SE9403573L - Sprutning av kapsel på optokomponent - Google Patents

Sprutning av kapsel på optokomponent

Info

Publication number
SE9403573L
SE9403573L SE9403573A SE9403573A SE9403573L SE 9403573 L SE9403573 L SE 9403573L SE 9403573 A SE9403573 A SE 9403573A SE 9403573 A SE9403573 A SE 9403573A SE 9403573 L SE9403573 L SE 9403573L
Authority
SE
Sweden
Prior art keywords
optocomponent
mold
cavity
guide pins
encapsulated
Prior art date
Application number
SE9403573A
Other languages
English (en)
Other versions
SE9403573D0 (sv
SE514116C2 (sv
Inventor
Odd Steijer
Hans-Christer Moll
Paul Eriksen
Jan-Aake Engstrand
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9403573A priority Critical patent/SE514116C2/sv
Publication of SE9403573D0 publication Critical patent/SE9403573D0/sv
Priority to JP8513829A priority patent/JPH10507847A/ja
Priority to CN95196850A priority patent/CN1107983C/zh
Priority to KR1019970702566A priority patent/KR100309406B1/ko
Priority to CA002203114A priority patent/CA2203114C/en
Priority to EP95936159A priority patent/EP0792526B1/en
Priority to ES95936159T priority patent/ES2160719T3/es
Priority to PCT/SE1995/001232 priority patent/WO1996013068A1/en
Priority to AU38199/95A priority patent/AU3819995A/en
Priority to US08/817,420 priority patent/US5970323A/en
Priority to DE69522116T priority patent/DE69522116T2/de
Publication of SE9403573L publication Critical patent/SE9403573L/sv
Priority to FI971657A priority patent/FI971657A7/sv
Priority to US09/369,252 priority patent/US6193493B1/en
Priority to US09/369,321 priority patent/US6326680B1/en
Publication of SE514116C2 publication Critical patent/SE514116C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Light Receiving Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SE9403573A 1994-10-19 1994-10-19 Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform SE514116C2 (sv)

Priority Applications (14)

Application Number Priority Date Filing Date Title
SE9403573A SE514116C2 (sv) 1994-10-19 1994-10-19 Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
DE69522116T DE69522116T2 (de) 1994-10-19 1995-10-19 Einspritzung von einkapselungsmaterial auf ein optoelektronisches bauelement
ES95936159T ES2160719T3 (es) 1994-10-19 1995-10-19 Inyeccion de un material de encapsulado sobre un componente optoelectronico.
AU38199/95A AU3819995A (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent
KR1019970702566A KR100309406B1 (ko) 1994-10-19 1995-10-19 옵토컴포넌트상의캡슐화재료의사출방법및장치
CA002203114A CA2203114C (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent
EP95936159A EP0792526B1 (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent
JP8513829A JPH10507847A (ja) 1994-10-19 1995-10-19 オプトコンポーネント上へのカプセル封止材の射出
PCT/SE1995/001232 WO1996013068A1 (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent
CN95196850A CN1107983C (zh) 1994-10-19 1995-10-19 制作一种封装了的光学部件的方法及模具
US08/817,420 US5970323A (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent
FI971657A FI971657A7 (sv) 1994-10-19 1997-04-18 Sprutning av inkapslingsmaterial på en optokomponent
US09/369,252 US6193493B1 (en) 1994-10-19 1999-08-06 Injection of encapsulating material on an optocomponent
US09/369,321 US6326680B1 (en) 1994-10-19 1999-08-06 Injection of encapsulating material on a optocomponent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403573A SE514116C2 (sv) 1994-10-19 1994-10-19 Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform

Publications (3)

Publication Number Publication Date
SE9403573D0 SE9403573D0 (sv) 1994-10-19
SE9403573L true SE9403573L (sv) 1996-04-20
SE514116C2 SE514116C2 (sv) 2001-01-08

Family

ID=20395667

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403573A SE514116C2 (sv) 1994-10-19 1994-10-19 Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform

Country Status (12)

