ES2116817T3 - Recubrimiento para la produccion estructurada de circuitos impresos en la superficie de sustratos electricamente aislantes. - Google Patents

Recubrimiento para la produccion estructurada de circuitos impresos en la superficie de sustratos electricamente aislantes.

Info

Publication number
ES2116817T3
ES2116817T3 ES96931814T ES96931814T ES2116817T3 ES 2116817 T3 ES2116817 T3 ES 2116817T3 ES 96931814 T ES96931814 T ES 96931814T ES 96931814 T ES96931814 T ES 96931814T ES 2116817 T3 ES2116817 T3 ES 2116817T3
Authority
ES
Spain
Prior art keywords
coating
structured
electrically insulating
printed circuits
insulating substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96931814T
Other languages
English (en)
Inventor
Joerg Kickelhain
Bruno Vitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF CAD CAM Systeme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF CAD CAM Systeme GmbH filed Critical LPKF CAD CAM Systeme GmbH
Application granted granted Critical
Publication of ES2116817T3 publication Critical patent/ES2116817T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
    • C03C17/23—Oxides
    • C03C17/25—Oxides by deposition from the liquid phase
    • C03C17/253—Coating containing SnO2
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
    • C04B41/505—Tin oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/87—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/662—Semiconductor materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/21—Oxides
    • C03C2217/211—SnO2
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/21—Oxides
    • C03C2217/23—Mixtures
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/21—Oxides
    • C03C2217/24—Doped oxides
    • C03C2217/241—Doped oxides with halides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/21—Oxides
    • C03C2217/24—Doped oxides
    • C03C2217/244—Doped oxides with Sb
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/11—Deposition methods from solutions or suspensions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Surface Treatment Of Glass (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

SE DESCRIBE UN RECUBRIMIENTO PARA LA GENERACION ESTRUCTURADA DE BANDAS CONDUCTORAS SOBRE LA SUPERFICIE DE SUBSTRATOS DE AISLAMIENTO ELECTRICO, EN PARTICULAR PARA LA ELABORACION DE ELEMENTOS DE SENSOR Y TARJETAS DE CIRCUITO IMPRESO. EL REVESTIMIENTO SE FORMA A PARTIR DE UNA CAPA DE OXIDO ESTANICO DOPADA DE COMPOSICION SN{SUB,1}-(Y+Z) AYBZO2, DONDE A = SB O F Y B = IN O AL. LA INVENCION SE CARACTERIZA DE TAL FORMA QUE LAS PORCIONES RELATIVAS EN EL REVESTIMIENTO DEL ANTIMONIO DE SUSTANCIAS DE DOPADO O EL FLUOR CON RESPECTO AL INDIO O EL ALUMINIO SE DEFINEN MEDIANTE LOS LIMITES 0,02 < Y + Z < 0,11 Y SE SATISFACE LA CONDICION 1,4 < Y/Z < 2,2. EL REVESTIMIENTO PUEDE SER ESTRUCTURADO MEDIANTE ABLACION UTILIZANDO RADIACION LASER ELECTROMAGNETICA EN LA ZONA DE LONGITUD DE ONDA DE 157-1064 NM. ESTO CREA UN MEDIO ECONOMICO PARA LA ALTA DESINTEGRACION Y ESTRUCTURACION DIRECTA LIBRE DE RESIDUOS DE CANALES DE AISLAMIENTO EN CAPAS CONDUCTORAS ELECTRICAMENTE ESTRECHAS DE ALTA RESISTENCIA QUIMICA, MECANICAO TERMICA SOBRE VIDRIO O SUBSTRATOS CERAMICOS.
ES96931814T 1995-09-21 1996-09-18 Recubrimiento para la produccion estructurada de circuitos impresos en la superficie de sustratos electricamente aislantes. Expired - Lifetime ES2116817T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19535068A DE19535068C2 (de) 1995-09-21 1995-09-21 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten, Verfahren zum Herstellen der Beschichtung und von strukturierten Leiterbahnen

Publications (1)

Publication Number Publication Date
ES2116817T3 true ES2116817T3 (es) 1998-07-16

Family

ID=7772759

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96931814T Expired - Lifetime ES2116817T3 (es) 1995-09-21 1996-09-18 Recubrimiento para la produccion estructurada de circuitos impresos en la superficie de sustratos electricamente aislantes.

Country Status (10)

