ES2130513T3 - Metodo para encapsular un componente electronico con un plastico endurecible. - Google Patents

Metodo para encapsular un componente electronico con un plastico endurecible.

Info

Publication number
ES2130513T3
ES2130513T3 ES95200178T ES95200178T ES2130513T3 ES 2130513 T3 ES2130513 T3 ES 2130513T3 ES 95200178 T ES95200178 T ES 95200178T ES 95200178 T ES95200178 T ES 95200178T ES 2130513 T3 ES2130513 T3 ES 2130513T3
Authority
ES
Spain
Prior art keywords
component
plastic
film
encapsulating
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95200178T
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3P Licensing BV
Original Assignee
3P Licensing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing BV filed Critical 3P Licensing BV
Application granted granted Critical
Publication of ES2130513T3 publication Critical patent/ES2130513T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Packaging Frangible Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

EN LA INVENCION SE PRESENTA UN METODO PARA ENCAPSULAR UN COMPONENTE ELECTRONICO (1), EN PARTICULAR UN CIRCUITO INTEGRADO, CON UN PLASTICO DE ENDURECIMIENTO (20), SEGUN EL CUAL EL COMPONENTE (1) SE COLOCA EN LA CAVIDAD (7) DE UN MOLDE SEPARABLE (5) Y ANTES DE LA INYECCION DE UN MATERIAL EN DICHA CAVIDAD SE COLOCA UNA PELICULA (10) QUE SE PUEDA RETIRAR DE LAS PAREDES DE LA CAVIDAD ENTRE EL COMPONENTE (1) Y DICHAS PAREDES, Y EL PLASTICO (20) SE INYECTA EN EL ESPACIO (7) QUE QUEDA ENTRE EL COMPONENTE (1) Y LA PELICULA (10), EN DONDE SE UTILIZA UNA PELICULA (10) QUE TIENE EN EL LADO QUE MIRA HACIA EL COMPONENTE (1) UN MATERIAL QUE SE ADHIERE MEJOR AL PLASTICO INYECTADO TODAVIA CALIENTE (20) QUE RODEA AL COMPONENTE (1) QUE A LA PELICULA (10), Y POR TANTO PERMANECE ADHERIDA A LA CUBIERTA DE PLASTICO (20) CUANDO ESTA SE RETIRA DEL MOLDE (5) TRAS LA REFRIGERACION.
ES95200178T 1994-01-27 1995-01-25 Metodo para encapsular un componente electronico con un plastico endurecible. Expired - Lifetime ES2130513T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9400119A NL9400119A (nl) 1994-01-27 1994-01-27 Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.

Publications (1)

Publication Number Publication Date
ES2130513T3 true ES2130513T3 (es) 1999-07-01

Family

ID=19863746

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95200178T Expired - Lifetime ES2130513T3 (es) 1994-01-27 1995-01-25 Metodo para encapsular un componente electronico con un plastico endurecible.

Country Status (11)

