ES2085368T3 - Sistema de calentamiento y de control de una placa de semi-conductor y modo de funcionamiento. - Google Patents

Sistema de calentamiento y de control de una placa de semi-conductor y modo de funcionamiento.

Info

Publication number
ES2085368T3
ES2085368T3 ES91105627T ES91105627T ES2085368T3 ES 2085368 T3 ES2085368 T3 ES 2085368T3 ES 91105627 T ES91105627 T ES 91105627T ES 91105627 T ES91105627 T ES 91105627T ES 2085368 T3 ES2085368 T3 ES 2085368T3
Authority
ES
Spain
Prior art keywords
heating
semi
control system
operation mode
conductor plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91105627T
Other languages
English (en)
Inventor
Jaim Nulman
Dan Maydan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24031855&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2085368(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ES2085368T3 publication Critical patent/ES2085368T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

LA TEMPERATURA DE UN DISCO SEMICONDUCTOR (14) DURANTE EL RECOCIDO DE METALIZACION SE CONTROLA PRECISA E INDIRECTAMENTE SOSTENIENDO EL DISCO (14) EN UN SUSCEPTOR DELGADO (13) DE PODER EMISOR CONSTANTE Y CONTROLANDO LA TEMPERATURA DEL SUSCEPTOR (13). EL SISTEMA TIENE LA VENTAJA AÑADIDA DE PROPORCIONAR UN CALENTAMIENTO EFICIENTE Y CONTROLADO DEL DISCO (14) MEDIANTE UN CALENTAMIENTO RADIANTE DE LA CARA TRASERA DEL SUSCEPTOR (13).
ES91105627T 1990-04-19 1991-04-09 Sistema de calentamiento y de control de una placa de semi-conductor y modo de funcionamiento. Expired - Lifetime ES2085368T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51071090A 1990-04-19 1990-04-19

Publications (1)

Publication Number Publication Date
ES2085368T3 true ES2085368T3 (es) 1996-06-01

Family

ID=24031855

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91105627T Expired - Lifetime ES2085368T3 (es) 1990-04-19 1991-04-09 Sistema de calentamiento y de control de una placa de semi-conductor y modo de funcionamiento.

Country Status (5)

Country Link
EP (1) EP0452777B1 (es)
JP (1) JP2965737B2 (es)
KR (1) KR100190357B1 (es)
DE (1) DE69117322T2 (es)
ES (1) ES2085368T3 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2939771B2 (ja) * 1990-04-09 1999-08-25 アネルバ 株式会社 半導体ウエハーの処理方法および装置
US5551982A (en) * 1994-03-31 1996-09-03 Applied Materials, Inc. Semiconductor wafer process chamber with susceptor back coating
US6600138B2 (en) * 2001-04-17 2003-07-29 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits
JP7701895B2 (ja) * 2021-06-24 2025-07-02 クアーズテック合同会社 サセプタ及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119647B2 (ja) * 1985-07-15 1995-12-20 日本電気株式会社 光強度測定装置
JPS62118519A (ja) * 1985-11-19 1987-05-29 Mitsubishi Electric Corp 半導体基板加熱装置
US4978567A (en) * 1988-03-31 1990-12-18 Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same
US4891499A (en) * 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems

Also Published As

Publication number Publication date
DE69117322D1 (de) 1996-04-04
EP0452777A3 (en) 1992-09-09
EP0452777A2 (en) 1991-10-23
JPH04226047A (ja) 1992-08-14
DE69117322T2 (de) 1996-10-02
KR910019167A (ko) 1991-11-30
KR100190357B1 (ko) 1999-06-01
EP0452777B1 (en) 1996-02-28
JP2965737B2 (ja) 1999-10-18

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