Country Link
US (3) US5970323A (sv)
EP (1) EP0792526B1 (sv)
JP (1) JPH10507847A (sv)
KR (1) KR100309406B1 (sv)
CN (1) CN1107983C (sv)
AU (1) AU3819995A (sv)
CA (1) CA2203114C (sv)
DE (1) DE69522116T2 (sv)
ES (1) ES2160719T3 (sv)
FI (1) FI971657A7 (sv)
SE (1) SE514116C2 (sv)
WO (1) WO1996013068A1 (sv)

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SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE516160C2 (sv) 1995-04-28 2001-11-26 Ericsson Telefon Ab L M Kapslad optoelektronisk komponent
SE510365C2 (sv) 1996-05-03 1999-05-17 Ericsson Telefon Ab L M Förfarande för framställning av ett opto-mekaniskt don samt sådant don
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DE19920638C2 (de) * 1999-04-29 2001-09-13 Infineon Technologies Ag Modul zur parallelen optischen Datenübertragung
US6576496B1 (en) * 2000-08-21 2003-06-10 Micron Technology, Inc. Method and apparatus for encapsulating a multi-chip substrate array
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
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US7275925B2 (en) * 2001-08-30 2007-10-02 Micron Technology, Inc. Apparatus for stereolithographic processing of components and assemblies
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window
EP1759412B1 (de) * 2004-06-25 2011-11-30 Conti Temic microelectronic GmbH Elektrische baugruppe mit einer schutzhülle
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
DE102007008464B4 (de) * 2007-02-19 2012-01-05 Hottinger Baldwin Messtechnik Gmbh Optischer Dehnungsmessstreifen
CA2719033C (en) * 2007-12-07 2014-07-08 Zimmer Orthopaedic Surgical Products, Inc. Spacer mold and methods therefor
CN101909840B (zh) * 2007-12-28 2013-08-07 柯尼卡美能达精密光学株式会社 成型模具及光学元件成型方法
US7943434B2 (en) * 2008-03-21 2011-05-17 Occam Portfolio Llc Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
US20090250836A1 (en) * 2008-04-04 2009-10-08 Toko, Inc. Production Method for Molded Coil
CA2742050C (en) 2008-10-29 2014-11-25 Scott M. Sporer Spacer molds with releasable securement
EP2192825A1 (en) * 2008-11-26 2010-06-02 Osram Gesellschaft mit Beschränkter Haftung An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process
CN102230991B (zh) * 2009-10-23 2013-01-09 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
CN102935693A (zh) * 2012-11-08 2013-02-20 凡嘉科技（无锡）有限公司 插针连接器模具结构
US9269597B2 (en) * 2013-01-23 2016-02-23 Microchip Technology Incorporated Open cavity plastic package
CN105286395A (zh) * 2013-08-29 2016-02-03 郑永如 带弹簧的竹凉席及其制造方法
JP2019060978A (ja) * 2017-09-25 2019-04-18 株式会社エンプラス 光レセプタクルの製造方法およびそれに用いる金型
CN110716269B (zh) * 2019-09-20 2021-10-29 武汉电信器件有限公司 一种可采用液体浸没式制冷的光模块及其制作方法
KR102239264B1 (ko) * 2020-07-28 2021-04-14 주식회사 제일금형 고무 가류제품의 사출 금형장치 및 제품의 탈거 방법

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SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform

Also Published As

Publication number Publication date
ES2160719T3 (es) 2001-11-16
CN1170476A (zh) 1998-01-14
DE69522116T2 (de) 2001-11-22
SE9403573D0 (sv) 1994-10-19
DE69522116D1 (de) 2001-09-13
KR100309406B1 (ko) 2001-12-17
US5970323A (en) 1999-10-19
SE514116C2 (sv) 2001-01-08
FI971657A0 (sv) 1997-04-18
EP0792526B1 (en) 2001-08-08
CA2203114C (en) 2006-01-24
CN1107983C (zh) 2003-05-07
CA2203114A1 (en) 1996-05-02
US6193493B1 (en) 2001-02-27
JPH10507847A (ja) 1998-07-28
FI971657A7 (sv) 1997-06-19
EP0792526A1 (en) 1997-09-03
WO1996013068A1 (en) 1996-05-02
AU3819995A (en) 1996-05-15
US6326680B1 (en) 2001-12-04

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Legal Events

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NUG Patent has lapsed