Country Link
EP (1) EP0665584B1 (es)
JP (2) JP3169315B2 (es)
KR (2) KR100327500B1 (es)
AT (1) ATE178737T1 (es)
DE (1) DE69508815T2 (es)
ES (1) ES2130513T3 (es)
MY (2) MY131118A (es)
NL (1) NL9400119A (es)
RU (1) RU2139597C1 (es)
SG (1) SG55005A1 (es)
TW (1) TW257737B (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW302527B (es) * 1994-11-17 1997-04-11 Hitachi Ltd
DE69501632T2 (de) * 1994-11-21 1998-07-23 Apic Yamada Corp Harzformmaschine mit Trennfolie
MY114536A (en) * 1994-11-24 2002-11-30 Apic Yamada Corp A resin molding machine and a method of resin molding
JP3246848B2 (ja) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 汎用ゲート位置樹脂モールド装置および樹脂モールド方法
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
NL1000777C2 (nl) * 1995-07-11 1997-01-14 3P Licensing Bv Werkwijze voor het inkapselen van een elektronische component, elektronische component geschikt te worden toegepast bij het uitvoeren van deze werkwijze en ingekapselde component verkregen onder toepassing der werkwijze.
EP0759349B1 (en) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatic molding machine using release film
MY114454A (en) * 1996-03-14 2002-10-31 Towa Corp Method of sealing electronic component with molded resin
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017470B2 (ja) 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017485B2 (ja) 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
TW421833B (en) 1998-07-10 2001-02-11 Apic Yamada Corp Method of manufacturing semiconductor devices and resin molding machine
NL1011392C2 (nl) * 1999-02-25 2000-08-28 3P Licensing Bv Inrichting voor het omhullen van elektronische componenten en daarvoor bestemde matrijs.
JP3581814B2 (ja) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂封止装置
RU2202842C2 (ru) * 2000-06-02 2003-04-20 Северо-Осетинский государственный университет им. К.Л.Хетагурова Композиция для защиты бескорпусных высоковольтных полупроводниковых приборов
DE10108253C1 (de) * 2001-02-21 2002-07-11 Bayern Chemie Gmbh Flugchemie Verfahren zur Herstellung von aus fliessfähigem Material bestehenden Gegenständen
US6567630B1 (en) 2002-02-01 2003-05-20 Toshiba Tec Kabushiki Kaisha Image forming device
BE1014855A5 (nl) * 2002-05-30 2004-05-04 Sol Spa Het vormgeven in een omhulling.
JP4540415B2 (ja) * 2004-07-16 2010-09-08 パナソニック株式会社 音響整合部材の製造方法
US20090035501A1 (en) * 2005-12-29 2009-02-05 Neil Edwin Wallace Composite product
TWI502653B (zh) * 2008-11-17 2015-10-01 先進封裝技術私人有限公司 半導體晶片封裝方法
EP2373479B1 (en) 2008-12-18 2018-05-16 Novartis AG Mold and method for manufacturing an ophtalmic lens
JP5119221B2 (ja) * 2009-08-31 2013-01-16 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
NL2007614C2 (nl) 2011-10-18 2013-04-22 Fico Bv Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten.
US9734304B2 (en) 2011-12-02 2017-08-15 Lumiradx Uk Ltd Versatile sensors with data fusion functionality
US9700222B2 (en) * 2011-12-02 2017-07-11 Lumiradx Uk Ltd Health-monitor patch
DE102012109144A1 (de) * 2012-09-27 2014-04-17 Osram Opto Semiconductors Gmbh Bauteilanordnung und Verfahren zum Herstellen von optischen Bauteilen
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
NL2011512C2 (en) * 2013-09-26 2015-03-30 Besi Netherlands B V Method for moulding and surface processing electronic components and electronic component produced with this method.
US9640743B2 (en) * 2014-09-29 2017-05-02 Nichia Corporation Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
US11292166B2 (en) 2017-04-07 2022-04-05 Tactotek Oy Method for manufacturing an electronic assembly and an electronic assembly
AU2018267560B2 (en) * 2017-11-20 2024-09-05 Coexpair S.A. Improvements in or relating to resin supply systems
US11318642B2 (en) 2019-12-20 2022-05-03 Eaton Intelligent Power Limited Permeable wall encapsulation mold
CN114434751B (zh) * 2022-03-18 2024-07-16 珠海格力精密模具有限公司 仿生透气装置及注塑模具
CN117719137B (zh) * 2024-02-06 2024-05-03 河南君源塑业有限公司 聚氯乙烯板材加工用挤压成型装置及其成型工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
JPS63250846A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd 面付実装用ｌｓｉプラスチツクパツケ−ジとその製造方法
JPS6444056A (en) * 1987-08-11 1989-02-16 Nec Corp Hybrid integrated circuit
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
ATE100616T1 (de) * 1988-06-21 1994-02-15 Gec Avery Ltd Herstellung von tragbaren elektronischen karten.
SE466051B (sv) * 1990-01-11 1991-12-09 Swerad Heat Radiating Concrete Gjutform foer gjutning av ett haerdbart material
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
US5169586A (en) * 1990-05-21 1992-12-08 Nec Corporation Method of manufacturing resin-sealed type semiconductor device

