ES2140690T3 - Hoja metalica de cobre para la fabricacion de circuitos impresos y metodo de produccion de la misma. - Google Patents

Hoja metalica de cobre para la fabricacion de circuitos impresos y metodo de produccion de la misma.

Info

Publication number
ES2140690T3
ES2140690T3 ES95924475T ES95924475T ES2140690T3 ES 2140690 T3 ES2140690 T3 ES 2140690T3 ES 95924475 T ES95924475 T ES 95924475T ES 95924475 T ES95924475 T ES 95924475T ES 2140690 T3 ES2140690 T3 ES 2140690T3
Authority
ES
Spain
Prior art keywords
electro
same
manufacture
production method
metal sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95924475T
Other languages
English (en)
Inventor
Kurt Acx
Paul Dufresne
Michel Mathieu
Michel Streel
Adam M Wolski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil Luxemburg SARL
Original Assignee
Circuit Foil Luxembourg Trading SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading SARL filed Critical Circuit Foil Luxembourg Trading SARL
Application granted granted Critical
Publication of ES2140690T3 publication Critical patent/ES2140690T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

SE PROTEGE LA SUPERFICIE DE UNA LAMINA DE COBRE DE LA OXIDACION Y DECOLORACION ELECTRODEPOSITANDO SOBRE LA SUPERFICIE UNA CAPA PROTECTORA QUE CONTIENE ZINC METALICO Y UNO O MAS COMPUESTOS DE CROMO TRIVALENTE, SIENDO LA CAPA PROTECTORA FACILMENTE ELIMINABLE POR DISOLUCION EN UNA SOLUCION ACUOSA ALCALINA DILUIDA Y POSEYENDO, PREFERIBLEMENTE, UNA RELACION EN PESO DE ZINC A CROMO DE 1:1 O MAYOR. LA LAMINA DE COBRE ELECTRODEPOSITADA ES ESPECIALMENTE ADECUADA PARA PLACAS DE CIRCUITO IMPRESO MULTICAPA Y POSEE LA CAPA DE PROTECCION ELECTRODEPOSITADA CITADA EN EL LADO MATE DE LA MISMA Y UN TRATAMIENTO DE COBRE ELECTRODEPOSITADO PARA CONTINUIDAD ELECTRICA EN SU LADO BRILLANTE.
ES95924475T 1995-07-20 1995-07-20 Hoja metalica de cobre para la fabricacion de circuitos impresos y metodo de produccion de la misma. Expired - Lifetime ES2140690T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN95197959A CN1088323C (zh) 1995-07-20 1995-07-20 用于制造印刷电路板的铜箔表面上形成防护层的方法
CA002227179A CA2227179A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
PCT/IB1995/000571 WO1997004627A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same

Publications (1)

Publication Number Publication Date
ES2140690T3 true ES2140690T3 (es) 2000-03-01

Family

ID=27170600

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95924475T Expired - Lifetime ES2140690T3 (es) 1995-07-20 1995-07-20 Hoja metalica de cobre para la fabricacion de circuitos impresos y metodo de produccion de la misma.

Country Status (14)

Country Link
EP (1) EP0839440B1 (es)
JP (1) JP3363155B2 (es)
CN (1) CN1088323C (es)
AT (1) ATE186443T1 (es)
AU (1) AU2896995A (es)
BR (1) BR9510620A (es)
CA (1) CA2227179A1 (es)
DE (1) DE69513202T2 (es)
DK (1) DK0839440T3 (es)
ES (1) ES2140690T3 (es)
FI (1) FI980099A7 (es)
PL (1) PL177139B1 (es)
RU (1) RU2138932C1 (es)
WO (1) WO1997004627A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4492434B2 (ja) * 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
CN102933746B (zh) * 2010-06-30 2017-10-13 三井金属矿业株式会社 负极集电体用铜箔的制造方法
JP5325175B2 (ja) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 銅箔複合体、及び成形体の製造方法
US10178816B2 (en) 2011-05-13 2019-01-08 Jx Nippon Mining & Metals Corporation Copper foil composite, copper foil used for the same, formed product and method of producing the same
CN104080605B (zh) 2012-01-13 2016-08-24 Jx日矿日石金属株式会社 铜箔复合体、以及成形体及其制造方法
JP5822838B2 (ja) 2012-01-13 2015-11-24 Jx日鉱日石金属株式会社 銅箔複合体、並びに成形体及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5338619A (en) * 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
RU2084087C1 (ru) * 1993-06-15 1997-07-10 Ломовский Олег Иванович Способ электрохимической металлизации отверстий печатных плат

Also Published As

Publication number Publication date
FI980099L (fi) 1998-02-27
DE69513202T2 (de) 2000-05-11
PL177139B1 (pl) 1999-09-30
CN1088323C (zh) 2002-07-24
FI980099A7 (fi) 1998-02-27
HK1016407A1 (en) 1999-10-29
JP3363155B2 (ja) 2003-01-08
RU2138932C1 (ru) 1999-09-27
DK0839440T3 (da) 2000-03-20
PL324464A1 (en) 1998-05-25
AU2896995A (en) 1997-02-18
FI980099A0 (fi) 1998-01-19
CA2227179A1 (en) 1997-02-06
BR9510620A (pt) 1999-01-12
EP0839440B1 (en) 1999-11-03
DE69513202D1 (de) 1999-12-09
CN1198293A (zh) 1998-11-04
ATE186443T1 (de) 1999-11-15
EP0839440A1 (en) 1998-05-06
WO1997004627A1 (en) 1997-02-06

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