachusetts Institute Of Technology Method for producing semiconductor particles
GB9611437D0 (en) 1995-08-03 1996-08-07 Secr Defence Biomaterial
WO1997049132A1 (en) * 1996-06-20 1997-12-24 Jeffrey Frey Light-emitting semiconductor device
US6074546A (en) * 1997-08-21 2000-06-13 Rodel Holdings, Inc. Method for photoelectrochemical polishing of silicon wafers
JP3490903B2 (ja) * 1997-09-11 2004-01-26 Kddi株式会社 半導体発光素子およびその製造方法
JPH11243076A (ja) * 1998-02-26 1999-09-07 Canon Inc 陽極化成方法及び陽極化成装置並びに半導体基板の製造方法
GB9808052D0 (en) 1998-04-17 1998-06-17 Secr Defence Implants for administering substances and methods of producing implants
GB9815819D0 (en) * 1998-07-22 1998-09-16 Secr Defence Transferring materials into cells and a microneedle array
US6197654B1 (en) * 1998-08-21 2001-03-06 Texas Instruments Incorporated Lightly positively doped silicon wafer anodization process
US6417069B1 (en) * 1999-03-25 2002-07-09 Canon Kabushiki Kaisha Substrate processing method and manufacturing method, and anodizing apparatus
EP1208002A4 (de) * 1999-06-03 2006-08-02 Penn State Res Found Dünnschicht-abgeschieden leersäule-netzwerksmaterialien
GB9929521D0 (en) 1999-12-15 2000-02-09 Secr Defence Bonded products and methods of fabrication therefor
GB0008494D0 (en) 2000-04-07 2000-05-24 Secr Defence Microprojectile delivery system
US6819845B2 (en) * 2001-08-02 2004-11-16 Ultradots, Inc. Optical devices with engineered nonlinear nanocomposite materials
US7005669B1 (en) 2001-08-02 2006-02-28 Ultradots, Inc. Quantum dots, nanocomposite materials with quantum dots, devices with quantum dots, and related fabrication methods
US6794265B2 (en) * 2001-08-02 2004-09-21 Ultradots, Inc. Methods of forming quantum dots of Group IV semiconductor materials
US6710366B1 (en) 2001-08-02 2004-03-23 Ultradots, Inc. Nanocomposite materials with engineered properties
US20030066998A1 (en) * 2001-08-02 2003-04-10 Lee Howard Wing Hoon Quantum dots of Group IV semiconductor materials
GB0120202D0 (en) 2001-08-18 2001-10-10 Psimedica Body fluid collection and analysis
JP2003124574A (ja) * 2001-10-09 2003-04-25 Fujitsu Ltd 光半導体装置及びその製造方法
GB0130608D0 (en) 2001-12-21 2002-02-06 Psimedica Ltd Medical fibres and fabrics
AU2003206031A1 (en) * 2002-03-08 2003-09-22 Koninklijke Philips Electronics N.V. Method of manufacturing nanowires and an electronic device
US6955745B1 (en) * 2002-08-01 2005-10-18 University Of Florida Research Foundation, Inc. Method of spark-processing silicon and resulting materials
US6864190B2 (en) * 2002-10-17 2005-03-08 National Research Council Of Canada Laser chemical fabrication of nanostructures
US7357877B2 (en) * 2002-11-18 2008-04-15 Koninklijke Philips Electronics N.V. Dispersion of nanowires of semiconductor material
JP2004335662A (ja) * 2003-05-06 2004-11-25 Canon Inc 部材及び部材の製造方法
US9508886B2 (en) 2007-10-06 2016-11-29 Solexel, Inc. Method for making a crystalline silicon solar cell substrate utilizing flat top laser beam
US8399331B2 (en) 2007-10-06 2013-03-19 Solexel Laser processing for high-efficiency thin crystalline silicon solar cell fabrication
US8420435B2 (en) * 2009-05-05 2013-04-16 Solexel, Inc. Ion implantation fabrication process for thin-film crystalline silicon solar cells
CN101536187A (zh) * 2006-10-05 2009-09-16 日立化成工业株式会社 有序排列、大长宽比、高密度的硅纳米线及其制造方法