Also Published As

Publication number Publication date
SG55005A1 (en) 1998-12-21
HK1006124A1 (en) 1999-02-12
JPH07283260A (ja) 1995-10-27
EP0665584B1 (en) 1999-04-07
KR950034712A (ko) 1995-12-28
MY118471A (en) 2004-11-30
RU95101033A (ru) 1996-10-27
JP2001260149A (ja) 2001-09-25
NL9400119A (nl) 1995-09-01
KR100336873B1 (ko) 2002-05-15
MY131118A (en) 2007-07-31
ATE178737T1 (de) 1999-04-15
JP3169315B2 (ja) 2001-05-21
EP0665584A1 (en) 1995-08-02
DE69508815D1 (de) 1999-05-12
DE69508815T2 (de) 1999-11-11
RU2139597C1 (ru) 1999-10-10
TW257737B (es) 1995-09-21
KR100327500B1 (ko) 2002-08-08

Similar Documents

Publication Publication Date Title
MY131118A (en) Method for encasing an electronic component with a hardening plastic
MX166392B (es) Proceso para moldear por inyeccion y articulo de plastico hueco, producido por el mismo
MX9305325A (es) Metodo para modelar un articulo.
AR247505A1 (es) Metodo y aparato para la produccion de lentes plasticas y composicion polimerizable que las forman
BR9809395A (pt) Processo e dispositivo de fabricacão de um recipiente equipado com uma etiqueta
BR9908923A (pt) Aparelho e processo para a laminação em molde por compressão e/ou injeção e formação de orla de um material decorativo com um material de suporte
BR9806814A (pt) Processo e máquina para moldagem de um objeto agrupado
AR016564A1 (es) CONJUNTO INTEGRAL DE CHAPoN Y CRUCETA PARA UN VEHíCULO
ES541469A0 (es) Procedimiento y dispositivo para fabricar piezas moldeadas por inyeccion
SE9403573L (sv) Sprutning av kapsel på optokomponent
ES8308255A1 (es) "un metodo de formar un recipiente hecho de resina sintetica".
EP1391285A4 (en) RESIN ELEMENT MOLDING METHOD AND INJECTION MOLDING DEVICE
KR920014592A (ko) 열가소성수지성형품의 사출성형법 및 사출성형용금형
GB0024070D0 (en) Mpulding apparatus and method
ES2184945T3 (es) Aparato y metodo para sellar una conexion electrica a una lamina transparente laminada.
ES2050781T3 (es) Procedimiento para reducir el tiempo del ciclo en el moldeo.
ATE233171T1 (de) Gussverfahren mit einsetzbarer libelle, beispielsweise für eine wasserwaage, sowie geformter gegenstand
ES2034585T5 (es) Metodo y aparato para montar un suplemento en un cuerpo hueco.
ES2186171T3 (es) Tarjeta moldeada por inyeccion con capa decorativa.
DE3371263D1 (en) Method and system for encapsulating electronic components into plastic material
BR0101862A (pt) Processo para fabricação de uma caixa para umconector de válvula de borboleta bem comoconector de válvula de borboleta
AR022114A1 (es) Aparato compacto para moldeo
MX9600185A (es) Proceso para encapsular un componente electronico, un componente electronico encapsulado asi y material encapsulado preparado para ello.
DE60304105D1 (de) Transponder in Kunststofftragebehälter
ATE279281T1 (de) Giessform, umfassend aussenformteile und darin eingelegte formstoffkerne

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 665584

Country of ref document: ES