ES2133662T3 - Proceso para encapsular un componente electronico y componente electronico asi encapsulado. - Google Patents

Proceso para encapsular un componente electronico y componente electronico asi encapsulado.

Info

Publication number
ES2133662T3
ES2133662T3 ES95203655T ES95203655T ES2133662T3 ES 2133662 T3 ES2133662 T3 ES 2133662T3 ES 95203655 T ES95203655 T ES 95203655T ES 95203655 T ES95203655 T ES 95203655T ES 2133662 T3 ES2133662 T3 ES 2133662T3
Authority
ES
Spain
Prior art keywords
electronic component
encapsulated
encapsulate
encapsulation material
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95203655T
Other languages
English (en)
Inventor
Ireneus J T M Pas
Johannes G L Nelissen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3P Licensing BV
Original Assignee
3P Licensing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing BV filed Critical 3P Licensing BV
Application granted granted Critical
Publication of ES2133662T3 publication Critical patent/ES2133662T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Sealing Material Composition (AREA)

Abstract

PROCESO PARA ENCAPSULAR UN COMPONENTE ELECTRONICO, EN PARTICULAR UN CIRCUITO INTEGRADO, CON UN MATERIAL DE ENCAPSULACION, QUE CONSISTE EN AL MENOS LOS PASOS SIGUIENTES: - SE COLOCA EL COMPONENTE A ENCAPSULAR EN LA CAVIDAD DE UN MOLDE; - SE INTRODUCE EL MATERIAL DE ENCAPSULACION A UNA TEMPERATURA ELEVADA EN LA CAVIDAD QUE HAY ENTRE EL MOLDE Y EL COMPONENTE A ENCAPSULAR; - SE ENDURECE EL MATERIAL DE ENCAPSULACION; Y - SE RETIRA EL COMPONENTE ENCAPSULADO DE LA CAVIDAD, EN DONDE EL MATERIAL DE ENCAPSULACION UTILIZADO CONTIENE DE UN 40 A UN 65 % EN PESO DE UN TERMOPLASTICO DE INGENIERIA Y DE UN 60 A UN 35 % EN PESO DE UN SOLVENTE REACTIVO.
ES95203655T 1994-12-29 1995-12-27 Proceso para encapsular un componente electronico y componente electronico asi encapsulado. Expired - Lifetime ES2133662T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.

Publications (1)

Publication Number Publication Date
ES2133662T3 true ES2133662T3 (es) 1999-09-16

Family

ID=19865082

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95203655T Expired - Lifetime ES2133662T3 (es) 1994-12-29 1995-12-27 Proceso para encapsular un componente electronico y componente electronico asi encapsulado.

Country Status (14)

Country Link
US (1) US5895620A (es)
EP (1) EP0720901B1 (es)
JP (1) JP3126104B2 (es)
KR (1) KR960026681A (es)
AT (1) ATE180201T1 (es)
CA (1) CA2166043A1 (es)
DE (1) DE69509739T2 (es)
ES (1) ES2133662T3 (es)
MX (1) MX9600185A (es)
MY (1) MY131688A (es)
NL (1) NL9402233A (es)
RU (1) RU2151447C1 (es)
SG (1) SG35053A1 (es)
TW (1) TW312843B (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
BRPI0418907A (pt) 2004-05-20 2007-11-27 Albemarle Corp aglomerados de polìmeros estirênicos aniÈnicos bromatadas inalterados e método de preparação
US9202770B1 (en) 2014-09-01 2015-12-01 Freescale Semiconductor, Inc. Non-homogeneous molding of packaged semiconductor devices
DE102017219020B4 (de) * 2017-10-25 2025-10-23 Volkswagen Aktiengesellschaft Verfahren zur Herstellung eines fertigen Bauteils umfassend ein Elektronikelement
CN115151705B (zh) * 2020-06-05 2024-09-13 伦森股份有限公司 遮篷装置的制造方法
KR102536941B1 (ko) * 2020-09-28 2023-05-26 한국전자통신연구원 반도체 패키지의 제조 방법
US12206056B2 (en) 2020-09-28 2025-01-21 Electronics And Telecommunications Research Institute Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials
CN113644203B (zh) * 2021-08-09 2024-02-27 天津大学 一种基于热塑性弹性体的有机太阳能电池及其制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969461A (en) * 1974-02-28 1976-07-13 Western Electric Company, Inc. Transfer molding thermosetting polymeric material
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
US4359831A (en) * 1980-05-19 1982-11-23 De Lorean Manufacturing Company Reversibly powered rotary snow tiller
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS57158271A (en) * 1981-03-26 1982-09-30 Showa Electric Wire & Cable Co Ltd Film extrusion-coating resin composition
JPS5911360A (ja) * 1982-07-09 1984-01-20 Toray Ind Inc 耐衝撃性熱可塑性樹脂組成物
US4528346A (en) * 1982-09-17 1985-07-09 Dainippun Ink and Chemicals, Inc. Resin composition
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0151553A3 (de) * 1984-02-03 1987-05-27 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
US4853442A (en) * 1987-04-03 1989-08-01 Hercules Incorporated Amine-terminated polysulfone sulfide, useful as epoxy curing agent
JPS63289016A (ja) * 1987-05-22 1988-11-25 Asahi Glass Co Ltd エポキシ樹脂組成物
JP2660012B2 (ja) * 1988-09-13 1997-10-08 株式会社東芝 ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5326516A (en) * 1989-10-03 1994-07-05 Plasticolors, Inc. Method of preparing a cured pigmented thermosetting polymer composition exhibiting improved color values and reduced haze
EP0545973A4 (en) * 1990-08-27 1993-09-15 E.I. Du Pont De Nemours And Company Toughened thermoplastic polyester compositions
DE4140876C2 (de) * 1991-12-11 1994-04-21 Voith Gmbh J M Walzenpresse
US5443775A (en) * 1992-05-08 1995-08-22 Plasticolors, Inc. Process for preparing pigmented thermoplastic polymer compositions and low shrinking thermosetting resin molding composition
EP0583224B1 (en) * 1992-08-11 1999-01-20 Hexcel Corporation Thermosetting resins toughened with sulfone polymers

Also Published As

Publication number Publication date
MY131688A (en) 2007-08-30
JPH08274221A (ja) 1996-10-18
ATE180201T1 (de) 1999-06-15
KR960026681A (ko) 1996-07-22
SG35053A1 (en) 1997-02-01
EP0720901B1 (en) 1999-05-19
NL9402233A (nl) 1996-08-01
MX9600185A (es) 1997-01-31
DE69509739T2 (de) 1999-10-21
JP3126104B2 (ja) 2001-01-22
RU2151447C1 (ru) 2000-06-20
EP0720901A1 (en) 1996-07-10
CA2166043A1 (en) 1996-06-30
US5895620A (en) 1999-04-20
TW312843B (es) 1997-08-11
DE69509739D1 (de) 1999-06-24

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