US8084684B2 (en) * 2006-10-09 2011-12-27 Solexel, Inc. Three-dimensional thin-film solar cells
US8512581B2 (en) * 2006-10-09 2013-08-20 Solexel, Inc. Methods for liquid transfer coating of three-dimensional substrates
US8193076B2 (en) 2006-10-09 2012-06-05 Solexel, Inc. Method for releasing a thin semiconductor substrate from a reusable template
US20100304521A1 (en) * 2006-10-09 2010-12-02 Solexel, Inc. Shadow Mask Methods For Manufacturing Three-Dimensional Thin-Film Solar Cells
US7999174B2 (en) * 2006-10-09 2011-08-16 Solexel, Inc. Solar module structures and assembly methods for three-dimensional thin-film solar cells
US8293558B2 (en) * 2006-10-09 2012-10-23 Solexel, Inc. Method for releasing a thin-film substrate
US20080264477A1 (en) * 2006-10-09 2008-10-30 Soltaix, Inc. Methods for manufacturing three-dimensional thin-film solar cells
US8035028B2 (en) * 2006-10-09 2011-10-11 Solexel, Inc. Pyramidal three-dimensional thin-film solar cells
US20100144080A1 (en) * 2008-06-02 2010-06-10 Solexel, Inc. Method and apparatus to transfer coat uneven surface
EP2356675B1 (de) 2008-11-13 2016-06-01 Solexel, Inc. Dreidimensionale Dünnschichtsolarzelle und deren Herstellungsverfahren
US8288195B2 (en) * 2008-11-13 2012-10-16 Solexel, Inc. Method for fabricating a three-dimensional thin-film semiconductor substrate from a template
EP2371006A4 (de) * 2008-11-26 2013-05-01 Solexel Inc Trunkierte pyramidenstruktren für durchsichtige solarzellen
US9890465B2 (en) * 2009-01-15 2018-02-13 Trutag Technologies, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate
US8906218B2 (en) 2010-05-05 2014-12-09 Solexel, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate
WO2010083422A1 (en) * 2009-01-15 2010-07-22 Solexel, Inc. Porous silicon electro-etching system and method
US9076642B2 (en) * 2009-01-15 2015-07-07 Solexel, Inc. High-Throughput batch porous silicon manufacturing equipment design and processing methods
MY162405A (en) * 2009-02-06 2017-06-15 Solexel Inc Trench Formation Method For Releasing A Thin-Film Substrate From A Reusable Semiconductor Template
US8828517B2 (en) 2009-03-23 2014-09-09 Solexel, Inc. Structure and method for improving solar cell efficiency and mechanical strength
EP2419306B1 (de) * 2009-04-14 2016-03-30 Solexel, Inc. Hochleistungsreaktor für epitaktische gasphasenabscheidung (cvd)
US9099584B2 (en) * 2009-04-24 2015-08-04 Solexel, Inc. Integrated three-dimensional and planar metallization structure for thin film solar cells
CN102460716B (zh) 2009-05-05 2015-03-25 速力斯公司 高生产率多孔半导体制造设备
US9318644B2 (en) 2009-05-05 2016-04-19 Solexel, Inc. Ion implantation and annealing for thin film crystalline solar cells
US8445314B2 (en) * 2009-05-22 2013-05-21 Solexel, Inc. Method of creating reusable template for detachable thin film substrate
EP2436028B1 (de) * 2009-05-29 2016-08-10 Solexel, Inc. Durchsichtiges dreidimensionales dünnfilmsolarzelle-halbleitersubstrat und herstellungsverfahren dafür
CN102763225B (zh) 2009-12-09 2016-01-20 速力斯公司 使用半导体晶片的高效率光伏背结背触点太阳能电池结构和制造方法
US8241940B2 (en) 2010-02-12 2012-08-14 Solexel, Inc. Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
KR20130051013A (ko) 2010-06-09 2013-05-16 솔렉셀, 인크. 고생산성 박막 증착 방법 및 시스템
MY158500A (en) 2010-08-05 2016-10-14 Solexel Inc Backplane reinforcement and interconnects for solar cells
