ES2083398T3 - Placas mejoradas de cricuitos de hilos metalicos trazados y metodos para su fabricacion. - Google Patents

Placas mejoradas de cricuitos de hilos metalicos trazados y metodos para su fabricacion.

Info

Publication number
ES2083398T3
ES2083398T3 ES90112209T ES90112209T ES2083398T3 ES 2083398 T3 ES2083398 T3 ES 2083398T3 ES 90112209 T ES90112209 T ES 90112209T ES 90112209 T ES90112209 T ES 90112209T ES 2083398 T3 ES2083398 T3 ES 2083398T3
Authority
ES
Spain
Prior art keywords
conductive layer
signal
manufacture
methods
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90112209T
Other languages
English (en)
Inventor
Joseph P Hammond
John Branigan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Interconnection Technology Inc
Original Assignee
Advanced Interconnection Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Interconnection Technology Inc filed Critical Advanced Interconnection Technology Inc
Application granted granted Critical
Publication of ES2083398T3 publication Critical patent/ES2083398T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

LA INVENCION SE REFIERE A UN TABLERO DE INTERCONEXION PARA CONECTAR DISPOSITIVOS ELECTRONICOS, ELECTRO-OPTICOS Y/U OPTICOS, Y METODOS DE FABRICACION DE TALES TABLEROS. LAS INTERCONEXIONES SE FORMAN TRAZANDO FILAMENTOS ELECTRICA U OPTICAMENTE CONDUCTIVOS PARA FORMAR UNA CAPA CONDUCTORA DE SEÑALES. EL TABLERO DE INTERCONEXIONES COMPRENDE UNA BASE COMO UN ELEMENTO DE SOPORTE, UNA CAPA CONDUCTORA DE SEÑALES LAMINADA A LA BASE Y UNA CAPA CONDUCTORA SUPERFICIAL LAMINADA A LA CAPA CONDUCTORA DE SEÑALES. LAS CONEXIONES INTERCAPAS ENTRE LA CAPA CONDUCTORA DE SEÑALES Y LA CAPA CONDUCTORA SUPERFICIAL ESTAN FORMADAS POR SEGMENTOS DE LOS FILAMENTOS CONDUCTIVOS DE LA CAPA CONDUCTORA DE SEÑALES, DESPLAZADOS DESDE LA CAPA CONDUCTORA DE SEÑALES HASTA CERCA DE LA SUPERFICIE DEL TABLERO DE INTERCONEXIONES, PARA FORMAR PARTE DE, O CONECTAR CON, EL MODELO CONDUCTIVO DE SUPERFICIES.
ES90112209T 1989-06-30 1990-06-27 Placas mejoradas de cricuitos de hilos metalicos trazados y metodos para su fabricacion. Expired - Lifetime ES2083398T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/374,489 US4972050A (en) 1989-06-30 1989-06-30 Wire scribed circuit boards and methods of their manufacture

Publications (1)

Publication Number Publication Date
ES2083398T3 true ES2083398T3 (es) 1996-04-16

Family

ID=23477065

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90112209T Expired - Lifetime ES2083398T3 (es) 1989-06-30 1990-06-27 Placas mejoradas de cricuitos de hilos metalicos trazados y metodos para su fabricacion.

Country Status (8)

