ES2146237T3 - Cuerpos microestructurados y procedimiento para su fabricacion. - Google Patents

Cuerpos microestructurados y procedimiento para su fabricacion.

Info

Publication number
ES2146237T3
ES2146237T3 ES94102351T ES94102351T ES2146237T3 ES 2146237 T3 ES2146237 T3 ES 2146237T3 ES 94102351 T ES94102351 T ES 94102351T ES 94102351 T ES94102351 T ES 94102351T ES 2146237 T3 ES2146237 T3 ES 2146237T3
Authority
ES
Spain
Prior art keywords
application
microstructure
mold
procedure
requirements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94102351T
Other languages
English (en)
Inventor
Christoph Dr Lessmollmann
Joachim Dr Eicher
Holger Dr Reinecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boehringer Ingelheim Microparts GmbH
Original Assignee
Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6482617&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2146237(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Microparts Gesellschaft fuer Mikrostrukturtechnik mbH filed Critical Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Application granted granted Critical
Publication of ES2146237T3 publication Critical patent/ES2146237T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/1208—Containers or coating used therefor
    • B22F3/1258—Container manufacturing
    • B22F3/1283—Container formed as an undeformable model eliminated after consolidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Adornments (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)

Abstract

2.1 LOS CUERPOS DE MICROESTRUCTURA SON CONFORMADOS POR MEDIO DE UNA APLICACION DE MOLDE ELABORABLE POR EJEMPLO SEGUN EL PROCEDIMIENTO LIGA. EL PROCEDIMIENTO ES COSTOSO EN MUCHOS CASOS, LOS MOLDES DE ESTRUCTURA QUE SE OBTIENEN SON LIMITADOS. MEDIANTE LA ELECCION DEL MATERIAL ES UN COMPROMISO A TENER EN CUENTA ENTRE LAS EXIGENCIAS EN EL PROCESO DE FABRICACION Y LAS EXIGENCIAS MEDIANTE LA APLICACION DEL CUERPO DE MICROESTRUCTURA. 2.2 LA APLICACION DE MOLDE DE MICROESTRUCTURA SE ELABORA A PARTIR DE UN CUERPO SOLIDO (METAL, CERAMICA, VIDRIO, PIEDRA O MATERIAL MONOCRISTALINO) A TRAVES DE MECANIZACION DE PRECISION DE MAQUINA DE AJUSTE FIJO, EFECTUANDOSE ESTRUCTURACION ADITIVA O SUBTRACTIVA. LA APLICACION DE MOLDE SE RELLENA CON UN MATERIAL CON CAPACIDAD DE FLUIR Y SE RECUBRE EL MATERIAL SOLIDIFICADO PREVIAMENTE QUE ES SEPARADO A PARTIR DE LA APLICACION DE MOLDE, CON LO CUAL SE OBTIENE EL CUERPO DE MICROESTRUCTURA. PARA LA ELABORACION DE LA APLICACION DE MOLDE SE ELIGE UN MATERIAL, QUE EN BASE A SUS PROPIEDADES PARA ESTE PROCEDIMIENTO DE ESTRUCTURACION DEBE SER LO MAS ADECUADO POSIBLE. PARA EL CUERPO DE MICROESTRUCTURA SE ELIGEN MATERIALES QUE CUMPLEN DE FORMA OPTIMA CON ESTAS EXIGENCIAS AJUSTADAS. 2.3 ELABORACION DE CUERPOS DE MICROESTRUCTURA CON PROPIEDADES DE MATERIALES OPTIMAS Y EN UNA MULTIPLICIDAD DE FORMA AMPLIADA.
ES94102351T 1993-03-12 1994-02-17 Cuerpos microestructurados y procedimiento para su fabricacion. Expired - Lifetime ES2146237T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4307869A DE4307869C2 (de) 1993-03-12 1993-03-12 Mikrostrukturkörper und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
ES2146237T3 true ES2146237T3 (es) 2000-08-01

Family

ID=6482617

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94102351T Expired - Lifetime ES2146237T3 (es) 1993-03-12 1994-02-17 Cuerpos microestructurados y procedimiento para su fabricacion.

Country Status (6)

Country Link
US (2) US5501784A (es)
EP (1) EP0620092B1 (es)
JP (1) JPH06320550A (es)
KR (1) KR100313048B1 (es)
DE (2) DE4307869C2 (es)
ES (1) ES2146237T3 (es)

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US7040016B2 (en) * 2003-10-22 2006-05-09 Hewlett-Packard Development Company, L.P. Method of fabricating a mandrel for electroformation of an orifice plate
DE10353060A1 (de) * 2003-11-13 2005-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur freiformenden Herstellung von dreidimensionalen Hohlräumen oder Hinterschneidungen aufweisenden Mikrobauteilen
DE10359102A1 (de) * 2003-12-17 2005-07-21 Carl Zeiss Smt Ag Optische Komponente umfassend ein Material mit einer vorbestimmten Homogenität der thermischen Längsausdehnung
EP3242318A1 (en) 2003-12-19 2017-11-08 The University of North Carolina at Chapel Hill Monodisperse micro-structure or nano-structure product
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
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Also Published As

Publication number Publication date
DE4307869A1 (de) 1994-09-15
JPH06320550A (ja) 1994-11-22
KR100313048B1 (ko) 2002-02-19
EP0620092A1 (de) 1994-10-19
DE59409280D1 (de) 2000-05-18
US6660151B1 (en) 2003-12-09
US5501784A (en) 1996-03-26
DE4307869C2 (de) 1996-04-04
EP0620092B1 (de) 2000-04-12

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