RU2448741C1 (ru) 2011-03-24 2012-04-27 Закрытое акционерное общество "Институт прикладной нанотехнологии" Способ формирования наноструктурированного биосовместимого покрытия на имплантатах
EP2710639A4 (de) 2011-05-20 2015-11-25 Solexel Inc Selbstaktivierte vorderseiten-vorspannung für eine solarzelle
CA2829605C (en) 2013-10-07 2016-06-14 Springpower International Incorporated A method for mass production of silicon nanowires and/or nanobelts, and lithium batteries and anodes using the silicon nanowires and/or nanobelts
GB202012302D0 (en) 2020-08-07 2020-09-23 Kings College Lithiated silicon

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027179B2 (ja) * 1975-11-05 1985-06-27 日本電気株式会社 多孔質シリコンの形成方法
US4155781A (en) * 1976-09-03 1979-05-22 Siemens Aktiengesellschaft Method of manufacturing solar cells, utilizing single-crystal whisker growth
US4392011A (en) * 1980-04-30 1983-07-05 Rca Corporation Solar cell structure incorporating a novel single crystal silicon material
JPS571265A (en) * 1980-06-02 1982-01-06 Fuji Electric Co Ltd Solar cell
US4954182A (en) * 1980-11-13 1990-09-04 Energy Conversion Devices, Inc. Multiple cell photoresponsive amorphous photo voltaic devices including graded band gaps
JPS57153478A (en) * 1981-03-19 1982-09-22 Agency Of Ind Science & Technol Photoelectric conversion device
US4532700A (en) * 1984-04-27 1985-08-06 International Business Machines Corporation Method of manufacturing semiconductor structures having an oxidized porous silicon isolation layer
DE3420887A1 (de) * 1984-06-05 1985-12-05 Telefunken electronic GmbH, 7100 Heilbronn Solarzelle
US4581103A (en) * 1984-09-04 1986-04-08 Texas Instruments Incorporated Method of etching semiconductor material
US4751194A (en) * 1986-06-27 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Structures including quantum well wires and boxes
US4775425A (en) * 1987-07-27 1988-10-04 Energy Conversion Devices, Inc. P and n-type microcrystalline semiconductor alloy material including band gap widening elements, devices utilizing same
DE3727823A1 (de) * 1987-08-20 1989-03-02 Siemens Ag Tandem-solarmodul
US4801380A (en) * 1987-12-23 1989-01-31 The Texas A&M University System Method of producing a silicon film with micropores
US4910165A (en) * 1988-11-04 1990-03-20 Ncr Corporation Method for forming epitaxial silicon on insulator structures using oxidized porous silicon
US4910115A (en) * 1988-11-21 1990-03-20 The Mead Corporation Light-sensitive polymerizable compositions containing silver compounds
US5023200A (en) * 1988-11-22 1991-06-11 The United States Of America As Represented By The United States Department Of Energy Formation of multiple levels of porous silicon for buried insulators and conductors in silicon device technologies
US4987094A (en) * 1989-06-02 1991-01-22 Bell Communications Research, Inc. Method of making a macroscopic stepped structure on a vicinally cut crystal
US5156896A (en) * 1989-08-03 1992-10-20 Alps Electric Co., Ltd. Silicon substrate having porous oxidized silicon layers and its production method
GB8927709D0 (en) * 1989-12-07 1990-02-07 Secretary Of The State For Def Silicon quantum wires
US5272355A (en) * 1992-05-20 1993-12-21 Spire Corporation Optoelectronic switching and display device with porous silicon
US5256339A (en) * 1992-10-30 1993-10-26 The United States Of America As Represented By The Secretary Of The Army Fabrication technique for silicon microclusters using pulsed electrical power
US5324965A (en) * 1993-03-26 1994-06-28 The United States Of America As Represented By The Secretary Of The Army Light emitting diode with electro-chemically etched porous silicon
US5420049A (en) * 1993-09-09 1995-05-30 The United States Of America As Represented By The Secretary Of The Navy Method of controlling photoemission from porous silicon using ion implantation

Also Published As

Publication number Publication date
ES2074586T3 (es) 1995-09-16
GB2266994B (en) 1994-08-03
WO1991009420A1 (en) 1991-06-27
EP0616378A3 (de) 1998-05-06
CA2073030C (en) 1999-02-23
DE69020906D1 (de) 1995-08-17
JPH05502978A (ja) 1993-05-20
EP0504170B1 (de) 1995-07-12
EP0616378A2 (de) 1994-09-21
GB2254188B (en) 1994-07-20
GB2266994A (en) 1993-11-17
JP2611072B2 (ja) 1997-05-21
DE69020906T2 (de) 1995-12-14
US6147359A (en) 2000-11-14
JPH0774392A (ja) 1995-03-17
US5358600A (en) 1994-10-25
US6369405B1 (en) 2002-04-09
EP0504170A1 (de) 1992-09-23
GB9209555D0 (en) 1992-07-01
DK0504170T3 (da) 1995-09-04
US5348618A (en) 1994-09-20
GB9304855D0 (en) 1993-04-28
JP2963617B2 (ja) 1999-10-18
CA2073030A1 (en) 1991-06-08
GB2254188A (en) 1992-09-30
GB8927709D0 (en) 1990-02-07
GB2254188C (en) 1994-12-23

Similar Documents

Publication Publication Date Title
DE69020906D1 (de) Herstellungsverfahren für einen quantumleiter.
DE69008931T2 (de) Verbindungshalbleitervorrichtung und Methode zu deren Oberflächenbehandlung.
Turner et al. Photoelectrochemistry with p‐Si electrodes: Effects of inversion
Gösele et al. Light-emitting porous silicon
DE4126955C2 (de) Verfahren zum Herstellen von elektrolumineszenten Siliziumstrukturen
US6017773A (en) Stabilizing process for porous silicon and resulting light emitting device
Bayliss et al. Network dimensionality of porous Si and Ge
DE2534945A1 (de) Leuchtdiode und verfahren zu ihrer herstellung
CN108329913A (zh) 一种铝掺杂半导体量子棒及其制备方法和用途
US5092957A (en) Carrier-lifetime-controlled selective etching process for semiconductors using photochemical etching
US3998672A (en) Method of producing infrared luminescent diodes
Shelton et al. Ultrasmooth GaN etched surfaces using photoelectrochemical wet etching and an ultrasonic treatment
Chang et al. Photoluminescence and Raman studies of porous silicon under various temperatures and light illuminations
Gomyou et al. Effect of electrochemical treatments on the photoluminescence from porous silicon
JP2006269421A (ja) 電界発光ダイオード、電界発光ダイオードアレイ、及び電界発光ダイオードの製造方法
US6690027B1 (en) Method for making a device comprising layers of planes of quantum dots
DE4126954C2 (de) Verwendung einer mikroporösen Siliziumstruktur als photolumineszente Struktur
US3759768A (en) Preferential etching of silicon
CN208225904U (zh) 基于GaN材料的RGBW垂直结构LED芯片及LED灯
CN103400909A (zh) 提高半导体硅发光效率的方法及产品及其制备方法
CN207705234U (zh) 高电压led光源
Inada et al. Anodic Oxidation of GaP in N‐methylacetamide for Electrical Profiling of Ion‐Implanted GaP
Richmond et al. Porous silicon and the search for a silicon-based LED
JPS6477960A (en) Manufacture of light-electron integrated circuit
Katsuyama et al. Optical properties of GaAs nano-whiskers

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee