ES2049831T3 - Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento. - Google Patents
Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento.Info
- Publication number
- ES2049831T3 ES2049831T3 ES89401173T ES89401173T ES2049831T3 ES 2049831 T3 ES2049831 T3 ES 2049831T3 ES 89401173 T ES89401173 T ES 89401173T ES 89401173 T ES89401173 T ES 89401173T ES 2049831 T3 ES2049831 T3 ES 2049831T3
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- cards
- carrying
- electronic memory
- out mainly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Instructional Devices (AREA)
Abstract
EL INVENTO SE REFIERE A LA REALIZACION DE UN MAPA CON MEMORIA ELECTRONICA POR MOLDEADO DEL CUERPO DEL MAPA SOBRE EL MODULO ELECTRONICO. PARA MANTENER EN SITUACION EL MODULO ELECTRONICO (32) EN EL MOLDE (50, 52), EL MODULO ESTA FIJADO SOBRE UNA PELICULA SOPORTE (12) AJUSTADO ENTRE LAS DOS PARTES (50, 52) DEL MOLDE. LA PELICULA 12 PUEDE IGUALMENTE INCLUIR ELEMENTOS DE IMPRESION (16) PARA REALIZAR UN GRAFISMO SOBRE UN LADO DEL CUERPO DEL MAPA.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8805671A FR2630843B1 (fr) | 1988-04-28 | 1988-04-28 | Procede de realisation de cartes comportant des elements graphiques et cartes obtenues par ledit procede |
| FR8812088A FR2636755B1 (fr) | 1988-09-16 | 1988-09-16 | Procede de realisation de cartes a memoire et cartes obtenues par ledit procede |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2049831T3 true ES2049831T3 (es) | 1994-05-01 |
Family
ID=26226631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES89401173T Expired - Lifetime ES2049831T3 (es) | 1988-04-28 | 1989-04-25 | Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento. |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US4961893A (es) |
| EP (2) | EP0340100B1 (es) |
| JP (2) | JP2812485B2 (es) |
| DE (1) | DE68911738T2 (es) |
| ES (1) | ES2049831T3 (es) |
Families Citing this family (89)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5387306A (en) * | 1988-06-21 | 1995-02-07 | Gec Avery Limited | Manufacturing integrated circuit cards |
| JPH0767874B2 (ja) * | 1989-03-31 | 1995-07-26 | リズム時計工業株式会社 | Icカードの製造方法 |
| US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
| FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
| US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
| FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
| DE3926578C1 (es) * | 1989-08-11 | 1990-07-26 | Leonhard Kurz Gmbh & Co, 8510 Fuerth, De | |
| DE3929299A1 (de) * | 1989-08-11 | 1991-02-14 | Kurz Leonhard Fa | Verfahren zur herstellung von karten |
| JP2602343B2 (ja) * | 1990-05-07 | 1997-04-23 | 三菱電機株式会社 | Icカード |
| JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
| US5367766A (en) * | 1990-08-01 | 1994-11-29 | Staktek Corporation | Ultra high density integrated circuit packages method |
| US5377077A (en) * | 1990-08-01 | 1994-12-27 | Staktek Corporation | Ultra high density integrated circuit packages method and apparatus |
| EP0509065A1 (en) * | 1990-08-01 | 1992-10-21 | Staktek Corporation | Ultra high density integrated circuit packages, method and apparatus |
| US5475920A (en) * | 1990-08-01 | 1995-12-19 | Burns; Carmen D. | Method of assembling ultra high density integrated circuit packages |
| US5446620A (en) * | 1990-08-01 | 1995-08-29 | Staktek Corporation | Ultra high density integrated circuit packages |
| FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
| DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
| FR2673017A1 (fr) * | 1991-02-18 | 1992-08-21 | Schlumberger Ind Sa | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
| US5681356A (en) * | 1991-05-10 | 1997-10-28 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method and apparatus for producing a plastic molded chip card having reduced wall thickness |
| JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
| US5702985A (en) * | 1992-06-26 | 1997-12-30 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method |
| JP2774906B2 (ja) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | 薄形半導体装置及びその製造方法 |
| FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
