ES2104327T3 - Procedimiento y equipamiento para la elaboracion automatica de componentes. - Google Patents

Procedimiento y equipamiento para la elaboracion automatica de componentes.

Info

Publication number
ES2104327T3
ES2104327T3 ES94900048T ES94900048T ES2104327T3 ES 2104327 T3 ES2104327 T3 ES 2104327T3 ES 94900048 T ES94900048 T ES 94900048T ES 94900048 T ES94900048 T ES 94900048T ES 2104327 T3 ES2104327 T3 ES 2104327T3
Authority
ES
Spain
Prior art keywords
electronic components
pct
printed circuit
circuit boards
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94900048T
Other languages
English (en)
Inventor
Klaus Englert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F E S USED ELECTRONICS ELEKTRO
Original Assignee
F E S USED ELECTRONICS ELEKTRO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19924239642 external-priority patent/DE4239642C2/de
Application filed by F E S USED ELECTRONICS ELEKTRO filed Critical F E S USED ELECTRONICS ELEKTRO
Application granted granted Critical
Publication of ES2104327T3 publication Critical patent/ES2104327T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Fertilizers (AREA)
  • Image Input (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

SE PROPONE UNA INSTALACION PARA LA ELIMINACION AUTOMATICA DE COMPONENTES (12,14,16) ELECTRONICOS MONTADOS SOBRE UNA PLACA (1) DE CIRCUITO IMPRESO, QUE DISPONE DE UN DISPOSITIVO DE ILUMINACION PARA EL ILUMINADO DE LA PLACA (1) DE CIRCUITO IMPRESO, UN SENSOR OPTICO, UN SISTEMA DE PROCESADO DE IMAGEN Y VARIOS DISPOSITIVOS (11,13 PARA LA ELIMINACION DE COMPONENTES (12,14). EL SISTEMA DE PROCESADO DE IMAGEN RECONOCE LAS COORDENADAS DE LOS CONTORNOS Y CON PREFERENCIA TAMBIEN LOS TIPOS DE COMPONENTES (11,13) A PARTIR DE LAS SEÑALES DE SALIDA SUMINISTRADAS POR EL SENSOR (4) OPTICO Y CONTROLA LOS DISPOSITIVOS (11,13) PARA LA ELIMINACION DE LOS COMPONENTES (12,14). DE FORMA ALTERNATIVA LOS CONTORNOS DE LOS COMPONENTES (12,14) SON RECONOCIDOS POR MEDIO DE RADIACION INFRARROJA. FINALMENTE SE DESCRIBE UN PROCESO PARA LA ELIMINACION DE COMPONENTES A PARTIR DE LA PLACA (1) DE CIRCUITO IMPRESO A TRAVES DE MEDIOS DE LA PLANTA DESCRITA.
ES94900048T 1992-11-26 1993-11-20 Procedimiento y equipamiento para la elaboracion automatica de componentes. Expired - Lifetime ES2104327T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19924239642 DE4239642C2 (de) 1992-11-26 1992-11-26 Verfahren zum automatischen Entstücken von mit elektronischen Bauelementen bestückten Leiterplatten sowie Anlage hierfür
DE4332236A DE4332236A1 (de) 1992-11-26 1993-09-22 Anlage zur automatischen Entstückung

Publications (1)

Publication Number Publication Date
ES2104327T3 true ES2104327T3 (es) 1997-10-01

Family

ID=25920731

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94900048T Expired - Lifetime ES2104327T3 (es) 1992-11-26 1993-11-20 Procedimiento y equipamiento para la elaboracion automatica de componentes.

Country Status (10)

Country Link
US (1) US5560100A (es)
EP (1) EP0671118B1 (es)
JP (1) JPH08505983A (es)
KR (1) KR950704930A (es)
AT (1) ATE148979T1 (es)
AU (1) AU5461694A (es)
CA (1) CA2149229A1 (es)
DE (2) DE4332236A1 (es)
ES (1) ES2104327T3 (es)
WO (1) WO1994013124A1 (es)

Families Citing this family (35)