Country Link
US (1) US4972050A (es)
EP (1) EP0405482B1 (es)
JP (1) JPH0770833B2 (es)
AU (1) AU644079B2 (es)
CA (1) CA2019615C (es)
DE (1) DE4020498C2 (es)
ES (1) ES2083398T3 (es)
GB (1) GB2235095B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223676A (en) * 1989-11-27 1993-06-29 The Furukawa Electric Co., Ltd. Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
JP2678958B2 (ja) * 1992-03-02 1997-11-19 カシオ計算機株式会社 フィルム配線基板およびその製造方法
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
SE510564C2 (sv) * 1996-12-19 1999-06-07 Ericsson Telefon Ab L M Kombinerad elektrisk och optisk kantkontakt för kompakt förbindning av en del med en annan del jämte förfarande för att åstadkomma en förbindning
US6005991A (en) * 1997-11-26 1999-12-21 Us Conec Ltd Printed circuit board assembly having a flexible optical circuit and associated fabrication method
JP2001053438A (ja) * 1999-08-16 2001-02-23 Sony Corp 多層プリント配線板の製造方法
ATE388613T1 (de) * 2001-11-02 2008-03-15 Imego Ab Trägeranordnung für optische komponenten und zum verbinden optischer signale und verfahren zu deren herstellung
US7130498B2 (en) * 2003-10-16 2006-10-31 3M Innovative Properties Company Multi-layer optical circuit and method for making
US20070013487A1 (en) * 2005-07-18 2007-01-18 Jan Scholtz Digital certificate on connectors and other products using RFID tags and/or labels as well as RFID reader/interrogator
US7336883B2 (en) * 2005-09-08 2008-02-26 Stratos International, Inc. Indexing optical fiber adapter
US7226217B1 (en) * 2005-11-18 2007-06-05 Stratos International, Inc. Transceiver/fiber optic connector adaptor with patch cord ID reading capability
US7583871B1 (en) * 2008-03-20 2009-09-01 Bchir Omar J Substrates for optical die structures
US7486847B1 (en) * 2008-03-31 2009-02-03 International Business Machines Corporation Chip carrier package with optical vias
KR101243837B1 (ko) * 2009-10-23 2013-03-20 한국전자통신연구원 다층 배선 연결 구조 및 그의 제조 방법
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
CN104428912A (zh) * 2012-06-26 2015-03-18 株式会社村田制作所 安装基板和发光装置
JP6492758B2 (ja) * 2014-02-27 2019-04-03 日立化成株式会社 マルチワイヤ配線板
EP3410471B1 (en) * 2016-01-27 2025-04-02 KYOCERA Corporation Wiring substrate, optical semiconductor element package, and optical semiconductor device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3019489A (en) * 1956-08-09 1962-02-06 Western Electric Co Method of making wired electrical mounting boards
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
JPS5550399B1 (es) * 1970-03-05 1980-12-17
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
US3872236A (en) * 1971-06-11 1975-03-18 Amp Inc Bonded wire i interconnection system
US4097684A (en) * 1971-12-20 1978-06-27 Kollmorgen Technologies Inc. Electric wiring assemblies
US3969816A (en) * 1972-12-11 1976-07-20 Amp Incorporated Bonded wire interconnection system
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4541882A (en) * 1981-04-14 1985-09-17 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components and articles made by said process
US4544442A (en) * 1981-04-14 1985-10-01 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4602318A (en) * 1981-04-14 1986-07-22 Kollmorgen Technologies Corporation Substrates to interconnect electronic components
US4533787A (en) * 1981-11-26 1985-08-06 Autophon Ag. Printed circuit assembly
JPS596591A (ja) * 1982-06-28 1984-01-13 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ワイヤ封入型回路板の製造方法
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
JPS6292495A (ja) * 1985-09-13 1987-04-27 アドバンスト　インターコネクション　テクノロジー　インコーポレイテッド 電子部品を相互接続するための基板の製造法およびそれによつて製造される物品
US4646436A (en) * 1985-10-18 1987-03-03 Kollmorgen Technologies Corporation Shielded interconnection boards
US4743710A (en) * 1985-10-18 1988-05-10 Kollmorgen Technologies Corporation Coaxial interconnection boards
US4679321A (en) * 1985-10-18 1987-07-14 Kollmorgen Technologies Corporation Method for making coaxial interconnection boards
CA1304865C (en) * 1985-12-20 1992-07-07 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
EP0228694A3 (en) * 1985-12-30 1989-10-04 E.I. Du Pont De Nemours And Company Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer
US4943334A (en) * 1986-09-15 1990-07-24 Compositech Ltd. Method for making reinforced plastic laminates for use in the production of circuit boards
JPH0666549B2 (ja) * 1988-08-31 1994-08-24 信越ポリマー株式会社 スルーホール付きフレキシブル基板の製造方法

Also Published As

Publication number Publication date
AU5798990A (en) 1991-01-03
DE4020498C2 (de) 1995-03-16
EP0405482A1 (en) 1991-01-02
CA2019615A1 (en) 1990-12-31
DE4020498A1 (de) 1991-01-10
EP0405482B1 (en) 1995-12-27
AU644079B2 (en) 1993-12-02
US4972050A (en) 1990-11-20
JPH0344998A (ja) 1991-02-26
GB2235095B (en) 1993-07-07
GB2235095A (en) 1991-02-20
JPH0770833B2 (ja) 1995-07-31
GB9013681D0 (en) 1990-08-08
CA2019615C (en) 1993-09-21

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