ES2125393T3 - Procedimiento y dispositivo de fabricacion de tarjetas de memoria. - Google Patents

Procedimiento y dispositivo de fabricacion de tarjetas de memoria.

Info

Publication number
ES2125393T3
ES2125393T3 ES94200273T ES94200273T ES2125393T3 ES 2125393 T3 ES2125393 T3 ES 2125393T3 ES 94200273 T ES94200273 T ES 94200273T ES 94200273 T ES94200273 T ES 94200273T ES 2125393 T3 ES2125393 T3 ES 2125393T3
Authority
ES
Spain
Prior art keywords
sides
card
manufacture
main
thermoplastic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94200273T
Other languages
English (en)
Inventor
Rene Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger SA filed Critical Schlumberger SA
Application granted granted Critical
Publication of ES2125393T3 publication Critical patent/ES2125393T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PROCESO PARA LA FABRICACION DE UNA TARJETA DE MEMORIA ELECTRONICA QUE COMPRENDE: A) UN CUERPO DE TARJETA (12) REALIZADA EN UN MATERIAL TERMOPLASTICO Y QUE PRESENTA DOS CARAS LATERALES SENSIBLEMENTE PARALELAS ENTRE SI: B) UN ELEMENTO-SOPORTE QUE COMPRENDE UN GRAFISMO SOBRE UNA DE SUS CARAS AL MENOS; C) UN MODULO ELECTRONICO QUE COMPRENDE UNA ZONA DE CONTACTOS SOBRE UNA DE LAS CARAS DE LA CUAL ESTA FIJADA UNA PLAQUITA QUE COMPRENDE UN CIRCUITO INTEGRADO, CARACTERIZADO POR LA SIGUIENTES ETAPAS: EN UN MOLDE PROVISTO DE UNA IMPRONTA QUE DEFINE LA FORMA DE DICHA TARJETA Y LIMITADA POR DOS PAREDES PRINCIPALES QUE CORRESPONDEN A LAS CARAS PRINCIPALES DE DICHA TARJETA, SE DISPONE Y SE MANTIENE DICHO ELEMENTO DE SOPORTE CONTRA UNA PRIMERA PARED PRINCIPAL DEL MOLDE; ICHA IMPRONTA, UN MATERIAL TERMOPLASTICO LLAMADO A LLENAR DICHO VOLUMEN NO OCUPADO POR DICHO ELEMENTO DE SOPORTE; Y CA DICHO MODULO ELECTRONICO EN EL INTERIOR DE LA IMPRONTA HASTA UNA POSICION ADECUADA DE DICHO MODULO, ANTES DE QUE DICHO MATERIAL INYECTADO SE HAYA SOLIDIFICADO COMPLETAMENTE.
ES94200273T 1993-02-23 1994-02-02 Procedimiento y dispositivo de fabricacion de tarjetas de memoria. Expired - Lifetime ES2125393T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9302059A FR2702067B1 (fr) 1993-02-23 1993-02-23 Procédé et dispositif de fabrication de cartes à mémoire.

Publications (1)

Publication Number Publication Date
ES2125393T3 true ES2125393T3 (es) 1999-03-01

Family

ID=9444338

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94200273T Expired - Lifetime ES2125393T3 (es) 1993-02-23 1994-02-02 Procedimiento y dispositivo de fabricacion de tarjetas de memoria.

Country Status (6)