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Publication number Priority date Publication date Assignee Title
US5595996A (en) * 1994-10-25 1997-01-21 Merck & Co., Inc. 7-substituted 4-aza cholanic acid derivatives and their use
DE29507009U1 (de) * 1995-04-26 1995-06-29 Stark, Ewald, 86850 Fischach Vorrichtung zur Entfrachtung von Leiterplatten
US7379788B1 (en) * 1998-06-10 2008-05-27 Hitachi, Ltd. Manufactured article treatment processing system
WO1997021501A1 (en) * 1995-12-12 1997-06-19 Hitachi, Ltd. Product disposal system
US6868603B2 (en) 1996-08-27 2005-03-22 Matsushita Electric Industrial Co., Ltd. Method of mounting component on circuit board
JPH1070395A (ja) 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 部品装着装置
KR19980039103A (ko) * 1996-11-27 1998-08-17 배순훈 임의 각도설정이 가능한 표면실장 부품용 장착 좌표 입력장치 및 방법
JP3689226B2 (ja) * 1997-03-13 2005-08-31 富士通株式会社 分解経路生成装置
JP3028791B2 (ja) * 1997-08-06 2000-04-04 日本電気株式会社 チップ部品の実装方法
JPH11298137A (ja) * 1998-04-13 1999-10-29 Fuji Photo Film Co Ltd 回路基板の部品交換装置
DE19982498T1 (de) 1998-11-05 2001-02-22 Cyberoptics Corp Elektronikmontagevorrichtung mit verbessertem Bilderzeugungssystem
US6538244B1 (en) 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6535291B1 (en) * 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
EP1911338A1 (en) * 2005-08-02 2008-04-16 Matsushita Electric Industrial Co., Ltd. Electronic component mounter and mounting method
JP4777759B2 (ja) * 2005-12-01 2011-09-21 富士フイルム株式会社 配線基板及び配線基板接続装置
US8366874B2 (en) 2010-08-09 2013-02-05 Empire Technology Development Llc Removing and segregating components from printed circuit boards
US8807189B2 (en) 2011-05-25 2014-08-19 Empire Technology Development Llc Removing and segregating components from printed circuit boards
KR102048361B1 (ko) * 2013-02-28 2019-11-25 엘지전자 주식회사 거리 검출 장치, 및 이를 구비하는 영상처리장치
JP5811159B2 (ja) * 2013-11-14 2015-11-11 オムロン株式会社 電子機器分析装置、ライブラリ提供システム
US10362720B2 (en) * 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US9591795B2 (en) * 2014-09-18 2017-03-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Sensor-based removal of a soldered device
FR3049813A1 (fr) * 2016-03-29 2017-10-06 D3Epaca Equipement et procede de separation de composants d'une carte electronique.
US11129318B1 (en) 2018-04-13 2021-09-21 Apple Inc. Modular system for automated portable electronic device disassembly
US11136191B1 (en) 2018-04-13 2021-10-05 Apple Inc. Modular system for automated portable electronic device disassembly
US11157043B1 (en) 2018-04-13 2021-10-26 Apple Inc. Modular system for automated portable electronic device disassembly
US11051441B1 (en) 2018-04-13 2021-06-29 Apple Inc. Modular system for automated portable electronic device disassembly
US11045913B1 (en) * 2018-04-13 2021-06-29 Apple Inc. Modular system for automated portable electronic device disassembly
IT202100002489A1 (it) 2021-02-04 2022-08-04 Futuredata Srl Sistema e metodo per lo smantellamento di schede elettroniche mediante attacco chimico
WO2022256332A1 (en) * 2021-06-01 2022-12-08 Kulicke And Soffa Industries, Inc. Electronic component bonding machines, and methods of measuring a distance on such machines
CN113613403A (zh) * 2021-07-16 2021-11-05 上海第二工业大学 一种移动终端电路板关键器件自动拆解装置和方法
GB2617086A (en) * 2022-03-28 2023-10-04 In2Tec Ltd Recycling circuit board components
CN115656787B (zh) * 2022-12-21 2023-04-07 巨翊医疗科技(苏州)有限公司 一种pcba的测试方法及装置
CN116511631A (zh) * 2023-04-25 2023-08-01 武汉理工大学 一种线路板拆解回收装置以及线路板拆解方法
US12263547B2 (en) * 2023-05-22 2025-04-01 Microsoft Technology Licensing, Llc Computerized demanufacturing system
EP4650060A1 (en) * 2024-05-14 2025-11-19 Microtest S.p.A. Electronic component selection and recovery method and related system

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US4222036A (en) * 1979-01-17 1980-09-09 Siemens Aktiengesellschaft Process for assembly of components on printed cards with the use of a position-locating aid
US4742947A (en) * 1986-10-21 1988-05-10 Pace, Incorporated Optical system for use as stand alone unit or with a device for attaching modular electronic components to or removing them from a substrate
DE58906804D1 (de) * 1988-08-05 1994-03-10 Siemens Ag Verfahren zur optischen Prüfung von Flachbaugruppen.
JPH0762654B2 (ja) * 1988-10-25 1995-07-05 松下電器産業株式会社 実装基板検査装置
US5044072A (en) * 1990-04-13 1991-09-03 Air-Vac Engineering Company, Inc. Vision system apparatus and method for component/pad alignment
US5172468A (en) * 1990-08-22 1992-12-22 Sony Corporation Mounting apparatus for electronic parts
JPH04107994A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Ind Co Ltd 電子部品の観察装置
US5194948A (en) * 1991-04-26 1993-03-16 At&T Bell Laboratories Article alignment method and apparatus
JPH04340799A (ja) * 1991-05-17 1992-11-27 Mitsubishi Electric Corp プリント基板及びその位置補正装置
DE4119401C2 (de) * 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
JPH05136600A (ja) * 1991-11-14 1993-06-01 Toshiba Corp 電子部品認識装置
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JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
JPH0653694A (ja) * 1992-07-28 1994-02-25 Sony Corp 電子部品実装機

Also Published As

Publication number Publication date
DE59305467D1 (de) 1997-03-27
KR950704930A (ko) 1995-11-20
AU5461694A (en) 1994-06-22
EP0671118B1 (de) 1997-02-12
EP0671118A1 (de) 1995-09-13
DE4332236A1 (de) 1995-03-23
CA2149229A1 (en) 1994-06-09
ATE148979T1 (de) 1997-02-15
US5560100A (en) 1996-10-01
WO1994013124A1 (de) 1994-06-09
JPH08505983A (ja) 1996-06-25

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