| FR2704961A1 (fr) * | 1993-05-04 | 1994-11-10 | Schlumberger Ind Sa | Procédé de fabrication de cartes à mémoire. |
| DE59404205D1 (de) * | 1993-10-26 | 1997-11-06 | Siemens Ag | Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen |
| WO1995019251A1 (en) * | 1994-01-13 | 1995-07-20 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor devices |
| US5626339A (en) * | 1994-02-03 | 1997-05-06 | Huffy Corporation | Structural foam basketball backboard with inmold graphics |
| US5916047A (en) * | 1994-02-03 | 1999-06-29 | Huffy Corporation | Portable basketball goal support system with separate ballast tank |
| US5980400A (en) * | 1994-02-03 | 1999-11-09 | Huffy Corporation | Compression molded basketball components with inmold graphics |
| JP3442877B2 (ja) * | 1994-02-21 | 2003-09-02 | 富士通株式会社 | 樹脂成形品及びその製造方法 |
| DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
| US5475919B1 (en) * | 1994-10-07 | 2000-10-17 | Three View Technology Co Ltd | Pcmcia card manufacturing process |
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| DE29502080U1 (de) * | 1995-02-09 | 1995-03-23 | Interlock Ag, Schlieren | Vorrichtung zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte |
| US5819394A (en) * | 1995-02-22 | 1998-10-13 | Transition Automation, Inc. | Method of making board matched nested support fixture |
| JP3337847B2 (ja) * | 1995-02-27 | 2002-10-28 | 株式会社東芝 | 電子部品内蔵カードの製造方法 |
| DE19519901C2 (de) * | 1995-05-31 | 1998-06-18 | Richard Herbst | Verfahren zum taktweisen Spritzgießen von Gegenständen aus Kunststoff und Halbzeug zur Verwendung bei diesem Verfahren |
| DE19519899A1 (de) * | 1995-05-31 | 1996-12-12 | Richard Herbst | Verfahren und Vorrichtung zum Herstellen einer Smart Card |
| FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
| US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
| GB9520072D0 (en) * | 1995-10-02 | 1995-12-06 | Dewhurst Plc | Indicators and push-button members and method of forming the same |
| US5632408A (en) * | 1995-11-21 | 1997-05-27 | Mitchell; Jerry B. | Apparatus for securing and dispensing currency |
| AU1028897A (en) * | 1995-12-22 | 1997-07-17 | Sempac Sa | Process for producing a chip card for contactless operation |
| DE19607212C1 (de) * | 1996-02-26 | 1997-04-10 | Richard Herbst | Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen |
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| US11034068B2 (en) | 2018-04-30 | 2021-06-15 | Raytheon Company | Encapsulating electronics in high-performance thermoplastics |
| US12440910B2 (en) | 2019-07-18 | 2025-10-14 | Transition Automation, Inc. | Paste retainer systems and methods for use in paste printing systems |
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| CN110696275B (zh) * | 2019-10-31 | 2022-06-21 | 奇点新源国际技术开发(北京)有限公司 | 一种线缆节点的塑封方法 |
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| JPS6442295A (en) * | 1987-08-10 | 1989-02-14 | Seiko Epson Corp | Memory card mounting structure |
| JPH01159295A (ja) * | 1987-12-16 | 1989-06-22 | Dainippon Printing Co Ltd | Icカード用カード基材の製造方法 |
| US4812633A (en) * | 1988-04-08 | 1989-03-14 | Minnesota Mining And Manufacturing Company | Optical data card |
-
1989
- 1989-04-21 US US07/341,182 patent/US4961893A/en not_active Expired - Lifetime
- 1989-04-21 US US07/341,183 patent/US5030407A/en not_active Expired - Lifetime
- 1989-04-25 EP EP89401173A patent/EP0340100B1/fr not_active Revoked
- 1989-04-25 EP EP89401172A patent/EP0340099A1/fr not_active Ceased
- 1989-04-25 ES ES89401173T patent/ES2049831T3/es not_active Expired - Lifetime
- 1989-04-25 DE DE89401173T patent/DE68911738T2/de not_active Revoked
- 1989-04-28 JP JP1111934A patent/JP2812485B2/ja not_active Expired - Fee Related
- 1989-04-28 JP JP1111933A patent/JPH0238099A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0340099A1 (fr) | 1989-11-02 |
| DE68911738T2 (de) | 1994-05-05 |
| US4961893A (en) | 1990-10-09 |
| JPH0238099A (ja) | 1990-02-07 |
| EP0340100B1 (fr) | 1993-12-29 |
| JP2812485B2 (ja) | 1998-10-22 |
| US5030407A (en) | 1991-07-09 |
| EP0340100A1 (fr) | 1989-11-02 |
| JPH0224197A (ja) | 1990-01-26 |
| DE68911738D1 (de) | 1994-02-10 |
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