ATE186443T1 - Kupferfolie für gedruckte schaltungen und verfahren zu ihrer herstellung - Google Patents

Kupferfolie für gedruckte schaltungen und verfahren zu ihrer herstellung

Info

Publication number
ATE186443T1
ATE186443T1 AT95924475T AT95924475T ATE186443T1 AT E186443 T1 ATE186443 T1 AT E186443T1 AT 95924475 T AT95924475 T AT 95924475T AT 95924475 T AT95924475 T AT 95924475T AT E186443 T1 ATE186443 T1 AT E186443T1
Authority
AT
Austria
Prior art keywords
copper foil
protective layer
production
electrodeposited
printed circuits
Prior art date
Application number
AT95924475T
Other languages
English (en)
Inventor
Kurt Acx
Paul Dufresne
Michel Mathieu
Michel Streel
Adam M Wolski
Original Assignee
Circuit Foil Luxembourg Trading Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading Sarl filed Critical Circuit Foil Luxembourg Trading Sarl
Application granted granted Critical
Publication of ATE186443T1 publication Critical patent/ATE186443T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT95924475T 1995-07-20 1995-07-20 Kupferfolie für gedruckte schaltungen und verfahren zu ihrer herstellung ATE186443T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/IB1995/000571 WO1997004627A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
CA002227179A CA2227179A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
CN95197959A CN1088323C (zh) 1995-07-20 1995-07-20 用于制造印刷电路板的铜箔表面上形成防护层的方法

Publications (1)

Publication Number Publication Date
ATE186443T1 true ATE186443T1 (de) 1999-11-15

Family

ID=27170600

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95924475T ATE186443T1 (de) 1995-07-20 1995-07-20 Kupferfolie für gedruckte schaltungen und verfahren zu ihrer herstellung

Country Status (14)

Country Link
EP (1) EP0839440B1 (de)
JP (1) JP3363155B2 (de)
CN (1) CN1088323C (de)
AT (1) ATE186443T1 (de)
AU (1) AU2896995A (de)
BR (1) BR9510620A (de)
CA (1) CA2227179A1 (de)
DE (1) DE69513202T2 (de)
DK (1) DK0839440T3 (de)
ES (1) ES2140690T3 (de)
FI (1) FI980099A7 (de)
PL (1) PL177139B1 (de)
RU (1) RU2138932C1 (de)
WO (1) WO1997004627A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4492434B2 (ja) * 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
US20130306486A1 (en) * 2010-06-30 2013-11-21 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing copper foil for negative electrode current collector
JP5325175B2 (ja) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 銅箔複合体、及び成形体の製造方法
WO2012157469A1 (ja) 2011-05-13 2012-11-22 Jx日鉱日石金属株式会社 銅箔複合体及びそれに使用される銅箔、並びに成形体及びその製造方法
EP2803481B1 (de) * 2012-01-13 2019-11-20 JX Nippon Mining & Metals Corporation Kupferfolienverbund, formkörper und herstellungsverfahren dafür
HUE030342T2 (en) 2012-01-13 2017-05-29 Jx Nippon Mining & Metals Corp Copper-foil composite, extruded body, and method for producing it

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5338619A (en) * 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
RU2084087C1 (ru) * 1993-06-15 1997-07-10 Ломовский Олег Иванович Способ электрохимической металлизации отверстий печатных плат

Also Published As

Publication number Publication date
DE69513202T2 (de) 2000-05-11
ES2140690T3 (es) 2000-03-01
CN1198293A (zh) 1998-11-04
EP0839440A1 (de) 1998-05-06
FI980099A0 (fi) 1998-01-19
WO1997004627A1 (en) 1997-02-06
AU2896995A (en) 1997-02-18
DE69513202D1 (de) 1999-12-09
CA2227179A1 (en) 1997-02-06
FI980099L (fi) 1998-02-27
EP0839440B1 (de) 1999-11-03
FI980099A7 (fi) 1998-02-27
CN1088323C (zh) 2002-07-24
HK1016407A1 (en) 1999-10-29
PL177139B1 (pl) 1999-09-30
DK0839440T3 (da) 2000-03-20
PL324464A1 (en) 1998-05-25
BR9510620A (pt) 1999-01-12
RU2138932C1 (ru) 1999-09-27
JP3363155B2 (ja) 2003-01-08

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee