ES2081926T3 - Adhesivos termoendurecibles, sensibles a la presion de una mezcla de epoxi-acrilato. - Google Patents

Adhesivos termoendurecibles, sensibles a la presion de una mezcla de epoxi-acrilato.

Info

Publication number
ES2081926T3
ES2081926T3 ES90301964T ES90301964T ES2081926T3 ES 2081926 T3 ES2081926 T3 ES 2081926T3 ES 90301964 T ES90301964 T ES 90301964T ES 90301964 T ES90301964 T ES 90301964T ES 2081926 T3 ES2081926 T3 ES 2081926T3
Authority
ES
Spain
Prior art keywords
epoxy
sensitive
thermo
pressure
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90301964T
Other languages
English (en)
Inventor
Shinobu Sato
Shuichi Kitano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of ES2081926T3 publication Critical patent/ES2081926T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

EL INVENTO RELATA A UN ADHESIVO TERMOESTABLE SENSIBLE DE PRESION QUE COMPRENDE DESDE EL 30% AL 80% DE PESO DE UN JARABE MONOMERO FOTOPOLIMERIZABLE QUE CONTIENE UN ESTER ACRILICO Y UN MONOMERO COPOLIMERIZABLE POLAR, DESDE EL 20 AL 60% DE PESO DE UNA RESINA EPOXI O UNA MEZCLA DE RESINAS EPOXI QUE CONTIENEN GRUPOS NO FOTOPOLIMERIZABLES, DESDE EL 0.5 AL 10% DE PESO DE UN ENDURECEDOR ACTIVABLE DE CALOR PARA LA RESINA EPOXI, DESDE EL 0.01 AL 5% DE UN FOTOINICIADOR, Y DESDE EL 0 AL 5% DE UN AGENTE FOTOENLAZANTE CRUZADO.
ES90301964T 1989-03-09 1990-02-23 Adhesivos termoendurecibles, sensibles a la presion de una mezcla de epoxi-acrilato. Expired - Lifetime ES2081926T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32157189A 1989-03-09 1989-03-09

Publications (1)

Publication Number Publication Date
ES2081926T3 true ES2081926T3 (es) 1996-03-16

Family

ID=23251147

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90301964T Expired - Lifetime ES2081926T3 (es) 1989-03-09 1990-02-23 Adhesivos termoendurecibles, sensibles a la presion de una mezcla de epoxi-acrilato.

Country Status (8)

Country Link
EP (1) EP0386909B1 (es)
JP (1) JPH0715090B2 (es)
KR (1) KR0136861B1 (es)
AU (1) AU615136B2 (es)
CA (1) CA2009566A1 (es)
DE (1) DE69024678T2 (es)
ES (1) ES2081926T3 (es)
MX (1) MX170402B (es)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU641580B2 (en) * 1991-02-28 1993-09-23 National Starch And Chemical Investment Holding Corporation Water vapor permeable pressure sensitive adhesive composition
JPH09505335A (ja) * 1993-11-10 1997-05-27 ミネソタ マイニング アンド マニュファクチャリング カンパニー 溶融−流動可能な材料および表面シール方法
BR9408007A (pt) * 1993-11-10 1996-12-03 Minnesota Mining & Mfg Adesivo termorrígido sensivel a pressao
DE69434203T2 (de) * 1993-11-10 2006-01-12 Minnesota Mining And Mfg. Co., St. Paul Wärmehärtbare druckempfindliche Klebefolie
DE69602835T2 (de) * 1995-04-24 2000-03-09 Minnesota Mining And Mfg. Co. Druckempfindliche klebstoffe für polyolefinoberflächen
WO1997003143A1 (en) 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JP4154513B2 (ja) * 1996-05-16 2008-09-24 スリーエム カンパニー 接着剤組成物と使用方法
JP4636513B2 (ja) * 1996-05-30 2011-02-23 日東電工株式会社 熱硬化型感圧性接着剤とその接着シ―ト類
EP1249479B1 (en) * 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
EP0823312A1 (en) 1996-08-07 1998-02-11 Minnesota Mining And Manufacturing Company Hand-held device for adhering an object having a thermosettable layer, to a substrate
KR100430958B1 (ko) * 1996-11-12 2004-05-12 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 열경화성의 감압성 접착제
JP3730787B2 (ja) 2000-02-14 2006-01-05 積水化学工業株式会社 光硬化性組成物、光硬化性組成物の製造方法、光硬化型粘接着シート、光硬化型粘接着シートの製造方法及び接合方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
US6908318B2 (en) 2001-08-08 2005-06-21 3M Innovative Properties Company Batch electrically connecting sheet
EP1858069A1 (en) * 2005-02-21 2007-11-21 Nitto Denko Corporation Semiconductor device manufacturing method
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
DE102006048464A1 (de) * 2006-10-11 2008-04-17 Bundesdruckerei Gmbh Haftvermittlerschicht für die Verbindung eines holographischen Datenträgers mit einem Substrat
US7787256B2 (en) * 2007-08-10 2010-08-31 Gore Enterprise Holdings, Inc. Tamper respondent system
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
KR101072371B1 (ko) 2010-09-20 2011-10-11 주식회사 엘지화학 편광판용 접착제 및 이를 포함하는 편광판
US10472545B2 (en) * 2012-12-26 2019-11-12 Nitto Denko Corporation Sealing sheet
DE102013216782A1 (de) 2013-08-23 2015-02-26 Tesa Se Stanzling insbesondere zum dauerhaften Verschließen von Löchern
JP6331367B2 (ja) * 2013-12-05 2018-05-30 東洋インキＳｃホールディングス株式会社 樹脂組成物、活性エネルギー線重合性接着剤、及び積層体
JP6310731B2 (ja) 2014-03-07 2018-04-11 スリーエム イノベイティブ プロパティズ カンパニー 熱硬化性感圧接着剤
US20180230337A1 (en) * 2014-10-20 2018-08-16 Sekisui Plastics Co., Ltd. Tacky gel sheet having adhesive applications, method for producing same, method for fixing a pair of objects, and composite material
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
EP3091059B1 (de) 2015-05-05 2020-09-09 tesa SE Klebeband mit klebemasse mit kontinuierlicher polymerphase
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
JP7836308B2 (ja) * 2020-11-25 2026-03-26 ニットー、インコーポレイテド 補強部材
CN115926688A (zh) * 2022-11-17 2023-04-07 沈阳化工研究院有限公司 一种导热压敏胶及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1552046A (en) * 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US4239077A (en) * 1978-12-01 1980-12-16 Westinghouse Electric Corp. Method of making heat curable adhesive coated insulation for transformers
JPS58149971A (ja) * 1982-03-01 1983-09-06 Semedain Kk 二液反応型接着剤
US4612209A (en) * 1983-12-27 1986-09-16 Ciba-Geigy Corporation Process for the preparation of heat-curable adhesive films
JPS60199025A (ja) * 1984-03-22 1985-10-08 Toshiba Corp 光硬化性樹脂組成物
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法

Also Published As

Publication number Publication date
AU615136B2 (en) 1991-09-19
KR0136861B1 (ko) 1998-04-25
AU4989590A (en) 1990-09-13
JPH02272076A (ja) 1990-11-06
MX170402B (es) 1993-08-19
DE69024678T2 (de) 1996-08-08
KR900014552A (ko) 1990-10-24
DE69024678D1 (de) 1996-02-22
EP0386909A2 (en) 1990-09-12
JPH0715090B2 (ja) 1995-02-22
EP0386909B1 (en) 1996-01-10
CA2009566A1 (en) 1990-09-09
EP0386909A3 (en) 1992-03-18

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