Country Link
US (1) US5955179A (es)
EP (1) EP0793903B1 (es)
JP (1) JP2931413B2 (es)
KR (1) KR100268122B1 (es)
CN (1) CN1108088C (es)
AT (1) ATE164483T1 (es)
DE (2) DE19535068C2 (es)
DK (1) DK0793903T3 (es)
ES (1) ES2116817T3 (es)
WO (1) WO1997011589A1 (es)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100358129B1 (ko) * 1995-02-27 2003-01-24 주식회사 하이닉스반도체 산화물이도핑된폴리실리콘막을사용한반도체소자제조방법
DE19850592C1 (de) * 1998-11-03 2000-10-12 Lpkf Laser & Electronics Ag Haftvermittlerschicht zur Erzeugung haftfester Leiterstrukturen auf Isoliermaterialien der Elektronik
US6417486B1 (en) 1999-04-12 2002-07-09 Ticona Gmbh Production of conductor tracks on plastics by means of laser energy
US7073246B2 (en) * 1999-10-04 2006-07-11 Roche Diagnostics Operations, Inc. Method of making a biosensor
US20050103624A1 (en) 1999-10-04 2005-05-19 Bhullar Raghbir S. Biosensor and method of making
US6662439B1 (en) 1999-10-04 2003-12-16 Roche Diagnostics Corporation Laser defined features for patterned laminates and electrodes
US6645359B1 (en) * 2000-10-06 2003-11-11 Roche Diagnostics Corporation Biosensor
US6627057B1 (en) 1999-12-23 2003-09-30 Roche Diagnostic Corporation Microsphere containing sensor
US6540890B1 (en) * 2000-11-01 2003-04-01 Roche Diagnostics Corporation Biosensor
JP4997665B2 (ja) * 2001-03-27 2012-08-08 住友化学株式会社 透明導電性膜の製造方法
JP2003016633A (ja) * 2001-06-28 2003-01-17 Asahi Glass Co Ltd 磁気ディスク用ガラス基板及びその製造方法
US6814844B2 (en) 2001-08-29 2004-11-09 Roche Diagnostics Corporation Biosensor with code pattern
ATE277207T1 (de) * 2001-10-11 2004-10-15 Franz Oberflaechentechnik Gmbh Beschichtungsverfahren für leichtmetalllegierungsoberflächen
DE10301516B3 (de) * 2003-01-17 2004-04-29 Ticona Gmbh Verfahren zur Herstellung von Leiterstrukturen auf Isoliersubstraten aus polymerem Schaumstoff
KR100785670B1 (ko) 2003-06-20 2007-12-14 에프. 호프만-라 로슈 아게 폭이 좁은 균질한 시약 시트립을 제조하는 방법 및 시약
DE102004026830B4 (de) * 2004-05-28 2018-06-28 Dendron Gmbh Verfahren zur Erzeugung von elektrolytisch korrodierbaren Ablösestellen in Okklusionsmitteln, Okklusionsmittel, Einführhilfe und Vorrichtung aus einer Einführhilfe und einem Okklusionsmittel
EP1622435A1 (en) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Method of manufacturing an electronic circuit assembly using direct write techniques
US20080187683A1 (en) * 2006-07-10 2008-08-07 Vanderbilt University Resonant infrared laser-assisted nanoparticle transfer and applications of same
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
US8362617B2 (en) * 2008-05-01 2013-01-29 Infineon Technologies Ag Semiconductor device
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US8528203B2 (en) 2011-06-07 2013-09-10 International Business Machines Corporation Providing selective via plating using laser resin activation
KR20140091029A (ko) 2011-10-31 2014-07-18 티코나 엘엘씨 레이저 직접 구조체 기판의 형성에 사용하기 위한 열가소성 조성물
US9045363B2 (en) * 2011-12-27 2015-06-02 Intermolecular, Inc. Low-E panels with ternary metal oxide dielectric layer and method for forming the same
US9545301B2 (en) 2013-03-15 2017-01-17 Covidien Lp Coated medical devices and methods of making and using same
US9320592B2 (en) 2013-03-15 2016-04-26 Covidien Lp Coated medical devices and methods of making and using same
CN104177130A (zh) * 2013-05-23 2014-12-03 比亚迪股份有限公司 一种绝缘性基材表面图案化方法和一种陶瓷
US9668890B2 (en) 2013-11-22 2017-06-06 Covidien Lp Anti-thrombogenic medical devices and methods
KR101722744B1 (ko) 2014-10-23 2017-04-03 주식회사 엘지화학 전자기파 조사에 의한 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
JP6200934B2 (ja) 2014-12-08 2017-09-20 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ ビームアンテナ
US9789228B2 (en) 2014-12-11 2017-10-17 Covidien Lp Antimicrobial coatings for medical devices and processes for preparing such coatings
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
TWI649193B (zh) 2017-12-07 2019-02-01 財團法人工業技術研究院 陶瓷元件及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1517341A (en) * 1975-01-02 1978-07-12 Day Specialties Coating solutions for dielectric materials
LU72932A1 (es) * 1975-07-08 1977-03-18
JPS60260393A (ja) * 1984-06-08 1985-12-23 Semiconductor Energy Lab Co Ltd 微細パターンの光加工方法
US4859496A (en) * 1986-09-02 1989-08-22 Matsushita Electric Industrial Co., Ltd. Method of producing an electrically-conductive transparent film
GB8630791D0 (en) * 1986-12-23 1987-02-04 Glaverbel Coating glass
DE3705639A1 (de) * 1987-02-21 1988-09-01 Philips Patentverwaltung Duennschicht-heizelement
DE4010244A1 (de) * 1990-03-30 1991-10-02 Manfred Mader Verfahren zum herstellen von leiterbilder auf leiterplatten
JPH05196949A (ja) * 1992-06-26 1993-08-06 Semiconductor Energy Lab Co Ltd 微細パターンの光加工方法
US5397920A (en) * 1994-03-24 1995-03-14 Minnesota Mining And Manufacturing Company Light transmissive, electrically-conductive, oxide film and methods of production

Also Published As

Publication number Publication date
JPH10501104A (ja) 1998-01-27
EP0793903B1 (de) 1998-03-25
DE19535068C2 (de) 1997-08-21
JP2931413B2 (ja) 1999-08-09
DK0793903T3 (da) 1998-11-30
EP0793903A1 (de) 1997-09-10
WO1997011589A1 (de) 1997-03-27
US5955179A (en) 1999-09-21
KR100268122B1 (ko) 2000-10-16
KR970707707A (ko) 1997-12-01
ATE164483T1 (de) 1998-04-15
CN1108088C (zh) 2003-05-07
DE59600129D1 (de) 1998-04-30
CN1165609A (zh) 1997-11-19
DE19535068A1 (de) 1997-03-27

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