Country Link
US (1) US5510074A (es)
EP (1) EP0618548B1 (es)
JP (1) JPH06270580A (es)
DE (1) DE69414292T2 (es)
ES (1) ES2125393T3 (es)
FR (1) FR2702067B1 (es)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US6306348B1 (en) * 1993-11-01 2001-10-23 Nanogen, Inc. Inorganic permeation layer for micro-electric device
WO1995019251A1 (en) * 1994-01-13 1995-07-20 Citizen Watch Co., Ltd. Method of resin-sealing semiconductor devices
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US5762853A (en) * 1996-04-01 1998-06-09 Morton International, Inc. Method of encapsulating a sensor into a panel body
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
WO1998052772A1 (en) * 1997-05-19 1998-11-26 Hitachi Maxell, Ltd. Flexible ic module and method of its manufacture, and method of manufacturing information carrier comprising flexible ic module
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
DE19749243C1 (de) 1997-11-07 1998-11-19 Richard Herbst Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse
US6154947A (en) * 1998-02-17 2000-12-05 Eger Products, Inc. Method for manufacturing a cover for a connector bar and the cover
CN1105033C (zh) * 1998-03-10 2003-04-09 德拉鲁国际有限公司 制造安全物品的方法和安全物品
US6256873B1 (en) * 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6241153B1 (en) * 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6145035A (en) * 1999-02-25 2000-11-07 Dallas Semiconductor Corporation Card cradle system and method
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
JP5181157B2 (ja) * 1999-09-30 2013-04-10 ハミダ・フォー・ライフ・ベスローテン・フェンノートシャップ マイクロエレクトロニックアレイ上の生体分子付着部位
US6524517B1 (en) 1999-12-15 2003-02-25 Nanogen, Inc. Methods for molding and grafting highly uniform polymer layers onto electronic microchips
US6303082B1 (en) * 1999-12-15 2001-10-16 Nanogen, Inc. Permeation layer attachment chemistry and method
DE10109993A1 (de) * 2001-03-01 2002-09-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Moduls
US6960298B2 (en) 2001-12-10 2005-11-01 Nanogen, Inc. Mesoporous permeation layers for use on active electronic matrix devices
US7037455B2 (en) * 2001-12-21 2006-05-02 Mattel, Inc. Insert molding method
EP1369815A1 (en) * 2002-06-03 2003-12-10 Dialog Semiconductor GmbH Battery pack with electronics assembly
US20030177051A1 (en) * 2003-03-13 2003-09-18 Robin Driscoll Method and system for managing worker resources
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
WO2006101493A1 (en) * 2005-03-23 2006-09-28 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
FR2895547B1 (fr) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
EP2013821B1 (en) * 2006-04-10 2011-10-12 Innovatier, Inc. An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US7687103B2 (en) * 2006-08-31 2010-03-30 Gamida For Life B.V. Compositions and methods for preserving permeation layers for use on active electronic matrix devices
US7736568B2 (en) 2006-09-19 2010-06-15 Mattel, Inc. Systems and methods of incorporating preformed items into a molded article
CA2681665A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. A step card and method for making a step card
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
EP2556732B1 (en) 2010-04-05 2019-01-02 Innovatier, Inc. A pre-lamination core and method for making a pre-lamination core for electronic cards and tags
JP5418684B2 (ja) * 2011-03-08 2014-02-19 トヨタ自動車株式会社 繊維強化樹脂材の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3320345A (en) * 1965-02-15 1967-05-16 Howmet Corp Method for the production of cored patterns
DE3130206A1 (de) * 1981-07-30 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Tragbare karte zur informationsverarbeitung
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
US4810444A (en) * 1987-06-08 1989-03-07 The Dow Chemical Company Method for making mat-molded rim parts
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
KR900702481A (ko) * 1988-06-21 1990-12-07 원본미기재 휴대용 전자 토큰 제조방법
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
JPH05228970A (ja) * 1992-02-21 1993-09-07 Sony Corp 射出圧縮成形法、これに用いる射出成形金型及び射出圧縮成形機

Also Published As

Publication number Publication date
EP0618548B1 (fr) 1998-11-04
EP0618548A1 (fr) 1994-10-05
US5510074A (en) 1996-04-23
DE69414292T2 (de) 1999-06-17
FR2702067A1 (fr) 1994-09-02
FR2702067B1 (fr) 1995-04-14
DE69414292D1 (de) 1998-12-10
JPH06270580A (ja) 1994-09-27

Similar Documents

Publication Publication Date Title
ES2125393T3 (es) Procedimiento y dispositivo de fabricacion de tarjetas de memoria.
ES297137U (es) Tarjeta de memoria electronica
ES2148721T3 (es) Distribuidor de jabon colapsable.
ES2049831T3 (es) Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento.
EP0308226A3 (en) Soft contact lens hydration device and kit
ES2098147T3 (es) Aparato de mando adosado.
ES2119186T3 (es) Sistema para limpiar un equipo de moldeo usando un laser.
ES2063935T5 (es) Procedimiento para la fabricacion de una tarjeta con circuito impreso.
ES2047877T3 (es) Procedimiento de realizacion de un cuerpo de tarjeta y tarjetas de grafismo; y cuerpo de tarjeta asi obtenido.
ATE192883T1 (de) Elektronikmodul in flachbauweise und chipkarte
JPH0920093A5 (es)
ES2181201T3 (es) Procedimiento que permite insertar una etiqueta electronica delgada, de cara plana, en la pared de un objeto realizado por transformacion plastica.
ES2030751T3 (es) Procedimiento de realizacion de una tarjeta de memoria electronica.
ES2109931T3 (es) Dispositivo semiconductor forrado de material plastico y procedimiento para la realizacion del mismo
ES2031258T3 (es) Tarjeta de microcircuitos electronicos y su procedimiento de fabricacion.
ES2171424T3 (es) Modulo electronico para tarjetas y fabricacion del mismo.
MX166030B (es) Mejoras en moldura de ornato con marcas tridimensionales y metodo para elaborarla
EP0213764A3 (en) Preparation of fragile sheet-like devices, such as lead frames
SG127716A1 (en) Mold die and method for manufacturing semiconductor device using the same
AR030928A1 (es) Dado capaz de ser abierto, metodo de fabricacion del mismo y molde
ES2094743T3 (es) Procedimiento y dispositivo para producir bloques de tierra.
MY126676A (en) Molding system for semiconductor packages
FR2747841B1 (fr) Procede de fabrication d'elements semi-conducteurs presentant des structures micromecaniques
ES2187688T3 (es) Procedimiento de realizacion de tarjetas con memoria.
IT939762B (it) Procedimento e dispositivo per la fabbricazione di recipienti in mate riale plastico recanti motivi stam pati

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 618548

Country of ref document: ES